Patents by Inventor Tadahiro Kitamura
Tadahiro Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10400931Abstract: A curved portion at an inner circumferential face on a bend direction inside of a bend has a circular arc shape. By configuring the curved portion with a circular arc shape, a recess, serving as an example of a cross-sectional area enlargement portion that enlarges the cross-sectional area of a flow path of a pipe body running along a direction of an axial line 13, is formed in the inner circumferential face on the bend direction inside of the bend.Type: GrantFiled: February 26, 2015Date of Patent: September 3, 2019Assignee: Nifco Inc.Inventors: Youhei Souma, Hiroyuki Nakaya, Yoshio Tomono, Tadahiro Kitamura, Yoshiyuki Goto
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Patent number: 10253913Abstract: A curved tube structure, including: a tube main body including a bent portion at one portion in an axis line direction; and an enlarged cross-section portion formed along the axis line direction of the tube main body in an inner periphery inside a bending direction of the bent portion for enlarging a cross-section area of the tube main body.Type: GrantFiled: September 13, 2013Date of Patent: April 9, 2019Assignee: NIFCO INC.Inventors: Youhei Souma, Hiroyuki Nakaya, Yoshio Tomono, Tadahiro Kitamura, Yoshiyuki Goto
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Publication number: 20180128408Abstract: A curved portion at an inner circumferential face on a bend direction inside of a bend has a circular arc shape. By configuring the curved portion with a circular arc shape, a recess, serving as an example of a cross-sectional area enlargement portion that enlarges the cross-sectional area of a flow path of a pipe body running along a direction of an axial line 13, is formed in the inner circumferential face on the bend direction inside of the bend.Type: ApplicationFiled: February 26, 2015Publication date: May 10, 2018Inventors: Youhei SOUMA, Hiroyuki NAKAYA, Yoshio TOMONO, Tadahiro KITAMURA, Yoshiyuki GOTO
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Publication number: 20150226360Abstract: A curved tube structure, including: a tube main body including a bent portion at one portion in an axis line direction; and an enlarged cross-section portion formed along the axis line direction of the tube main body in an inner periphery inside a bending direction of the bent portion for enlarging a cross-section area of the tube main body.Type: ApplicationFiled: September 13, 2013Publication date: August 13, 2015Inventors: Youhei Souma, Hiroyuki Nakaya, Yoshio Tomono, Tadahiro Kitamura, Yoshiyuki Goto
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Patent number: 8216350Abstract: A dryer for an air suspension for a vehicle, includes a housing having an inlet port and an outlet port, a desiccant disposed between first and second filters within the housing, and a guide member including a shielding cylinder portion and a plate portion having plural communication holes, wherein the guide member is disposed between the inlet port and the first filter positioned closer to the inlet port, supports the first filter and the desiccant and guides a fluid to the desiccant, the shielding cylinder portion includes an opening and forms a flow passage for guiding the fluid, the fluid is guided to the desiccant from the inlet port via the shielding cylinder portion, and the flow passage and the communication holes, so that the fluid is dried by the desiccant and is then discharged from the dryer as a dry air to the air suspension for the vehicle.Type: GrantFiled: December 29, 2009Date of Patent: July 10, 2012Assignee: Aisin Seiki Kabushiki KaishaInventors: Yutaro Honjo, Hiroyuki Uehara, Tadahiro Kitamura
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Publication number: 20100206168Abstract: A dryer for an air suspension for a vehicle, includes a housing having an inlet port and an outlet port, a desiccant disposed between first and second filters within the housing, and a guide member including a shielding cylinder portion and a plate portion having plural communication holes, wherein the guide member is disposed between the inlet port and the first filter positioned closer to the inlet port, supports the first filter and the desiccant and guides a fluid to the desiccant, the shielding cylinder portion includes an opening and forms a flow passage for guiding the fluid, the fluid is guided to the desiccant from the inlet port via the shielding cylinder portion, and the flow passage and the communication holes, so that the fluid is dried by the desiccant and is then discharged from the dryer as a dry air to the air suspension for the vehicle.Type: ApplicationFiled: December 29, 2009Publication date: August 19, 2010Applicant: AISIN SEIKI KABUSHIKI KAISHAInventors: Yutaro HONJO, Hiroyuki Uehara, Tadahiro Kitamura
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Publication number: 20080260700Abstract: The invention is directed to spontaneously immortalized pancreatic duct cells and methods for generating pancreatic endocrine cells from spontaneously immortalized pancreatic duct cells that express the transcription factors Pdx1 and FoxO1. The invention also provides for methods for treating beta cell failure, the method comprising administering to a subject an effective amount of spontaneously immortalized pancreatic duct cells expressing a mutated version FoxO1.Type: ApplicationFiled: February 26, 2008Publication date: October 23, 2008Applicant: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORKInventors: Domenico ACCILI, Tadahiro Kitamura
