Patents by Inventor Tadaaki Miyata

Tadaaki Miyata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8916903
    Abstract: A light emitting device that includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion between the plurality of wiring portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the base. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The sealing resin member is spaced apart from a first groove portion of the groove portion, the first groove portion extending in a second direction intersecting the first direction.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: December 23, 2014
    Assignee: Nichia Corporation
    Inventors: Motokazu Yamada, Tadaaki Miyata, Naoki Mori
  • Publication number: 20140334164
    Abstract: A wiring board includes an insulated substrate, a wiring pattern and a folded part. The insulated substrate has an elongated shape with shorter sides extending along a width direction. The wiring pattern is provided on the substrate. The wiring pattern extends between both ends in the width direction of the substrate, and has an exposed part exposed at at least one of the ends of the substrate. In the folded part, the exposed part of the wiring pattern and the substrate are integrally folded up inwardly toward an upper face side of the substrate at each of the ends of the substrate.
    Type: Application
    Filed: May 7, 2014
    Publication date: November 13, 2014
    Applicant: NICHIA CORPORATION
    Inventor: Tadaaki MIYATA
  • Publication number: 20140239331
    Abstract: Disclosed is a light emitting device including: a light emitting element including an LED chip and a phosphor layer provided at the light emitting side of the LED chip; and a substrate on which the light emitting element is bonded by an adhesive material. The adhesive material is an anisotropic conductive material.
    Type: Application
    Filed: February 26, 2014
    Publication date: August 28, 2014
    Applicant: NICHIA CORPORATION
    Inventors: Takahiro OYU, Tadaaki MIYATA
  • Publication number: 20140185294
    Abstract: In a light emitting device, one of at least one reinforcing portion is disposed on a site for joining regions of two wiring portions. The site for joining regions is provided for at least a first joining region where the first groove portion and the third groove portion join, and a second joining region where the second groove portion and the third groove portion join. A light emitting element is disposed over the third groove portion. In a plan view of the substrate member, the reinforcing portion surrounds the light emitting element. The upper surface of the reinforcing portion is lower than the upper surface of the light emitting element.
    Type: Application
    Filed: December 20, 2013
    Publication date: July 3, 2014
    Applicant: NICHIA CORPORATION
    Inventor: Tadaaki MIYATA
  • Publication number: 20140183575
    Abstract: The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace that remains after removal of the defective element is sealed by a same sealing member by which the new light-emitting element is sealed.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 3, 2014
    Applicant: NICHIA CORPORATION
    Inventor: Tadaaki MIYATA
  • Publication number: 20140177220
    Abstract: A light-emitting device includes a first substrate having a through-hole, a plurality of first light-emitting elements that are arranged on the first substrate, a second substrate that is attached to the first substrate to cover the through-hole of the first substrate, and a second light-emitting element arranged on the second substrate, and electrically connected to wiring of the first substrate.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 26, 2014
    Applicant: NICHIA CORPORATION
    Inventor: Tadaaki MIYATA
  • Publication number: 20140061684
    Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 6, 2014
    Applicant: NICHIA CORPORATION
    Inventors: Yukitoshi MARUTANI, Hiroto TAMAKI, Tadaaki MIYATA
  • Publication number: 20140038325
    Abstract: A method for manufacturing a light-emitting device comprises retaining a conductor wire so that a straight-line distance between adjacent mounting portions while the conductor is retained is less than a distance along the conductor wire between the adjacent mounting portions; mounting a plurality of light emitting diodes to respective ones of the mounting portions on the retained conductor wire; and after the mounting step, sealing the plurality of light-emitting diodes mounted on the conductor wire.
    Type: Application
    Filed: July 30, 2013
    Publication date: February 6, 2014
    Applicant: NICHIA CORPORATION
    Inventors: Yukitoshi Marutani, Tadaaki Miyata
  • Publication number: 20140008694
    Abstract: A light emitting device that includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion between the plurality of wiring portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the base. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The sealing resin member is spaced apart from a first groove portion of the groove portion, the first groove portion extending in a second direction intersecting the first direction.
