Patents by Inventor Tadahiro Kuroda

Tadahiro Kuroda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10992349
    Abstract: Ringing occurring in a digital signal to be transmitted, is reduced or suppressed. A transmission module Ma includes a transmitter 200a configured to transmit a digital signal, a transmission antenna 100a constituted by a metal plate, or by a conductor formed on an insulator. The transmission antenna 100a is configured to be electromagnetically or magnetically coupled to a reception antenna 100b of a non-contact reception module Mb for digital communication. A resistor 400a is connected in series between the transmitter 200a and the transmission antenna 100a. The resistor 400a has such a resistance value that the resistor 400a entirely blunts a waveform of the digital signal outputted from the transmitter 200a so as to reduce or suppress ringing occurring in the digital signal. The blunted digital signal can be inputted into the transmission antenna 100a.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: April 27, 2021
    Assignees: Hosiden Corporation, Keio University
    Inventors: Hayato Kondo, Kosuke Sasada, Tadahiro Kuroda
  • Patent number: 10666324
    Abstract: The invention relates to a rotation information transmission apparatus where wireless communication of data of several Gbps is made possible without miniaturizing the coupler to such an extent that installation is difficult. A first substrate where a first coupler in arc form is provided in an upper portion or a lower portion and a second substrate where a second coupler in arc form of which the length of the arc is shorter than that of the first coupler in arc form is arranged in a location where coupling with the first coupler in arc form is possible are arranged so as to rotate relative to each other by fixing either the first substrate or the second substrate to a non-movable portion and fixing the other of the first substrate or the second substrate to a rotational member.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: May 26, 2020
    Assignee: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20190372627
    Abstract: Ringing occurring in a digital signal to be transmitted, is reduced or suppressed. A transmission module Ma includes a transmitter 200a configured to transmit a digital signal, a transmission antenna 100a constituted by a metal plate, or by a conductor formed on an insulator. The transmission antenna 100a is configured to be electromagnetically or magnetically coupled to a reception antenna 100b of a non-contact reception module Mb for digital communication. A resistor 400a is connected in series between the transmitter 200a and the transmission antenna 100a. The resistor 400a has such a resistance value that the resistor 400a entirely blunts a waveform of the digital signal outputted from the transmitter 200a so as to reduce or suppress ringing occurring in the digital signal. The blunted digital signal can be inputted into the transmission antenna 100a.
    Type: Application
    Filed: December 1, 2017
    Publication date: December 5, 2019
    Inventors: Hayato Kondo, Kosuke Sasada, Tadahiro Kuroda
  • Publication number: 20190363067
    Abstract: The invention relates to a multilayer semiconductor integrated circuit device where a stable multilayer structure is achieved. According to the invention, a first semiconductor integrated circuit device is provided with: a first n type trough semiconductor region that penetrates trough a first p type semiconductor body in the direction of the thickness and is connected to the potential of a grounded power supply; and a second n type through semiconductor region that is connected to the potential of a positive power supply, and a second semiconductor integrated circuit device, which has a first electrode and a second electrode respectively connected to the first n type through semiconductor region and the second n type through semiconductor region, is layered on the first semiconductor integrated circuit device.
    Type: Application
    Filed: February 13, 2018
    Publication date: November 28, 2019
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20190296798
    Abstract: The invention relates to a rotation information transmission apparatus where wireless communication of data of several Gbps is made possible without miniaturizing the coupler to such an extent that installation is difficult. A first substrate where a first coupler in arc form is provided in an upper portion or a lower portion and a second substrate where a second coupler in arc form of which the length of the arc is shorter than that of the first coupler in arc form is arranged in a location where coupling with the first coupler in arc form is possible are arranged so as to rotate relative to each other by fixing either the first substrate or the second substrate to a non-movable portion and fixing the other of the first substrate or the second substrate to a rotational member.