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Patent number: 6838016Abstract: A polishing composition comprising the following components (a) to (g): (a) an abrasive which is at least one member selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide and titanium oxide, (b) a polyalkyleneimine, (c) at least one member selected from the group consisting of guinaldic acid and its derivatives, (d) at least one member selected from the group consisting of glycine, ?-alanine, histidine and their derivatives, (e) at least one member selected from the group consisting of benzotriazole and its derivatives, (f) hydrogen peroxide, and (g) water.Type: GrantFiled: November 5, 2001Date of Patent: January 4, 2005Assignee: Fujimi IncorporatedInventors: Kenji Sakai, Hiroshi Asano, Tadahiro Kitamura, Koji Ohno, Katsuyoshi Ina
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Patent number: 6797626Abstract: The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.Type: GrantFiled: December 27, 2002Date of Patent: September 28, 2004Assignees: Fujikoshi Machinery Corp., Fujimi IncorporatedInventors: Noriko Miyairi, Yasuo Inada, Tsuyoshi Hasegawa, Yuji Terashima, Kenji Sakai, Tadahiro Kitamura, Takahiro Umeda
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Patent number: 6773476Abstract: A polishing composition comprising: (a) at least one abrasive selected from the group consisting of silicon dioxide and aluminum oxide, (b) at least one organic compound selected from the group consisting of a polyethylene oxide, a polypropylene oxide, a polyoxyethylene alkyl ether, a polyoxypropylene alkyl ether, a polyoxyethylenepolyoxypropylene alkyl ether and a polyoxyalkylene addition polymer having a C≡C triple bond, represented by the formula (1): wherein each of R1 to R6 is H or a C1-10 alkyl group, each of X and Y is an ethyleneoxy group or a propyleneoxy group, and each of m and n is a positive number of from 1 to 20, (c) at least one polishing accelerating compound selected from the group consisting of citric acid, oxalic acid, tartaric acid, glycine, &agr;-alanine and histidine, (d) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole and tolyltriazole, (e) hydrogen peroxide, and (f) water.Type: GrantFiled: July 23, 2002Date of Patent: August 10, 2004Assignee: Fujimi IncorporatedInventors: Kenji Sakai, Kazusei Tamai, Tadahiro Kitamura, Tsuyoshi Matsuda, Katsuyoshi Ina
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Publication number: 20030124862Abstract: The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.Type: ApplicationFiled: December 27, 2002Publication date: July 3, 2003Applicant: Fujikoshi Machinery Corp.Inventors: Noriko Miyairi, Yasuo Inada, Tsuyoshi Hasegawa, Yuji Terashima, Kenji Sakai, Tadahiro Kitamura, Takahiro Umeda
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Publication number: 20030051413Abstract: A polishing composition comprising:Type: ApplicationFiled: July 23, 2002Publication date: March 20, 2003Applicant: FUJIMI INCORPORATEDInventors: Kenji Sakai, Kazusei Tamai, Tadahiro Kitamura, Tsuyoshi Matsuda, Katsuyoshi Ina
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Patent number: 6440186Abstract: A polishing composition comprising: (a) an abrasives (b) a compound to form a chelate with copper ions (c) a compound to provide a protective layer-forming function to a copper layer, (d) hydrogen peroxide, and (e) water, wherein the abrasive of component (a) has a primary particle size within a range of from 50 to 120 nm.Type: GrantFiled: August 15, 2001Date of Patent: August 27, 2002Assignee: Fujimi IncorporatedInventors: Kenji Sakai, Hiroshi Asano, Tadahiro Kitamura, Katsuyoshi Ina
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Patent number: 6428721Abstract: A polishing composition comprising the following components: (a) an abrasive, (b) &agr;-alanine, (c) hydrogen peroxide, and (d) water.Type: GrantFiled: May 4, 2000Date of Patent: August 6, 2002Assignee: Fujimi IncorporatedInventors: Katsuyoshi Ina, Tadahiro Kitamura, Satoshi Suzumura
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Publication number: 20020096659Abstract: A polishing composition comprising the following components (a) to (g):Type: ApplicationFiled: November 5, 2001Publication date: July 25, 2002Applicant: FUJIMI INCORPORATEDInventors: Kenji Sakai, Hiroshi Asano, Tadahiro Kitamura, Koji Ohno, Katsuyoshi Ina
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Publication number: 20020043027Abstract: A polishing composition comprising:Type: ApplicationFiled: August 15, 2001Publication date: April 18, 2002Applicant: FUJIMI INCORPORATEDInventors: Kenji Sakai, Hiroshi Asano, Tadahiro Kitamura, Katsuyoshi Ina
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Patent number: 6315803Abstract: Object: To provide a polishing composition which is capable of polishing a tantalum-containing compound at a high stock removal rate and whereby the copper surface after polishing is scarcely corroded, and to provide a polishing process where dishing can be minimized. Means to accomplish the object: A polishing composition comprising an abrasive, oxalic acid, an ethylenediamine derivative, a benzotriazole derivative and water and not containing an oxidizing agent, and a polishing composition comprising an abrasive, oxalic acid, an ethylenediamine derivative, a benzotriazole derivative, water and hydrogen peroxide.Type: GrantFiled: December 1, 1999Date of Patent: November 13, 2001Assignee: Fujimi IncorporatedInventors: Katsuyoshi Ina, Tadahiro Kitamura
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Patent number: 6139763Abstract: A polishing composition comprising the following components:(a) an abrasive,(b) an oxidizing agent capable of oxidizing tantalum,(c) a reducing agent capable of reducing tantalum oxide, and(d) water.Type: GrantFiled: December 1, 1999Date of Patent: October 31, 2000Assignee: Fujimi IncorporatedInventors: Katsuyoshi Ina, Tadahiro Kitamura, Tomohide Kamiya, Satoshi Suzumura