Patents by Inventor Swee Kah Lee

Swee Kah Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8945990
    Abstract: Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: February 3, 2015
    Assignee: Infineon Technologies AG
    Inventors: Holger Torwesten, Manfred Mengel, Stefan Schmid, Soon Lock Goh, Swee Kah Lee
  • Publication number: 20130277813
    Abstract: Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip.
    Type: Application
    Filed: April 24, 2012
    Publication date: October 24, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Holger Torwesten, Manfred Mengel, Stefan Schmid, Soon Lock Goh, Swee Kah Lee
  • Patent number: 8304295
    Abstract: Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: November 6, 2012
    Assignee: Infineon Technologies AG
    Inventors: Soon Lock Goh, Swee Kah Lee, Chin Wei Ronnie Tan
  • Publication number: 20110309493
    Abstract: Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad.
    Type: Application
    Filed: June 22, 2010
    Publication date: December 22, 2011
    Inventors: Soon Lock Goh, Swee Kah Lee, Chin Wei Ronnie Tan