Abstract: A light emitting device includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion. The groove portion is formed between the plurality of wiring portions spaced apart from each other, and includes a first groove portion, a second groove portion, and a third groove portion extending in a direction intersecting the first and second groove portions. The first and third groove portions are connected to each other with a curve. The second and third groove portions are connected to each other with a curve. The sealing resin member seals the light emitting element and the substrate. The sealing resin member is arranged on the third groove portion and spaced apart from the first groove portion and the second groove portion.

Abstract: A light emitting device includes a substrate, a light emitting device and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions, a groove portion and a pair of terminal portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the flexible base. The groove portion is formed between the plurality of wiring portions spaced apart from each other. The pair of terminal portions is arranged along the first direction at the both sides of the plurality of wiring portions. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The light emitting element is mounted on the substrate in a flip-chip manner.

Abstract: A wavelength converting member includes a sealed housing which is at least partially light transmissive, a coolant enclosed in the sealed housing, a cooling part provided on a part of an external surface of the sealed housing, and a channel having a plurality of micro-passages allowing a liquid coolant flowing therein. At least a portion of the micro-passages are formed by gaps between particles, and phosphor particles are contained in the particles.

Abstract: The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace that remains alter removal of the defective element is sealed by a same sealing member by which the new light-emitting element is sealed.

Abstract: A light source apparatus and a Projector including the light source apparatus are provided. The light source apparatus comprises: a plurality of light sources each including a laser diode and a collimating lens, said collimating lens making a light emitted from said laser diode into an approximately collimated beam, a plurality of housings in which said plurality of light sources are placed so that a light is emitted from each of said light source advances approximately in parallel in the same direction, a condenser lens which condenses lights which is emitted from said plurality of housings to a phosphor, a phosphor wheel having said phosphor, said phosphor wheel transmitting the lights which is emitted from said condenser lens, wherein incident angles of the lights emitted from said housings to an optical axis of said condenser lens are made different by varying mount angles of said housings to a supporting member.

Abstract: A light source device includes light sources having semiconductor lasers, a condensing lens, an optical component between the light sources and the condensing lens, and a phosphor wheel. The optical component has an inclined optical surface, and the inclined optical surface has different inclination angles for each of the light sources. Some of the semiconductor lasers are first semiconductor lasers having a short axis of the shape of its condensing spot aligned in a first direction and some of them are second semiconductor lasers having a short axis in a second direction that is different from the first direction. A light diffusing layer is disposed in the optical path of the emitting light of either the first semiconductor laser or the second semiconductor laser. A light scattering layer is disposed in the optical path of the emitting light of either the first semiconductor laser or the second semiconductor laser.

Abstract: A light source apparatus comprising light sources including laser diodes and collimating lenses, a condenser lens, and a transmissive phosphor wheel. The collimating lens and laser diode are placed with a first shift such that an optical axis of the collimating lens is shifted from that of light from said laser diode in the direction perpendicular thereto. The laser diodes include a first laser or second diode where a direction of a short axis of a condensed shape is placed in a first or second direction, and a second laser diode where a direction of a short axis of a condensed shape is placed in a second direction. The collimating lenses corresponding to said first laser diode and the second laser diode are placed with a second shift in a direction of the optical axis of said collimating lens.

Abstract: A wiring board includes an insulated substrate, a wiring pattern and a folded part. The insulated substrate has an elongated shape with shorter sides extending along a width direction. The wiring pattern is provided on the substrate. The wiring pattern extends between both ends in the width direction of the substrate, and has an exposed part exposed at at least one of the ends of the substrate. In the folded part, the exposed part of the wiring pattern and the substrate are integrally folded up inwardly toward an upper face side of the substrate at each of the ends of the substrate.

Abstract: In a light emitting device, one of at least one reinforcing portion is disposed on a site for joining regions of two wiring portions. The site for joining regions is provided for at least a first joining region where the first groove portion and the third groove portion join, and a second joining region where the second groove portion and the third groove portion join. A light emitting element is disposed over the third groove portion. In a plan view of the substrate member, the reinforcing portion surrounds the light emitting element. The upper surface of the reinforcing portion is lower than the upper surface of the light emitting element.

Abstract: A light emitting device includes a substrate, a light emitting device and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions, a groove portion and a pair of terminal portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the flexible base. The groove portion is formed between the plurality of wiring portions spaced apart from each other. The pair of terminal portions is arranged along the first direction at the both sides of the plurality of wiring portions. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The light emitting element is mounted on the substrate in a flip-chip manner.

Abstract: A light source apparatus and a Projector including the light source apparatus are provided. The light source apparatus comprises: a plurality of light sources each including a laser diode and a collimating lens, said collimating lens making a light emitted from said laser diode into an approximately collimated beam, a plurality of housings in which said plurality of light sources are placed so that a light is emitted from each of said light source advances approximately in parallel in the same direction, a condenser lens which condenses lights which is emitted from said plurality of housings to a phosphor, a phosphor wheel having said phosphor, said phosphor wheel transmitting the lights which is emitted from said condenser lens, wherein incident angles of the lights emitted from said housings to an optical axis of said condenser lens are made different by varying mount angles of said housings to a supporting member.

Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

Abstract: A light emitting device includes a light emitting element and a substrate including a flexible base, a plurality of wiring portions, a groove portion, and a reflective layer. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate. The wiring portions are arranged on the flexible base. The groove portion is formed between the wiring portions spaced apart from each other. The groove portion includes a first groove portion extending in a second direction intersecting the first direction. The reflective layer is arranged on the plurality of wiring portions. The light emitting element is disposed near the reflective layer and electrically connected to the plurality of wiring portions. The light emitting element is spaced apart from the first groove portion.

Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

Abstract: The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace that remains alter removal of the defective element is sealed by a same sealing member by which the new light-emitting element is sealed.

Abstract: A light-emitting device includes a first substrate having a through-hole, a plurality of first light-emitting elements that are arranged on the first substrate, a second substrate that is attached to the first substrate to cover the through-hole of the first substrate, and a second light-emitting element arranged on the second substrate, and electrically connected to wiring of the first substrate.

Abstract: A method for manufacturing a light-emitting device comprises retaining a conductor wire so that a straight-line distance between adjacent mounting portions while the conductor is retained is less than a distance along the conductor wire between the adjacent mounting portions; mounting a plurality of light emitting diodes to respective ones of the mounting portions on the retained conductor wire; and after the mounting step, sealing the plurality of light-emitting diodes mounted on the conductor wire.

Abstract: The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace that remains after removal of the defective element is sealed by a same sealing member by which the new light-emitting element is sealed.

Abstract: A light-emitting device includes a support including a substrate, a pair of electrodes and an insulating reflective member, the pair of electrodes being disposed on an upper surface of the substrate, and the reflective member being disposed on the substrate, a light-emitting element flip-chip mounted on the pair of electrodes, and a resin member disposed at least between the light-emitting element and the reflective member, the resin member including a conductive substance which electrically connects the light-emitting element to the pair of electrodes, the reflective member being disposed at least over an entirety of a surface that is located immediately below the resin member.

Abstract: A light emitting device includes a light emitting element and a substrate including a flexible base, a plurality of wiring portions, a groove portion, and a reflective layer. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate. The wiring portions are arranged on the flexible base. The groove portion is formed between the wiring portions spaced apart from each other. The groove portion includes a first groove portion extending in a second direction intersecting the first direction. The reflective layer is arranged on the plurality of wiring portions. The light emitting element is disposed near the reflective layer and electrically connected to the plurality of wiring portions. The light emitting element is spaced apart from the first groove portion.