Abstract: A light source device includes: a base member; a semiconductor laser mounted on an upper surface of the base member; a lateral wall portion having: a lower surface facing the upper surface of the base member and being a non-reflecting surface, and a reflecting surface that reflects light emitted from the semiconductor laser, is connected to the lower surface of the lateral wall portion at a lower end portion of the reflecting surface, and is inclined with respect to the upper surface of the base member; a first bonding film that is a metal film disposed in a region on the upper surface of the base member facing the lower surface of the lateral wall portion; a second bonding film that is a metal film disposed on the lower surface of the lateral wall portion; and a metal bonding member fuse-bonded to the first bonding film and the second bonding film to each other.

Abstract: There is provided an optical module comprising a semiconductor laser element; and a planar lightwave circuit (PLC) in which a waveguide is formed on a substrate. A position of a light-emitting point of the semiconductor laser element is approximately aligned with a position of a core of the waveguide. In a plan view, a first line segment representing an emission surface of the semiconductor laser element and a second line segment corresponding to the first line segment and representing an incident surface of the waveguide are arranged oblique to each other, and the light-emitting point of the semiconductor laser element is disposed closer to an intersection point of an extension line of the first line segment and the second line segment or an extension line of the second line segment than a center of the first line segment.

Abstract: There is provided a light source device comprising a substrate; a semiconductor laser placed on the substrate; a side wall portion formed so as to surround the semiconductor laser; and a cover being translucent, configured to cover a space surrounded by the substrate and the side wall portion, wherein the side wall portion includes a lower surface connected to an upper surface of the substrate over a whole periphery, an upper surface connected to a lower surface of the cover over a whole periphery, and inner side surfaces inclined so that the space expands from a lower surface side to an upper surface side of the side wall portion, at least a part of the inner side surfaces serving as a reflection surface for reflecting a beam emitted from the semiconductor laser toward the cover, and a connecting portion where an upper surface of the substrate and a lower surface of the side wall portion are in contact with each other via a connecting layer is provided in a region corresponding to an upper surface of the sid

Abstract: There is provided an apparatus comprising: a unit that receives, from a sender, a registration request of an execution condition of a lifecycle of a virtual function under a virtual environment and registers the execution condition of the lifecycle in a storage unit; a unit that secures in advance one or more resources necessary for execution of the lifecycle in the virtual function; a unit that determines whether or not the execution condition of the lifecycle registered in the storage unit is satisfied; a unit that instructs the execution of the lifecycle when the execution condition of the lifecycle is satisfied; and a unit that notifies the lifecycle execution result to the sender of the registration request of the execution condition of the lifecycle.

Abstract: A light source device includes: a base member; a semiconductor laser mounted on an upper surface of the base member; a lateral wall portion having: a lower surface facing the upper surface of the base member and being a non-reflecting surface, and a reflecting surface that reflects light emitted from the semiconductor laser, is connected to the lower surface of the lateral wall portion at a lower end portion of the reflecting surface, and is inclined with respect to the upper surface of the base member; a first bonding film that is a metal film disposed in a region on the upper surface of the base member facing the lower surface of the lateral wall portion; a second bonding film that is a metal film disposed on the lower surface of the lateral wall portion; and a metal bonding member fuse-bonded to the first bonding film and the second bonding film to each other.

Abstract: Provided is a light source device, including: a base member; a semiconductor laser disposed on the base member; a lateral wall portion formed so as to surround the semiconductor laser; a light-transmissive lid covering a gap surrounded by the base member and the lateral wall portion; and a connection member that airtightly connects an upper surface of the lateral wall portion and a lower surface of the lid over an entire perimeter of the lateral wall portion. The lateral wall portion has a reflecting surface which is an inside surface connected to an upper surface, the reflecting surface being inclined so that light emitted from the semiconductor laser is reflected toward the lid. A dielectric film is continuously formed on the reflecting surface and the upper surface. A height of the connection member is greater than a height of the dielectric film formed on the upper surface.

Abstract: A light source device includes a substrate having a principal surface, a light-transmitting member arranged over the principal surface of the substrate, and a laser light source arranged on the principal surface of the substrate at a portion in the bottom recess. The light-transmitting member has a lower surface that faces the principal surface of the substrate, an upper surface opposite to the lower surface, and a bottom recess opening downward. The laser light source is arranged on the principal surface of the substrate so that an optical axis of a laser beam emitted from the laser light source is substantially parallel to the principal surface of the substrate. At least a portion of the upper surface of the light-transmitting member is covered with an upper light reflection coat. At least a portion of the lower surface of the light-transmitting member is covered with a lower light reflection coat.

Abstract: A method of manufacturing a light-emitting device includes steps of: preparing at least one substrate having a plurality of through holes; providing an electric wire on a rear surface side of the substrate so that a plurality of portions of the electric wire communicates with a front surface side of the substrate at the plurality of through holes of the substrate; and respectively mounting a plurality of light-emitting diodes to the respective portions of the electric wire that communicate with the front surface side of the substrate.

