Patents by Inventor Szu-Yu Yeh

Szu-Yu Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
    Patent number: 10790252
    Abstract: Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes forming a plurality of contact pads over a substrate, and forming an insulating material over the plurality of contact pads and the substrate. The insulating material is patterned to form an opening over each of the plurality of contact pads, and the plurality of contact pads is cleaned. The method includes forming an under-ball metallization (UBM) structure over the plurality of contact pads and portions of the insulating material. Cleaning the plurality of contact pads recesses a top surface of each of the plurality of contact pads.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: September 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Yi-Yang Lei, Szu-Yu Yeh, Yu-Ren Chen, Hung-Jui Kuo, Chung-Shi Liu
  • Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
    Patent number: 10269747
    Abstract: Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes forming a plurality of contact pads over a substrate, and forming an insulating material over the plurality of contact pads and the substrate. The insulating material is patterned to form an opening over each of the plurality of contact pads, and the plurality of contact pads is cleaned. The method includes forming an under-ball metallization (UBM) structure over the plurality of contact pads and portions of the insulating material. Cleaning the plurality of contact pads recesses a top surface of each of the plurality of contact pads.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: April 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Yi-Yang Lei, Szu-Yu Yeh, Yu-Ren Chen, Hung-Jui Kuo, Chung-Shi Liu
  • Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
    Publication number: 20180337155
    Abstract: Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes forming a plurality of contact pads over a substrate, and forming an insulating material over the plurality of contact pads and the substrate. The insulating material is patterned to form an opening over each of the plurality of contact pads, and the plurality of contact pads is cleaned. The method includes forming an under-ball metallization (UBM) structure over the plurality of contact pads and portions of the insulating material. Cleaning the plurality of contact pads recesses a top surface of each of the plurality of contact pads.
    Type: Application
    Filed: July 31, 2018
    Publication date: November 22, 2018
    Inventors: Yi-Yang Lei, Szu-Yu Yeh, Yu-Ren Chen, Hung-Jui Kuo, Chung-Shi Liu