Patents by Inventor Tadashi Nomura

Tadashi Nomura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200137893
    Abstract: A high frequency module 1a includes a wiring board 2, multiple components 3a to 3d mounted on an upper surface 2a of the wiring board 2, a shield component 4 mounted between the component 3b and the component 3c, a sealing resin layer 5 that covers the components 3a to 3d and the shield component 4, and a shield film 6 that covers the surface of the sealing resin layer. A recess 10 is formed in an upper surface 5a of the sealing resin layer 5 so as to expose the shield component 4. The recess 10 is formed within a region surrounded by edges of the sealing resin layer 5 so as not to reach the side surfaces of the sealing resin layer 5. The shield film 6 further covers wall surfaces 10a of the recess 10 and part of the shield component 4 exposed through the recess 10.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Inventors: Tadashi NOMURA, Yuta MORIMOTO, Minoru KOMIYAMA, Akio KATSUBE
  • Publication number: 20200003449
    Abstract: An air-conditioning apparatus makes it possible to detect the presence or absence of a biofilm without the influence of water surface. The air-conditioning apparatus performs at least cooling operation or humidifying operation. The air-conditioning apparatus includes a drain pan to receive water, a draining unit to drain water received in the drain pan, and a detection unit to detect a biofilm formed in the drain pan. The detection unit performs the detection of the biofilm in a state in which draining of water from the drain pan is complete.
    Type: Application
    Filed: December 6, 2016
    Publication date: January 2, 2020
    Applicant: Mitsubishi Electrict Corporation
    Inventors: Akira MORIKAWA, Akane NOMURA, Tadashi SAITO, Isamu HIRASHIKI
  • Patent number: 10473360
    Abstract: A fan includes: an impeller including a main plate having a first plane, a plurality of first blades each formed the first plane, and a shroud formed integrally with the plurality of first blades; a fan case; a drive source; and a rotation shaft. The first blades each include a linearly protruding region that is linearly increased in height from an outer circumferential side to an inner circumferential side, and a curvedly protruding region that is curvedly increased in height from the outer circumferential side to the inner circumferential side, the height extending in a direction in which each first blade protrudes. The linearly protruding region is welded to the main plate. Accordingly, a highly durable fan can be implemented that allows sufficient durability to be maintained even under a high temperature environment or an acid environment.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: November 12, 2019
    Assignee: NORITZ CORPORATION
    Inventors: Shuji Kameyama, Keigo Fukunishi, Mitsuo Nomura, Masaaki Takata, Yukio Yoshida, Tadashi Takewaka
  • Publication number: 20190341329
    Abstract: A module improves a heat-releasing effect and that can be stably mounted on a mother substrate or the like. The module includes: a first component mounted on one main surface of a wiring substrate and generates heat; second components mounted on the one main surface of the wiring substrate; a sealing resin layer that seals the first component and the second components so as not to cover a top surface of the first component; and heat-dissipating parts arranged on the top surface of the first component. The height of the highest positions of the heat-dissipating parts relative to the one main surface is less than or equal to the position of a highest surface out of a surface of the sealing resin layer that is on the opposite side from the surface of the sealing resin layer that faces the one main surface.
    Type: Application
    Filed: July 11, 2019
    Publication date: November 7, 2019
    Inventors: Issei YAMAMOTO, Tadashi NOMURA
  • Patent number: 10349512
    Abstract: A high-frequency module includes: a multilayer wiring board; a plurality of components mounted on an upper surface of the multilayer wiring board; a sealing resin layer laminated on the upper surface of the multilayer wiring board and sealing the plurality of components; a shield wall disposed within the sealing resin layer and between the predetermined components; and a surface layer conductor disposed between the upper surface of the multilayer wiring board and the shield wall so as to overlap the shield wall in a plan view of the multilayer wiring board. The shield wall is formed in a polyline shape having bent portions in the plan view, and has, at the bent portions, projection portions penetrating the surface layer conductor.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: July 9, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Issei Yamamoto, Takuya Murayama, Tadashi Nomura
  • Patent number: 10279660
    Abstract: A window cover for an automobile integrally includes: a front sheet to cover an outer surface of an automobile windshield; and a pair of side sheets to cover outer surfaces of left and right front door glasses, respectively. The side sheets are fixed to a vehicle body by a fixing device. The device includes a plate-shaped tab fixed to a rear edge of each side sheet. The tab is fixed by being inserted into a clearance between a rear edge of each of the front door glasses and a front edge of a rear door glass of a rear door placed rearward of the rear edge. Accordingly, convenience is improved because the cover can be easily attached to the vehicle body with the front and rear doors remaining closed, and workability is not deteriorated because the cover is not twisted or entwined when the front doors are opened or closed.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: May 7, 2019
    Assignee: HONDA ACCESS CORP.
