Abstract: A liquid cooled coldplate has a tub with an inlet port and an outlet port and a plurality of pockets recessed within a top surface of the tub. Each pocket has a peripheral opening and a ledge, the ledge disposed inwardly and downwardly from the peripheral opening. The inlet port and outlet port are in fluid communication with the pocket via an inlet slot and an outlet slot. A plurality of cooling plates are each received by a pocket and recessed within the pocket. Each cooling plate comprises an electronics side for receiving electronics and enhanced side for cooling the cooling plate. The enhanced side of the cooling plate comprises a plurality of pins formed by micro deformation technology. The tub may be formed by extrusion.

Abstract: A liquid cooled coldplate has a tub with an inlet port and an outlet port and a plurality of pockets recessed within a top surface of the tub. Each pocket has a peripheral opening and a ledge, the ledge disposed inwardly and downwardly from the peripheral opening. The inlet port and outlet port are in fluid communication with the pocket via an inlet slot and an outlet slot. A plurality of cooling plates are each received by a pocket and recessed within the pocket. Each cooling plate comprises an electronics side for receiving electronics and enhanced side for cooling the cooling plate. The enhanced side of the cooling plate comprises a plurality of pins formed by micro deformation technology. The tub may be formed by extrusion.

Abstract: A liquid cooled coldplate has a tub with an inlet port and an outlet port and a plurality of pockets recessed within a top surface of the tub. Each pocket has a peripheral opening and a ledge, the ledge disposed inwardly and downwardly from the peripheral opening. The inlet port and outlet port are in fluid communication with the pocket via an inlet slot and an outlet slot. A plurality of cooling plates are each received by a pocket and recessed within the pocket. Each cooling plate comprises an electronics side for receiving electronics and enhanced side for cooling the cooling plate. The enhanced side of the cooling plate comprises a plurality of pins formed by micro deformation technology. The tub may be formed by extrusion.

Abstract: The current invention comprises a base plate made of at least a first metal and a second metal clad together with a metallurgical bond, where the first and second metals are different metals. The base plate includes an enhanced surface that is entirely contained within the second metal, where the enhanced surface comprises fins, pins, or other structures. The tip of the enhanced surface extends above the outer surface of the second metal, and the enhancements are monolithic with the second metal. The base plate can form one component of a cold plate for cooling electronics.

Abstract: A substrate for electronic components is formed by bonding a cooling metal layer to one side of a ceramic tile and bonding an electronic metal layer to the other side of the electronic tile. The substrate is secured to a machining base and the cooling metal layer surface is enhanced through an MDT process. In the process, fins are sliced into the cooling metal layer with a tool to a depth of less than the cooling metal layer thickness. The slicing forces material upward without removing material from the cooling metal layer, forming fins that extend beyond the original thickness of the cooling metal layer. The fins can be cross-sliced at an angle to form pins.

Abstract: A liquid cooled coldplate has a tub with an inlet port and an outlet port and a plurality of pockets recessed within a top surface of the tub. Each pocket has a peripheral opening and a ledge, the ledge disposed inwardly and downwardly from the peripheral opening. The inlet port and outlet port are in fluid communication with the pocket via an inlet slot and an outlet slot. A plurality of cooling plates are each received by a pocket and recessed within the pocket. Each cooling plate comprises an electronics side for receiving electronics and enhanced side for cooling the cooling plate. The enhanced side of the cooling plate comprises a plurality of pins formed by micro deformation technology. The tub may be formed by extrusion.

Abstract: A method for producing a plate heat exchanger uses micro deformation technology to form fins on both sides of a sheet of metal. In the method, a substantially flat, substantially thin sheet of metal is restrained in a tooling fixture. The sheet has a first flat side and a second flat side. Fins are formed in the first and second flat sides of the sheet by slicing the sheet with a tool to create monolithic fins extending from the sheet. A base plate is formed by cutting the finned portions from the sheet. The base plate is used to form a plate heat exchanger.