    Type: Application
    Filed: July 14, 2017
    Publication date: September 26, 2019
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Patent number: 10348365
    Abstract: The invention relates to a directional coupling communication apparatus where the coupling impedance can be easily matched to reduce reflections, and thus, the speed of communication channels is increased as compared to that with inductive coupling, and at the same time, the reliability of communication is improved by increasing the signal intensity. Modules having a coupler where an input/output connection line is connected to a first end, and either a ground line or an input/output connection line to which an inverse signal of a signal to be inputted into the input/output connection line connected to the above-described first end is inputted is connected are layered on top of each other so that the couplers are couplers to each other using capacitive coupling and inductive coupling.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: July 9, 2019
    Assignee: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Patent number: 10291290
    Abstract: The invention relates to a directional coupling communication apparatus where the coupling impedance can be easily matched to reduce reflections, and thus, the speed of communication channels is increased as compared to that with inductive coupling, and at the same time, the reliability of communication is improved by increasing the signal intensity. Modules having a coupler where an input/output connection line is connected to a first end, and either a ground line or an input/output connection line to which an inverse signal of a signal to be inputted into the input/output connection line connected to the above-described first end is inputted is connected are layered on top of each other so that the couplers are couplers to each other using capacitive coupling and inductive coupling.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: May 14, 2019
    Assignee: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20190051720
    Abstract: The invention relates to a semiconductor integrated circuit device where it is made possible to achieve both an improvement in the degree of inductive coupling between coils and suppression of the power supply voltage drop in the power supply wires. A power supply network is provided with: a first power supply wire group that passes through the inside of every coil of a first coil array formed in the same level in a multilayered wire structure provided on a substrate, in the X direction as viewed in the direction in which the multilayered wire structure is layered, and a second power supply wire group that passes through the inside of every coil in the Y direction, wherein at least part of the first power supply wire group and at least part of the second power supply wire group form a closed circuit that surrounds the periphery of each coil.
    Type: Application
    Filed: January 26, 2017
    Publication date: February 14, 2019
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Patent number: 9979441
    Abstract: An electronic circuit carries out communication by inductive coupling between chips which are stacked and mounted. The electronic circuit relays an inter-chip communication signal by a repeater which receives a signal from a transmitter to recognize a transmission source and a receiving destination, and relays a received signal when the repeater itself exists between the transmission source and the receiving destination, and does not relay the received signal when the repeater itself does not exist between the transmission source and the receiving destination. Accordingly, data can be transferred at high speed up to a chip farther than the dimensions of a coil through communications by inductive coupling between the stacked and mounted chips.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: May 22, 2018
    Assignee: THRUCHIP JAPAN INC.
    Inventor: Tadahiro Kuroda
  • Patent number: 9978717
    Abstract: The invention relates to a multilayer semiconductor integrated circuit device which is provided with a smaller space for a three-dimensional multilayer configuration at a lower cost and with a sufficient power supply quality. A first semiconductor integrated circuit device is provided with a first penetrating semiconductor region that penetrates through the first semiconductor body in the thickness direction and that is connected to the first power supply potential, and a second penetrating semiconductor region that penetrates through the first semiconductor body in the thickness direction and that is connected to the second power supply potential. A second semiconductor integrated circuit device having a first electrode and a second electrode is layered on top of the first semiconductor integrated circuit device so that the first electrode and the second electrode are respectively connected to the first penetrating semiconductor region and the second penetrating semiconductor region.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: May 22, 2018
    Assignee: THRUCHIP JAPAN INC.
    Inventor: Tadahiro Kuroda
  • Publication number: 20180076853
    Abstract: The invention relates to a directional coupling communication apparatus where the coupling impedance can be easily matched to reduce reflections, and thus, the speed of communication channels is increased as compared to that with inductive coupling, and at the same time, the reliability of communication is improved by increasing the signal intensity. Modules having a coupler where an input/output connection line is connected to a first end, and either a ground line or an input/output connection line to which an inverse signal of a signal to be inputted into the input/output connection line connected to the above-described first end is inputted is connected are layered on top of each other so that the couplers are couplers to each other using capacitive coupling and inductive coupling.
    Type: Application
    Filed: November 9, 2017
    Publication date: March 15, 2018
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Patent number: 9864143
    Abstract: The invention relates to a directional coupling-type multi-drop bus of which the impedance is matched with the bus at the time of coupling so that the speed is increased. A directional coupler is formed when a second module provided with a second coupler end is mounted on a first module provided with a first coupler end, and as a result, the coupling impedance where the proximity effects in the coupling state of the directional coupler are reflected is matched with the impedance of the bus.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: January 9, 2018
    Assignee: KEIO UNIVERSITY
    Inventors: Tadahiro Kuroda, Hiroki Ishikuro
  • Patent number: 9847305
    Abstract: In accordance with the disclosed semiconductor chip and multi-chip module, signal transmission is made possible between semiconductor chips that are placed on a plane so as to be adjacent to each other through inductive coupling without affecting other coils such as in an oscillation circuit or an antenna circuit for RF communication. A multilayer solenoid coil, where a plane of the coil formed in a multilayer wiring structure in a semiconductor body is parallel to a main surface of the semiconductor body, is formed along at least one side end surface of the semiconductor body.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: December 19, 2017
    Assignee: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Patent number: 9843363
    Abstract: This invention relates to a covered wire coupling type information communication network, an electromagnetic field coupling communication method and an electromagnetic field coupler, which makes it possible to solve the problem with the mechanical contact system and the structure where wires are exposed in a connector. A first covered wire and a second covered wire are placed in close proximity to each other in a coupling unit, and electromagnetic coupling in the coupling unit creates a data connection between the first and second covered wire.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: December 12, 2017
    Assignee: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Patent number: 9749020
    Abstract: An integrated circuit includes multiple quadrangular coils including a first wiring and a second wiring that are alternately connected to each other and formed on different layers in a manner perpendicularly intersecting each other. The coils are partly overlapped with each other in a diagonal direction that connects opposite corners of the coils. The coils preferably have the same structures. A target coil among the coils preferably partly overlaps with another coil among the coils in two diagonal directions that connect opposite corners of the target coil.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: August 29, 2017
    Assignee: ThruChip Japan, Inc.
