Patents by Inventor Syota Sawamura

Syota Sawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210261834
    Abstract: An object of the present invention is to provide an emulsion-based adhesive having excellent adhesive force, excellent heat resistance of adhesive force, excellent holding power, less adhesive residue and good “tack”. According to the present invention, an emulsion-based adhesive comprising: a styrene-butadiene rubber; a natural rubber; and a tackifier, wherein a gel fraction of the styrene-butadiene rubber is 20 to 60% by mass, a content of the natural rubber with respect to 100 parts by mass of the styrene-butadiene rubber is 10 to 35 parts by mass, a content of the tackifier with respect to 100 parts by mass of the styrene-butadiene rubber is 100 to 150 parts by mass, and a ratio of a styrene monomer unit in a total amount of the styrene-butadiene rubber and the natural rubber contained in the adhesive is 5 to 15% by mass, is provided.
    Type: Application
    Filed: July 4, 2019
    Publication date: August 26, 2021
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yuto Honda, Fumio Ogata, Daisuke Yoshimura, Syota Sawamura
  • Publication number: 20210139743
    Abstract: An adhesive tape has superior mechanical properties, and can suppress occurrence of cracks after being exposed to high temperature conditions for a long period of time. The adhesive tape includes a substrate and an adhesive layer formed on one side of the substrate; wherein the substrate is made of a resin composition including 40 to 65 parts by mass of high boiling point plasticizer and 5 to 15 parts by mass of antimony trioxide with respect to 100 parts by mass of polyvinyl chloride resin.
    Type: Application
    Filed: May 25, 2018
    Publication date: May 13, 2021
    Applicant: Denka Company Limited
    Inventors: Syota Sawamura, Mizuki Hasumi
  • Publication number: 20200157383
    Abstract: The substrate for adhesive tape is thin in thickness and can also suppress repelling of a water-borne primer when the primer is being coated. The substrate for adhesive tape includes 25 to 75 parts by mass of a plasticizer and 5 to 40 parts by mass of an inorganic filler with respect to 100 parts by mass of polyvinyl chloride resin having a mean degree of polymerization of 1200 to 1800; wherein the inorganic filler has a mean particle size of 0.05 to 0.8 ?m; and the substrate has a thickness of 40 to 80 ?m.
    Type: Application
    Filed: August 1, 2018
    Publication date: May 21, 2020
    Applicant: Denka Company Limited
    Inventors: Akiyoshi Kimura, Mizuki Hasumi, Syota Sawamura