    Type: Application
    Filed: July 8, 2013
    Publication date: January 9, 2014
    Inventors: Motokazu YAMADA, Tadaaki MIYATA, Naoki MORI
  • Publication number: 20130277707
    Abstract: A light-emitting device having superior light extraction efficiency and method for producing a light emitting device are provided. A light emitting device includes a base body having wiring conductors, conductive adhesive member, especially an anisotropic conductive adhesive member, including electrically conductive particles mixed in a light transmissive resin, and a semiconductor light emitting element bonded on the wiring conductors via the anisotropic conductive adhesive. The anisotropic conductive adhesive member includes the electrically conductive particles with a concentration lower in a surrounding region around the semiconductor light emitting element than in a lower region located between the semiconductor light emitting element and the base body.
    Type: Application
    Filed: April 22, 2013
    Publication date: October 24, 2013
    Applicant: NICHIA CORPORATION
    Inventor: Tadaaki MIYATA
  • Patent number: 8023549
    Abstract: A tuning methods of an External Cavity Laser Diode (ECLD), comprises steps of: (1) providing a laser light to a grating so as to tilt the grating to an optical axis of a collimated laser light, (2) adjusting the orientation of the grating relative to the collimated laser light, (3) monitoring singleness of longitudinal mode and optical power of a light emitted from the grating, (4) calculating an orientation of the grating to exhibit intended optical power at which the singleness of longitudinal mode shows at least predetermined value, (5) adjusting the grating orientation or the optical axis of the collimated laser light to the calculated grating orientation.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: September 20, 2011
    Assignees: Nichia Corporation, Inphase Technologies Inc.
    Inventors: Tadaaki Miyata, Hideki Kondo, Naoki Mori, Masaki Omori, Jason R. Ensher, Rodney Harris
  • Publication number: 20110075689
    Abstract: A tuning methods of an External Cavity Laser Diode (ECLD), comprises steps of: (1) providing a laser light to a grating so as to tilt the grating to an optical axis of a collimated laser light, (2) adjusting the orientation of the grating relative to the collimated laser light, (3) monitoring singleness of longitudinal mode and optical power of a light emitted from the grating, (4) calculating an orientation of the grating to exhibit intended optical power at which the singleness of longitudinal mode shows at least predetermined value, (5) adjusting the grating orientation or the optical axis of the collimated laser light to the calculated grating orientation.
    Type: Application
    Filed: September 30, 2009
    Publication date: March 31, 2011
    Applicants: NICHIA CORPORATION, INPHASE TECHNOLOGIES INC.
    Inventors: Tadaaki MIYATA, Hideki KONDO, Naoki MORI, Masaki OMORI, Jason R. ENSHER, Rodney HARRIS
  • Publication number: 20040078646
    Abstract: When a normal block of the recovery copy target having the same address as the recovery copy source is readable and the information items relating to both files using the related blocks coincide with each other, after the replacement processing of the faulty block of the recovery copy source, the block of the recovery copy source is allowed to be recovered by using the content of the block of the recovery copy target. This makes it possible that the faulty block be allowed to be recovered without the recovery copy processing being suspended.
    Type: Application
    Filed: March 17, 2003
    Publication date: April 22, 2004
    Applicant: NEC CORPORATION
    Inventor: Tadaaki Miyata
  • Publication number: 20030007417
    Abstract: An agitating impeller includes an agitation shaft and a blade section including a plurality of blade-forming sections mounted to the agitation shaft. The blade-forming sections are each formed of a planar member. An outer end portion of each of the blade-forming sections is bent backward with respect to the direction of rotation of the agitating impeller. A lower end portion of each of the blade-forming sections is formed to conform to the shape of a bottom wall of an agitating vessel in which the agitating impeller is provided. All angular portions of the individual blade-forming sections are chamfered, and agitation shaft and the blade section are glass-lined.
    Type: Application
    Filed: May 16, 2002
    Publication date: January 9, 2003
    Inventors: Tadaaki Miyata, Hiroyuki Tokuoka, Takahiko Nakamura