Patents by Inventor Tadashi Kosaka

Tadashi Kosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220224071
    Abstract: A semiconductor laser device comprises a stem serving as a base; a laser diode LD submount having surface electrodes arranged thereon and joined to the surface of the stem; an LD chip joined to the surface electrode and connected with the surface electrode; and leads fixed in through holes formed in the stem by means of sealing parts and electrically connected to the surface electrodes via embedded layers in via holes formed in the LD submount, wherein grooves are formed in portions of the sealing parts or in portions of the LD submount around the connections between the leads and the embedded layers, to obtain a good modulated light waveform.
    Type: Application
    Filed: July 2, 2019
    Publication date: July 14, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Naoki KOSAKA, Ayumi FUCHIDA, Masaaki SHIMADA, Go SAKAINO, Tadashi TAKASE
  • Patent number: 10831235
    Abstract: Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: November 10, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yu Katase, Tadashi Kosaka, Koichi Shimizu, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Ikuto Kimura
  • Patent number: 10735673
    Abstract: According to the disclosure, a relationship of Tgp>Tgf, ?f1<?PCB1, and (Tgp?To)×?PCB1<(Tgf?To)×?f1+(Tgp?Tgf)×?f2 or a relationship of Tgp<Tgf, ?PCB1<?f1, and (Tgf?To)×?f1<(Tgp?To)×?PCB1+(Tgf?Tgp)×?PCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as ?PCB1 and ?PCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as ?f1 and ?f2, respectively, and a room temperature is denoted as To.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: August 4, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Koichi Shimizu, Tadashi Kosaka, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Yu Katase
  • Publication number: 20190335119
    Abstract: According to the disclosure, a relationship of Tgp>Tgf, ?f1<?PCB1, and (Tgp-To) ×?PCB1<(Tgf-To)×?f1+(Tgp-Tgf)×?f2 or a relationship of Tgp<Tgf, ?PCB1<?f1, and (Tgf-To)×?f1<(Tgp-To)×?PCB1+(Tgf-Tgp)×?PCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as ?PCB1 and ?PCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as ?f1 and ?f2, respectively, and a room temperature is denoted as To.
    Type: Application
    Filed: April 19, 2019
    Publication date: October 31, 2019
    Inventors: Koichi Shimizu, Tadashi Kosaka, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Yu Katase
  • Publication number: 20190294213
    Abstract: Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.
    Type: Application
    Filed: March 19, 2019
    Publication date: September 26, 2019
    Inventors: Yu Katase, Tadashi Kosaka, Koichi Shimizu, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Ikuto Kimura
  • Patent number: 10319867
    Abstract: Provided is an electronic component including: a base member; an electronic device fixed on the base member; and a lid member arranged over the electronic device and fixed on the base member. A primary material of the lid member is a crystal quartz, the lid member has two primary faces opposing to the electronic device and four side faces, and each of the four side faces is a wet-etched face that is not parallel to an optical axis of the crystal quartz.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: June 11, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yu Katase, Tadashi Kosaka, Koichi Shimizu, Shuichi Chiba, Kazuya Notsu, Yoshifumi Murakami
  • Patent number: 10115691
    Abstract: A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: October 30, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Ichiro Kataoka, Takahiro Hachisu, Tadashi Kosaka
  • Publication number: 20180269336
    Abstract: Provided is an electronic component including: a base member; an electronic device fixed on the base member; and a lid member arranged over the electronic device and fixed on the base member. A primary material of the lid member is a crystal quartz, the lid member has two primary faces opposing to the electronic device and four side faces, and each of the four side faces is a wet-etched face that is not parallel to an optical axis of the crystal quartz.
    Type: Application
    Filed: March 7, 2018
    Publication date: September 20, 2018
    Inventors: Yu Katase, Tadashi Kosaka, Koichi Shimizu, Shuichi Chiba, Kazuya Notsu, Yoshifumi Murakami
  • Patent number: 9978675
    Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: May 22, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Takanori Suzuki, Fujio Ito, Tadashi Kosaka, Takao Toyooka, Koji Tsuduki, Yasushi Kurihara, Ikuto Kimura
  • Publication number: 20170330852
    Abstract: A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.
    Type: Application
    Filed: April 19, 2017
    Publication date: November 16, 2017
    Inventors: Ichiro Kataoka, Takahiro Hachisu, Tadashi Kosaka
  • Patent number: 9815133
    Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: November 14, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
  • Publication number: 20170150601
    Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.
    Type: Application
    Filed: November 14, 2016
    Publication date: May 25, 2017
    Inventors: Takanori Suzuki, Fujio Ito, Tadashi Kosaka, Takao Toyooka, Koji Tsuduki, Yasushi Kurihara, Ikuto Kimura
  • Patent number: 9585287
    Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: February 28, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yu Katase, Fujio Ito, Tadashi Kosaka, Koji Tsuduki, Ichiro Kataoka
  • Publication number: 20160366774
    Abstract: An electronic component including an electronic device and a container accommodating the electronic device. The container includes a base portion including a first surface on which the electronic device is mounted and a second surface on an opposite side of the first surface, an opposing portion opposing the electronic device with a space in between, a frame portion surrounding the space between the base portion and the opposing portion, and a plurality of connecting portions that are positioned on the second surface and positioned in at least an orthographic projection area of the electronic device, the plurality of connecting portions being soldered to a wiring member. In the orthographic projection area of the electronic device, a thickness of the base portion in a central area is smaller than a thickness of the base portion in a peripheral area such that the second surface forms a concave surface.
    Type: Application
    Filed: June 8, 2016
    Publication date: December 15, 2016
    Inventors: Shin Hasegawa, Fujio Ito, Takanori Suzuki, Takao Toyoka, Tadashi Kosaka, Yasushi Kurihara, Koji Tsuduki
  • Publication number: 20160044796
    Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
    Type: Application
    Filed: August 3, 2015
    Publication date: February 11, 2016
    Inventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
  • Patent number: 9253922
    Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: February 2, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
  • Patent number: 9220172
    Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: December 22, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Patent number: 9155212
    Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: October 6, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20150279770
    Abstract: A package for mounting a semiconductor element includes a substrate including an upper face having a region where a semiconductor element is mounted, a lower face positioned on a side opposite to the upper face, and a side face connecting the upper face and the lower face and an electrode formed on the side face to extend in a direction from the lower face to the upper face. A width of the electrode at a first height in the direction from the lower face to the upper face is smaller than that of the electrode at a second height closer to the upper face than the first height in the direction from the lower face to the upper face.
    Type: Application
    Filed: March 16, 2015
    Publication date: October 1, 2015
    Inventors: Ichiro Kataoka, Tadashi Kosaka, Takanori Suzuki
  • Publication number: 20150116946
    Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.
    Type: Application
    Filed: October 21, 2014
    Publication date: April 30, 2015
    Inventors: Yu Katase, Fujio Ito, Tadashi Kosaka, Koji Tsuduki, Ichiro Kataoka