Tadahiro Kuroda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: An integrated circuit includes multiple quadrangular coils including a first wiring and a second wiring that are alternately connected to each other and formed on different layers in a manner perpendicularly intersecting each other. The coils are partly overlapped with each other in a diagonal direction that connects opposite corners of the coils. The coils preferably have the same structures. A target coil among the coils preferably partly overlaps with another coil among the coils in two diagonal directions that connect opposite corners of the target coil.
Abstract: This invention relates to a covered wire coupling type information communication network, an electromagnetic field coupling communication method and an electromagnetic field coupler, which makes it possible to solve the problem with the mechanical contact system and the structure where wires are exposed in a connector. A first covered wire and a second covered wire are placed in close proximity to each other in a coupling unit, and electromagnetic coupling in the coupling unit creates a data connection between the first and second covered wire.
Abstract: The invention relates to a directional coupling communication apparatus where the coupling impedance can be easily matched to reduce reflections, and thus, the speed of communication channels is increased as compared to that with inductive coupling, and at the same time, the reliability of communication is improved by increasing the signal intensity. Modules having a coupler where an input/output connection line is connected to a first end, and either a ground line or an input/output connection line to which an inverse signal of a signal to be inputted into the input/output connection line connected to the above-described first end is inputted is connected are layered on top of each other so that the couplers are couplers to each other using capacitive coupling and inductive coupling.
Abstract: By stacking and mounting a second substrate 20 having the same structure as that of a first substrate 10 on the first substrate upon rotating the second substrate by 180 degrees and sliding the second substrate, an antenna 11 and an antenna 22 overlap each other and an antenna 12 and an antenna 21 overlap each other and communications in each of these combinations are enabled, and a space for wire bondings 16 is secured. Accordingly, communications between the substrates are made via the antennas, and further, a space for wire bondings is secured on each substrate, wireless communications are carried out between substrates which have the same basic structure and are stacked and mounted, and power can be supplied via the wire bondings.
Abstract: Wirelessly supplying power is rapidly changed by a switching circuit 11 selectively exciting a magnetic field coupling resonance circuit of L1 and C1 for wireless power supply by use of a resonant frequency of the resonance circuit and its ?-divided frequency. A large power is supplied in the case of excitation at the resonant frequency, and in the case of excitation at the ?-divided frequency, a small power is supplied. A wireless power supply device with a high power conversion efficiency, with less unwanted radiation, and capable of rapidly changing supplying power can thereby be provided.
Abstract: A low-power high-speed asynchronous inductive-coupling transmission and reception technology is provided, in which a current signal of a single pulse is made to flow through a transmitting coil, and a voltage signal of a double pulse induced in an inductively-coupled receiving coil can be received asynchronously. A transmitting circuit for performing non-contact proximity communication adopts a configuration in which current flows through a first coil in a first direction for each change of a logical value of transmit data. A receiving circuit connected to a second coil coupled inductively to the first coil employs a comparator which determines an induced voltage of a double pulse induced in the second coil by current in the first direction and outputs a unipolar single pulse signal. Whenever the single pulse signal outputted by the comparator is inputted, the receiving circuit inverts the output in a sequential circuit and reproduces receive data.
Abstract: The invention relates to a directional coupling-type multi-drop bus of which the impedance is matched with the bus at the time of coupling so that the speed is increased. A directional coupler is formed when a second module provided with a second coupler end is mounted on a first module provided with a first coupler end, and as a result, the coupling impedance where the proximity effects in the coupling state of the directional coupler are reflected is matched with the impedance of the bus.
Abstract: The invention relates to an inductor element and an integrated circuit device where the efficiency of use of wire materials is high and noise interference through capacitive/inductive coupling from peripheral wires is low. Coil elements 1, 2 are provided in at least two adjacent layer levels having main wires which run in different directions so that each coil element 1 (2) is connected to a coil element 2 (1) in a different layer level so as to form one coil, and shield wires 3, 4 are connected to a power 5 either above or below or to the left or right of said coil elements 1, 2.
Abstract: The invention relates to a sealed semiconductor recording medium and a sealed semiconductor memory and provides at low cost a sealed semiconductor memory with high reliability that can allow wireless data communication to be carried out at high speed without interference. At least one semiconductor substrate is provided with a number of read only memory blocks having such a size that the maximum side is 20 mm or less in such a state that the read only memory blocks do not share a power source wire, wherein each of the above-described read only memory blocks has a coil for power reception and a coil for data communication, and data different from each other are written in the above-described read only memory blocks.
Abstract: The invention relates to a multi-stack semiconductor integrated circuit device where communication between semiconductor chips can be efficiently carried out by bypassing a number of chips. Each semiconductor chip that forms a multi-stack semiconductor integrated circuit device having a stack structure where four or more semiconductor chips having the same shape are stacked on top of each other is provided with: a first coil for transmission/reception for communication between chips over a long distance; and a second coil for transmission/reception for communication between chips over a short distance, of which the size is smaller than that of the above-described first coil for transmission/reception.
