Patents by Inventor Syuhei TOYOSHIMA

Syuhei TOYOSHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200388740
    Abstract: A thermoelectric conversion device includes: a thermoelectric module layer, in which a thermoelectric conversion chip is surrounded by a thermal insulation rubber containing a rubber component and a hollow filler forming a plurality of air gaps that are independent from one another; an insulation base layer and an insulation intermediate layer, which are thermal-conductive insulation sheets and sandwiches the thermoelectric module layer; a heat diffusion layer, which has a higher thermal conductance than those of the insulation base layer and the insulation intermediate layer and is stacked on the insulation intermediate layer; and a thermal radiation layer, which has thermal conductivity and is stacked on the heat diffusion layer. And at least one pair among the adjacent layers is bonded through chemical bonds.
    Type: Application
    Filed: November 13, 2017
    Publication date: December 10, 2020
    Applicant: ASAHI FR R&D CO., LTD.
    Inventors: Syuhei TOYOSHIMA, Syo MIHARA, Koichi ABE
  • Patent number: 10636952
    Abstract: A flexible Peltier device in which emitting heat conversion properties between Peltier elements and an object transferring heat may be improved and a flexible heat-emitting sheet having the Peltier elements bonded thereto may be bent without worrying the separation there between. A flexible Peltier device includes a single or plural Peltier element which is disposed on one surface side of a heat-emitting sheet having flexibility made from heat-conductive rubber containing a heat conductive filler and each semiconductor element which has a heating side and a cooling side and composes the Peltier element at least one of the heating side and the cooling side is bonded integrally to the heat-emitting sheet by a direct covalent bond and/or by an indirect covalent bond through a molecular adhesive at active groups existing on each other surfaces.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: April 28, 2020
    Assignee: ASAHI FR R&D CO., LTD.
    Inventors: Kazuhisa Takagi, Koichi Abe, Nobuyoshi Watanabe, Syuhei Toyoshima
  • Publication number: 20170352794
    Abstract: A flexible Peltier device in which emitting heat conversion properties between Peltier elements and an object transferring heat may be improved and a flexible heat-emitting sheet having the Peltier elements bonded thereto may be bent without worrying the separation there between. A flexible Peltier device includes a single or plural Peltier element which is disposed on one surface side of a heat-emitting sheet having flexibility made from heat-conductive rubber containing a heat conductive filler and each semiconductor element which has a heating side and a cooling side and composes the Peltier element at least one of the heating side and the cooling side is bonded integrally to the heat-emitting sheet by a direct covalent bond and/or by an indirect covalent bond through a molecular adhesive at active groups existing on each other surfaces.
    Type: Application
    Filed: January 8, 2016
    Publication date: December 7, 2017
    Applicant: ASAHI FR R&D CO., LTD.
    Inventors: Kazuhisa TAKAGI, Koichi ABE, Nobuyoshi WATANABE, Syuhei TOYOSHIMA