Patents by Inventor Tadao Shinoda

Tadao Shinoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof
    Patent number: 6297074
    Abstract: A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: October 2, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Ichiro Miyano, Koji Serizawa, Hiroyuki Tanaka, Tadao Shinoda, Suguru Sakaguchi
  • Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof
    Patent number: 5804872
    Abstract: A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip-semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.
    Type: Grant
    Filed: February 5, 1997
    Date of Patent: September 8, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Ichiro Miyano, Koji Serizawa, Hiroyuki Tanaka, Tadao Shinoda, Suguru Sakaguchi
  • Film carrier tape and laminated multi-chip semiconductor device incorporating the same
    Patent number: 5631497
    Abstract: A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.
    Type: Grant
    Filed: July 9, 1991
    Date of Patent: May 20, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Ichiro Miyano, Koji Serizawa, Hiroyuki Tanaka, Tadao Shinoda, Suguru Sakaguchi