Abstract: The invention relates to an inductor element, an integrated circuit device and a three-dimensional circuit device where a wire passes through the opening of a coil so that the efficiency in the use of wires is high. Coil elements are provided in the main direction of wires in at least two adjacent layer levels having different main directions of wires, and the coil elements are connected to coil elements formed in different layer levels so that a single coil is formed.
Abstract: An electronic circuit includes: a first substrate having a first coil and a first transmission circuit connected to the first coil that asynchronously outputs the signal to the first coil; a second substrate having a second coil at a position corresponding to the first coil that forms a communication channel with the first coil to receive the signal and a third coil connected to the second coil by a wire on the substrate and transmits the signal; and a third substrate having a fourth coil at a position corresponding to the third coil that forms a communication channel with the third coil and a first reception circuit connected to the fourth coil to asynchronously receive the signal. The substrates are stacked on one another, and the first transmission circuit changes a current to the first coil each time a logical value of transmission data changes.
Abstract: The present invention has an object to provide an electronic circuit testing apparatus that is preferable for testing an electronic circuit which carries out communications between substrates based on inductive coupling and is capable of testing the electronic circuit without using test pads, wherein a probe 15 is caused to intervene in a communications channel composed by inductive coupling based on the first and second transmitter coils 21a, 21b; and the first and second receiver coils 23a, 23b, and an LSI is tested by a tester 11, buffers 12 and 13, and a Tx/Rx switch 14. Accordingly, it is not be necessary for that the electronic circuit testing apparatus is provided with a needle that touches pads and leads of the electronic circuit, and the service life there can be lengthened.
Abstract: To provide an electronic circuit capable of easily testing semiconductor chips that are inductively coupled to each other and that communicate with each other, and an inspection method performed in the electronic circuit.
Abstract: The invention relates to an inter-module communication apparatus where the reflection is reduced so that the communication channel can provide high speed and broadband as compared to inductive coupling. When modules having a signal line terminated with a terminating member and a feedback signal line are layered on top of each other so that the signal lines are coupled to each other and the return signal lines are coupled to each other using capacitive coupling and inductive coupling, the impedance of the terminating members is a coupling impedance that reflects the proximity effects in the coupling state between the modules.
Abstract: The invention relates to a semiconductor device and a manufacturing method for the same, and makes the rejection rate of the product after chips are stacked and mounted sufficiently low, even when the chips are selected in a conventional, simple and inexpensive wafer test.
Abstract: Disclosed is a semiconductor integrated circuit device including a transmitting circuit and a receiving coil inductively coupled to a transmitting coil. The transmitting circuit transmits data by supplying a current through the transmitting coil not at the time of transition of data but at every rising edge or falling edge of a clock used in transmission of data. At every rising edge or falling edge of the clock, a receiving circuit captures a voltage induced in the receiving coil due to the current flowing through the transmitting coil, reproduces the transmitted data and outputs the reproduced data.
Abstract: An electronic circuit for which a coil 22 is disposed overlapping with a memory array region to carry out communications by inductive coupling between stacked and mounted chips by the coil 22. Because intersections 1 and 2 between the coil 22 and a bit line 15 are located at a pair of positions that are equal to each other in wiring length from both terminals a and g of the coil 22, interference from the bit line 15 to the coil 22 results in the same phase and same amplitude at both ends of the coil 22, and can thus be eliminated by a differential amplifier. Thereby, a coil antenna can be disposed so that, even when a coil antenna to carry out communications by inductive coupling is disposed overlapping with a memory array region, little interference occurs from a memory array wiring to communications by the coil antenna.
Abstract: A pulse transmission technique is used for wireless communication between a microcomputer (13) having a debugging support circuit (17) and a debugger (13). The pulse transmission technique is based on magnetic field coupling between a first coil (14) provided for the microcomputer and a second coil (8) coupled with the debugger. During an initialization operation, the microcomputer performs a process of configuring a communication condition of the wireless communication to perform the wireless communication. The microcomputer awaits control from the debugger when the microcomputer establishes communication with the debugger. The debugger awaits establishment of the communication and proceeds to control of the microcomputer in accordance with the wireless communication. It is possible to provide contactless interface for system debugging without the need for a large antenna or a large-scale circuit for modulation and demodulation.
November 8, 2007
Date of Patent:
April 16, 2013
Renesas Electronics Corporation, Keio University
Abstract: In the electronic circuit device with stacked plural components of the same function, this invention enables to select an arbitrary component among plural components by a control element, without setting pre-determined identification information in each component. By installing a sequential logic circuit in each component, and changing a state of the sequential logic circuit by control data transmitted from the component stacked in a preceding stage or the control element, the state of the controlled component is set to a state that accepts a selection made by the control element.