Abstract: A cold plate includes an enclosure with an inlet, an outlet, a base and a lid. The inlet and outlet are in fluid communication, so fluid can flow from the inlet though the enclosure to the outlet. The base is formed from a base plate, and the base plate includes an island facing into the enclosure. A plurality of pins extends from the island toward the lid. The pins can have a spiral shape, where the cross sectional profile of the pins change along the length of the pin.

Abstract: A cold plate is manufactured by obtaining a base plate with a top surface, a bottom surface, and an edge. An inlet trough and an outlet trough are machined in the top surface. Fins are cut into the base plate with a tool that contacts the base plate in either the inlet trough and the outlet trough and then exits the base plate in the other of the inlet trough and the outlet trough. An inlet nozzle indent is machined from the inlet trough to the edge of the base plate, and an outlet nozzle indent is machined from the outlet trough to the edge of the base plate. A cover covers the inlet and outlet nozzle indents, and an inlet nozzle and outlet nozzle are secured to the inlet and outlet nozzle indents.

Abstract: A substrate for electronic components is formed by bonding a cooling metal layer to one side of a ceramic tile and bonding an electronic metal layer to the other side of the electronic tile. The substrate is secured to a machining base and the cooling metal layer surface is enhanced through an MDT process. In the process, fins are sliced into the cooling metal layer with a tool to a depth of less than the cooling metal layer thickness. The slicing forces material upward without removing material from the cooling metal layer, forming fins that extend beyond the original thickness of the cooling metal layer. The fins can be cross-sliced at an angle to form pins.

Abstract: A cold plate has a base plate connected to a cover to form an enclosure, with an inlet and outlet nozzle penetrating the enclosure for coolant flow. The base plate includes a top surface opposite a bottom surface, Where the top surface includes enhancements positioned within the enclosure under the cover. The base plate has an inlet trough and an outlet trough that serve as headers, so the inlet nozzle connects to the inlet trough, and coolant from the inlet trough can flow through the enhanced surface, collect in the outlet trough, and then exit the cold plate through the outlet nozzle. The enhanced surface includes enhancements that begin at a point in between the bottom surface and the top surface, and the enhancements extend to a point above the top surface. In another embodiment, electronic components can be soldered on a cold plate. The electronic component can be positioned in contact with the cold plate, and solid solder can be positioned at a contact point on the electronic component.

Abstract: The current invention comprises a base plate made of at least a first metal and a second metal clad together with a metallurgical bond, where the first and second metals are different metals. The base plate includes an enhanced surface that is entirely contained within the second meta where the enhanced surface comprises fins, pins, or other structures. The tip of the enhanced surface extends above the outer surface of the second metal, and the enhancements are monolithic with the second metal. The base plate can form one component of a cold plate for cooling electronics.

Abstract: A substrate for electronic components includes a ceramic tile and a cooling metal layer. The cooling metal layer can include copper, aluminum, nickel, gold, or other metals. The cooling metal layer has an enhanced surface facing away from the ceramic tile, where the enhanced surface includes either fins or pins. Electronic components can be connected to the substrate on a surface opposite the cooling metal layer.

Abstract: A cold plate includes an enclosure with an inlet, an outlet, a base and a lid. The inlet and outlet are in fluid communication, so fluid can flow from the inlet though the enclosure to the outlet. The base is formed from a base plate, and the base plate includes an island facing into the enclosure. A plurality of pins extends from the island toward the lid. The pins can have a spiral shape, where the cross sectional profile of the pins change along the length of the pin.

Abstract: Methods of treating superconducting composites to enhance their wettability in solder, and composites having enhanced wettability. It has been found that wettability can be substantially enhanced by stripping a thin layer off the surface of the composite before incorporating it into a laminated component. This layer can be stripped, for example, by chemically etching the composite, for example in a solution of nitric acid and ammonium bifluoride.