Abstract: A wavelength converting member includes a sealed housing which is at least partially light transmissive, a coolant enclosed in the sealed housing, a cooling part provided on a part of an external surface of the sealed housing, and a channel having a plurality of micro-passages allowing a liquid coolant flowing therein. At least a portion of the micro-passages are formed by gaps between particles, and phosphor particles are contained in the particles.

Abstract: Disclosed is a light emitting device including: a light emitting element including an LED chip and a phosphor layer provided at the light emitting side of the LED chip; and a substrate on which the light emitting element is bonded by an adhesive material. The adhesive material is an anisotropic conductive material.

Abstract: A light source device includes light sources having semiconductor lasers, a condensing lens, an optical component between the light sources and the condensing lens, and a phosphor wheel. The optical component has an inclined optical surface, and the inclined optical surface has different inclination angles for each of the light sources. Some of the semiconductor lasers are first semiconductor lasers having a short axis of the shape of its condensing spot aligned in a first direction and some of them are second semiconductor lasers having a short axis in a second direction that is different from the first direction. A light diffusing layer is disposed in the optical path of the emitting light of either the first semiconductor laser or the second semiconductor laser. A light scattering layer is disposed in the optical path of the emitting light of either the first semiconductor laser or the second semiconductor laser.

Abstract: A system includes an active system that executes processing, a standby system that is able to perform at least one of scale-up and scale-down, and a control apparatus that controls system switching to set the standby system undergoing the scaled up or scaled down as a new active system.

Abstract: A light source device includes a substrate having a principal surface, a light-transmitting member arranged over the principal surface of the substrate, and a laser light source arranged on the principal surface of the substrate at a portion in the bottom recess. The light-transmitting member has a lower surface that faces the principal surface of the substrate, an upper surface opposite to the lower surface, and a bottom recess opening downward. The laser light source is arranged on the principal surface of the substrate so that an optical axis of a laser beam emitted from the laser light source is substantially parallel to the principal surface of the substrate. At least a portion of the upper surface of the light-transmitting member is covered with an upper light reflection coat. At least a portion of the lower surface of the light-transmitting member is covered with a lower light reflection coat.

Abstract: A light-emitting device includes a support including a substrate, a pair of electrodes and an insulating reflective member, the pair of electrodes being disposed on an upper surface of the substrate, and the reflective member being disposed on the substrate, a light-emitting element flip-chip mounted on the pair of electrodes, and a resin member disposed at least between the light-emitting element and the reflective member, the resin member including a conductive substance which electrically connects the light-emitting element to the pair of electrodes, the reflective member being disposed at least over an entirety of a surface that is located immediately below the resin member.

Abstract: A light source apparatus comprising light sources including laser diodes and collimating lenses, a condenser lens, and a transmissive phosphor wheel. The collimating lens and laser diode are placed with a first shift such that an optical axis of the collimating lens is shifted from that of light from said laser diode in the direction perpendicular thereto. The laser diodes include a first laser or second diode where a direction of a short axis of a condensed shape is placed in a first or second direction, and a second laser diode where a direction of a short axis of a condensed shape is placed in a second direction. The collimating lenses corresponding to said first laser diode and the second laser diode are placed with a second shift in a direction of the optical axis of said collimating lens.

Abstract: A light emitting device includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion. The groove portion is formed between the plurality of wiring portions spaced apart from each other, and includes a first groove portion, a second groove portion, and a third groove portion extending in a direction intersecting the first and second groove portions. The first and third groove portions are connected to each other with a curve. The second and third groove portions are connected to each other with a curve. The sealing resin member seals the light emitting element and the substrate. The sealing resin member is arranged on the third groove portion and spaced apart from the first groove portion and the second groove portion.

Abstract: A method of manufacturing a light-emitting device includes steps of: preparing at least one substrate having a plurality of through holes; providing an electric wire on a rear surface side of the substrate so that a plurality of portions of the electric wire communicates with a front surface side of the substrate at the plurality of through holes of the substrate; and respectively mounting a plurality of light-emitting diodes to the respective portions of the electric wire that communicate with the front surface side of the substrate.

Abstract: A light source device includes a package, one or more semiconductor lasers each having an emission surface, a light-transmissive cover, and an optical member. The package includes an inner bottom surface and inner lateral surfaces, and a recess defined by the inner bottom surface and the inner lateral surfaces and having an open end. The one or more semiconductor lasers are arranged on the inner bottom surface. The light-transmissive cover covers the open end of the recess. The optical member is arranged on an upper surface of the cover and is configured to mix light. The one or more semiconductor lasers are arranged so that their emission surfaces are respectively oblique to their adjacent inner lateral surface when viewed from above, and the inner lateral surface has a reflecting region arranged inclined with respect to the bottom surface.

Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

Abstract: A light emitting device includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion. The groove portion is formed between the plurality of wiring portions spaced apart from each other, and includes a first groove portion, a second groove portion, and a third groove portion extending in a direction intersecting the first and second groove portions. The first and third groove portions are connected to each other with a curve. The second and third groove portions are connected to each other with a curve. The sealing resin member seals the light emitting element and the substrate. The sealing resin member is arranged on the third groove portion and spaced apart from the first groove portion and the second groove portion.