Patents by Inventor Swaminathan Manickam
Swaminathan Manickam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8406487Abstract: This invention provides a method for contactless fingerprint detection and verification comprising illuminating a fingerprint and directing a reflected light through an imaging system using liquid crystal panels and birefringent elements to polarize the light. A plurality of polarized images are captured and used to calculate the depth of structural features on the fingertip. A means to generate a two-dimensional rolled equivalent image of the fingerprint is also provided which may then be used for verification and authentication. The invention also provides an imaging system for carrying out the method.Type: GrantFiled: January 27, 2010Date of Patent: March 26, 2013Assignee: General Electric CompanyInventors: Gil Abramovich, Kevin George Harding, Qingying Hu, Swaminathan Manickam, Meena Ganesh, Christopher Allen Nafis
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Publication number: 20110064282Abstract: This invention provides a method for contactless fingerprint detection and verification comprising illuminating a fingerprint and directing a reflected light through an imaging system using liquid crystal panels and birefringent elements to polarize the light. A plurality of polarized images are captured and used to calculate the depth of structural features on the fingertip. A means to generate a two-dimensional rolled equivalent image of the fingerprint is also provided which may then be used for verification and authentication. The invention also provides an imaging system for carrying out the method.Type: ApplicationFiled: January 27, 2010Publication date: March 17, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Gil Abramovich, Kevin George Harding, Qingying Hu, Swaminathan Manickam, Meena Ganesh, Christopher Allen Nafis
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Patent number: 7813559Abstract: The present invention includes a method of determining a location of a component on a workpiece. A before-placement standard image is acquired of an intended placement location on a standard workpiece. Then, a standard component is placed upon the standard workpiece and the placement is verified. An after-placement standard image is acquired and a standard difference image is created from the before and after standard images. Then, a before-placement test image is acquired of an intended placement location on the workpiece. A component is then placed upon the workpiece, and after-placement test image is acquired. A test difference image is created from the before and after test images. A first offset is calculated between the before standard difference image and the before test image. Then, the test difference is transformed based on the first offset to generate a difference test image (DTR) that is registered to the standard difference image.Type: GrantFiled: May 18, 2005Date of Patent: October 12, 2010Assignee: CyberOptics CorporationInventors: David W. Duquette, Eric P. Rudd, Thomas W. Bushman, Swaminathan Manickam, Timothy A. Skunes, Steven K. Case
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Patent number: 7545514Abstract: A pick and place machine includes a sensor disposed to acquire an image of a nozzle before a pick operation, and one or more images after the pick operation. Image analytics based upon these images reveal important characteristics that can be used to classify the pick operation. In some embodiments, a plurality of after-pick images are acquired at different poses (angular orientations).Type: GrantFiled: September 14, 2006Date of Patent: June 9, 2009Assignee: CyberOptics CorporationInventors: Swaminathan Manickam, John P. Konicek, David W. Duquette, Steven K. Case
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Publication number: 20090135251Abstract: An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.Type: ApplicationFiled: February 2, 2009Publication date: May 28, 2009Applicant: CyberOptics CorporationInventors: Steven K. Case, John P. Konicek, David W. Duquette, Eric P. Rudd, Swaminathan Manickam
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Publication number: 20090133249Abstract: An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.Type: ApplicationFiled: February 2, 2009Publication date: May 28, 2009Applicant: CyberOptics CorporationInventors: Steven K. Case, John P. Konicek, David W. Duquette, Eric P. Rudd, Swaminathan Manickam
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Publication number: 20090046921Abstract: Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include inspecting the pick operation in pick and place machines by collecting images of the pick event inside the machine and identifying errors as they happen. By detecting and displaying this information as it generated on the machine, the operator or machine can take prompt and effective corrective actions.Type: ApplicationFiled: October 29, 2008Publication date: February 19, 2009Applicant: CyberOptics CorporationInventors: Steven K. Case, Paul R. Haugen, David W. Duquette, David D. Madsen, David Fishbaine, Lance K. Fisher, Timothy G. Badar, Swaminathan Manickam
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Publication number: 20070130755Abstract: A pick and place machine includes a placement head configured to releasably grasp a component for placement. A robotic system is coupled to the placement head to generate relative movement between the placement head and a workpiece. An image acquisition system is configured to acquire at least one image of an intended placement location of the component before the component is placed. A controller is operably coupled to the image acquisition system, the controller is configured to process at least one before-placement image to generate a metric relative to solder deposited at the intended placement location.Type: ApplicationFiled: October 31, 2006Publication date: June 14, 2007Inventors: David Duquette, John Konicek, Steven Case, Eric Rudd, Swaminathan Manickam
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Publication number: 20070091323Abstract: A pick and place machine includes a sensor disposed to acquire an image of a nozzle before a pick operation, and one or more images after the pick operation. Image analytics based upon these images reveal important characteristics that can be used to classify the pick operation. In some embodiments, a plurality of after-pick images are acquired at different poses (angular orientations).Type: ApplicationFiled: September 14, 2006Publication date: April 26, 2007Inventors: Swaminathan Manickam, John Konicek, David Duquette, Steven Case
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Publication number: 20070003126Abstract: An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.Type: ApplicationFiled: May 18, 2006Publication date: January 4, 2007Inventors: Steven Case, John Konicek, David Duquette, Eric Rudd, Swaminathan Manickam
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Publication number: 20060075631Abstract: Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include inspecting the pick operation in pick and place machines by collecting images of the pick event inside the machine and identifying errors as they happen. By detecting and displaying this information as it generated on the machine, the operator or machine can take prompt and effective corrective actions.Type: ApplicationFiled: October 4, 2005Publication date: April 13, 2006Inventors: Steven Case, Paul Haugen, David Duquette, David Madsen, David Fishbaine, Lance Fisher, Timothy Badar, Swaminathan Manickam
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Publication number: 20050276464Abstract: The present invention includes a method of determining a location of a component on a workpiece. A before-placement standard image is acquired of an intended placement location on a standard workpiece. Then, a standard component is placed upon the standard workpiece and the placement is verified. An after-placement standard image is acquired and a standard difference image is created from the before and after standard images. Then, a before-placement test image is acquired of an intended placement location on the workpiece. A component is then placed upon the workpiece, and after-placement test image is acquired. A test difference image is created from the before and after test images. A first offset is calculated between the before standard difference image and the before test image. Then, the test difference is transformed based on the first offset to generate a difference test image (DTR) that is registered to the standard difference image.Type: ApplicationFiled: May 18, 2005Publication date: December 15, 2005Inventors: David Duquette, Eric Rudd, Thomas Bushman, Swaminathan Manickam, Timothy Skunes, Steven Case
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Patent number: 6272247Abstract: A system for digital image recognition which combines sparse correlation with image pyramiding to reduce the number of pixels used in correlation provides effective recognition of a reference image template without exhaustive correlation of all pixels in the reference image template. An optimal sparse pixel set is selected from the pixels of the reference image template by correlating the reference image template against a search image scene which is to be searched. Such a sparse pixel set includes those pixels which are optimal in defining the correlation sensitive features of the reference image template. By terminating the accumulation of sparse pixels at an optimal point, performance is maximized without compromising accuracy of recognition. The resultant optimal sparse pixel set is then correlated against the pixels in the search image scene through a series of transformations to find a match of the reference image template within the search image scene.Type: GrantFiled: May 18, 1999Date of Patent: August 7, 2001Assignee: Datacube, Inc.Inventors: Swaminathan Manickam, Scott D. Roth, Thomas W. Bushman