Patents by Inventor Syuji Moriya

Syuji Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140110937
    Abstract: A pipe joint which does not generate fine particles even though being repeatedly mounted and demounted is provided. A pipe joint includes first and second joint members having fluid channels communicating with each other, an annular gasket to be interposed between abutting end surfaces of the both joint members, and a nut configured to couple the joint members. The nut is provided with an inner surface treated layer. The inner surface treated layer includes a Co (cobalt)-P (phosphorous) alloy metal coating provided on an inner surface of the nut and a fluorine coating provided on the surface of the alloy metal coating.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 24, 2014
    Inventors: Tsuneyuki OKABE, Syuji MORIYA, Kenichi SATO, Tomohiro NAKATA, Tsutomu SHINOHARA, Michio YAMAJI
  • Patent number: 5514196
    Abstract: An air cleaning apparatus includes an air passage chamber having a suction port, from which air is sucked, and a discharge port from which the air sucked from the suction port is discharged, an air blower, provided in the air passage chamber, for sucking the air from the suction port into the air passage chamber and discharging the sucked air from the discharge port, and a particle removing mechanism for removing particles contained in the air sucked from the suction port, the entire body of the particle removing mechanism being formed of a material which generates little impurity gas detrimental to processing in a processing space.
    Type: Grant
    Filed: April 13, 1994
    Date of Patent: May 7, 1996
    Assignees: Tokyo Electron Limited, Tokyo Electron Tohoku Limited
    Inventors: Takashi Tanahashi, Syuji Moriya, Tsuyoshi Wakabayashi, Takenobu Matsuo
  • Patent number: 5261935
    Abstract: A clean air apparatus includes a housing having an opening through which a carrier housing semiconductor wafers is supplied into the housing and an I/O port for supporting the carrier and a furnace for treating the wafer, provided in the upper portion of the housing. The carriers are at the same time supported by a first carrier stage provided in the upper portion of the housing and supported by a second carrier stage provided in the lower portion of the housing. The carrier or carriers are selectively moved between the I/O port and the first stage, between the I/O port and the second stage, and between the first stage and the second stage. A clean air is applied to the wafers in the carriers supported by the I/O port, the first stage and the second stage.
    Type: Grant
    Filed: February 26, 1993
    Date of Patent: November 16, 1993
    Assignee: Tokyo Electron Sagami Limited
    Inventors: Katsumi Ishii, Takanobu Asano, Masaharu Abe, Kenichi Yamaga, Kazunari Sakata, Takashi Tanahashi, Syuji Moriya
  • Patent number: 5219464
    Abstract: A clean air apparatus comprises a body in which clean air is supplied, an I/O port having an opening for carrying a carrier housing objects to be treated in/out of the body, a door which opens/closes the opening, and dust preventing device for preventing dusts from entering the body from the outside through the opening, when the door is opened.
    Type: Grant
    Filed: July 10, 1992
    Date of Patent: June 15, 1993
    Assignees: Tokyo Electron Limited, Tokyo Electron Sagami Limited
    Inventors: Kenichi Yamaga, Kazunari Sakata, Katsumi Ishii, Takashi Tanahashi, Syuji Moriya
  • Patent number: 4172869
    Abstract: The manufacture is carried out by impregnating bundles of filaments of fibrous-reinforcing material in a bath made up of an emulsion of a thermoplastic resin and a blowing agent. The emulsion-impregnated reinforcing filament bundles are then squeezed and dried to form resin coatings, and then collected to provide a single bunch of the fiber-reinforced thermoplastic resin material. This bunch is subsequently heated and allowed to expand in a tunnel and also cooled in a tunnel to produce a fiber-reinforced thermoplastic resin of a cellular structure. During the impregnation with the emulsion in a bath, the bundles are slackened and repeatedly beaten in the condition of free tension to cause the filament bundles to be substantially frayed to facilitate the impregnation. An apparatus utilizable in the practice of the above method is also disclosed.
    Type: Grant
    Filed: March 23, 1978
    Date of Patent: October 30, 1979
    Assignee: Kurashiki Boseki Kabushiki Kaisha
    Inventors: Yoshisue Oishi, Akihisa Inoue, Syuji Moriya, Hironori Nakabayashi, Yasuaki Kobayashi, Hiroyuki Nagata