    Inventor: Tadahiro Kuroda
  • Patent number: 9716306
    Abstract: A directional coupler including a first transmission line including a terminal part provided with a matched termination, and a front end part being an end portion on a side opposite to a side of the terminal part; a second transmission line electromagnetically coupled with the first transmission line; and a third transmission line electromagnetically coupled with the first transmission line, wherein each of the second and third transmission lines includes a near end and a far end, the near end being positioned on a side closer to the front end part when tracing the first transmission line from the front end part, the far end being positioned on a side farther from the front end part when tracing the first transmission line from the front end part, and wherein the near end is terminated to have an impedance smaller than a characteristic impedance of the second transmission line.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: July 25, 2017
    Assignee: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20170092603
    Abstract: In accordance with the disclosed semiconductor chip and multi-chip module, signal transmission is made possible between semiconductor chips that are placed on a plane so as to be adjacent to each other through inductive coupling without affecting other coils such as in an oscillation circuit or an antenna circuit for RF communication. A multilayer solenoid coil, where a plane of the coil formed in a multilayer wiring structure in a semiconductor body is parallel to a main surface of the semiconductor body, is formed along at least one side end surface of the semiconductor body.
    Type: Application
    Filed: September 29, 2016
    Publication date: March 30, 2017
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro KURODA
  • Publication number: 20160379958
    Abstract: The invention relates to a multilayer semiconductor integrated circuit device which is provided with a smaller space for a three-dimensional multilayer configuration at a lower cost and with a sufficient power supply quality. A first semiconductor integrated circuit device is provided with a first penetrating semiconductor region that penetrates through the first semiconductor body in the thickness direction and that is connected to the first power supply potential, and a second penetrating semiconductor region that penetrates through the first semiconductor body in the thickness direction and that is connected to the second power supply potential. A second semiconductor integrated circuit device having a first electrode and a second electrode is layered on top of the first semiconductor integrated circuit device so that the first electrode and the second electrode are respectively connected to the first penetrating semiconductor region and the second penetrating semiconductor region.
    Type: Application
    Filed: September 9, 2016
    Publication date: December 29, 2016
    Applicant: THRUCHIP JAPAN INC.
    Inventor: Tadahiro Kuroda
  • Patent number: 9419684
    Abstract: The invention relates to an inter-module communication apparatus where the reflection is reduced so that the communication channel can provide high speed and broadband as compared to inductive coupling. When modules having a signal line terminated with a terminating member and a feedback signal line are layered on top of each other so that the signal lines are coupled to each other and the return signal lines are coupled to each other using capacitive coupling and inductive coupling, the impedance of the terminating members is a coupling impedance that reflects the proximity effects in the coupling state between the modules.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: August 16, 2016
    Assignee: KEIO UNIVERSITY
    Inventors: Tadahiro Kuroda, Hiroki Ishikuro
  • Publication number: 20160197393
    Abstract: A directional coupler including a first transmission line including a terminal part provided with a matched termination, and a front end part being an end portion on a side opposite to a side of the terminal part; a second transmission line electromagnetically coupled with the first transmission line; and a third transmission line electromagnetically coupled with the first transmission line, wherein each of the second and third transmission lines includes a near end and a far end, the near end being positioned on a side closer to the front end part when tracing the first transmission line from the front end part, the far end being positioned on a side farther from the front end part when tracing the first transmission line from the front end part, and wherein the near end is terminated to have an impedance smaller than a characteristic impedance of the second transmission line.
    Type: Application
    Filed: July 30, 2014
    Publication date: July 7, 2016
    Applicant: Keio University
    Inventor: Tadahiro KURODA