    Inventors: Tadashi Nomura, Daisuke Watanabe
  • Patent number: 10098229
    Abstract: To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: October 9, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoichi Takagi, Tadashi Nomura, Masato Yoshida, Nobuaki Ogawa, Mitsuhiro Matsumoto
  • Publication number: 20180092201
    Abstract: A high-frequency module includes: a multilayer wiring board; a plurality of components mounted on an upper surface of the multilayer wiring board; a sealing resin layer laminated on the upper surface of the multilayer wiring board and sealing the plurality of components; a shield wall disposed within the sealing resin layer and between the predetermined components; and a surface layer conductor disposed between the upper surface of the multilayer wiring board and the shield wall so as to overlap the shield wall in a plan view of the multilayer wiring board. The shield wall is formed in a polyline shape having bent portions in the plan view, and has, at the bent portions, projection portions penetrating the surface layer conductor.
    Type: Application
    Filed: December 4, 2017
    Publication date: March 29, 2018
    Inventors: Yoshihito Otsubo, Issei Yamamoto, Takuya Murayama, Tadashi Nomura
  • Patent number: 9832871
    Abstract: A module having high reliability in terms of its connection to an external unit is provided. The module includes: a wiring substrate that mounts components and 3b thereon; a substrate electrode formed on one main surface of the wiring substrate; a columnar conductor connected at one end to the substrate electrode; an intermediate coating formed to cover an outer peripheral surface of the columnar conductor; and a first sealing resin layer provided to cover one main surface of the wiring substrate and the intermediate coating. The intermediate coating has a coefficient of linear expansion which is between that of the columnar conductor and that of the first sealing resin layer.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: November 28, 2017
    Assignee: MURATA MANUFACTURING CO, LTD.
    Inventors: Nobuaki Ogawa, Tadashi Nomura
  • Patent number: 9456503
    Abstract: An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: September 27, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tadashi Nomura, Akihiko Kamada
  • Patent number: 9293446
    Abstract: A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a module 100 by respectively mounting components such as a semiconductor substrate 104 and chip components 105 on the two main surfaces 101a and 101b of a wiring substrate 101, the low-profile module 100 can be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layer 102 formed by mounting only the semiconductor substrate 104 face down on one main surface 101a of the wiring substrate 101 so as to be smaller than the thickness of a second component layer 103 formed by mounting a plurality of chip components 105 on the other main surface 101b of the wiring substrate 101.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: March 22, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Mitsuhiro Matsumoto, Yoichi Takagi, Tadashi Nomura, Akihiko Kamada, Nobuaki Ogawa, Kensei Nishida
  • Publication number: 20160073499
    Abstract: A module having high reliability in terms of its connection to an external unit is provided. The module includes: a wiring substrate that mounts components and 3b thereon; a substrate electrode formed on one main surface of the wiring substrate; a columnar conductor connected at one end to the substrate electrode; an intermediate coating formed to cover an outer peripheral surface of the columnar conductor; and a first sealing resin layer provided to cover one main surface of the wiring substrate and the intermediate coating. The intermediate coating has a coefficient of linear expansion which is between that of the columnar conductor and that of the first sealing resin layer.
    Type: Application
    Filed: November 17, 2015
    Publication date: March 10, 2016
    Inventors: Nobuaki Ogawa, Tadashi Nomura
  • Publication number: 20150366063
    Abstract: To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.
    Type: Application
    Filed: August 21, 2015
    Publication date: December 17, 2015
    Inventors: Yoichi TAKAGI, Tadashi NOMURA, Masato YOSHIDA, Nobuaki OGAWA, Mitsuhiro MATSUMOTO
  • Patent number: 9137904
    Abstract: A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: September 15, 2015
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tadashi Nomura, Yoichi Takagi, Nobuaki Ogawa, Akihiko Kamada
  • Publication number: 20150179621
    Abstract: A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a module 100 by respectively mounting components such as a semiconductor substrate 104 and chip components 105 on the two main surfaces 101a and 101b of a wiring substrate 101, the low-profile module 100 can be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layer 102 formed by mounting only the semiconductor substrate 104 face down on one main surface 101a of the wiring substrate 101 so as to be smaller than the thickness of a second component layer 103 formed by mounting a plurality of chip components 105 on the other main surface 101b of the wiring substrate 101.
    Type: Application
    Filed: January 23, 2015
    Publication date: June 25, 2015
    Inventors: Mitsuhiro Matsumoto, Yoichi Takagi, Tadashi Nomura, Akihiko Kamada, Nobuaki Ogawa, Kensei Nishida
  • Patent number: 8944002
    Abstract: An infinitely variable physical vapor deposition matrix system that allows the synthesis of multiple combinatorial catalyst samples at essentially the same time, by the co-deposition of multiple materials, or the sequential layer by layer deposition of multiple catalyst constituents, or both, such that the optimum mix of materials for a pre-determined application can be experimentally determined in subsequent testing. The discovery of optimal catalyst combinations for utilization in specified reactions and devices is facilitated. The high throughput system reduces the time and complexity of processing typically required to formulate and test combinatorial catalyst materials.
    Type: Grant
    Filed: January 14, 2004
    Date of Patent: February 3, 2015
    Assignee: Honda Motor Co., Ltd.
    Inventors: Ting He, Eric R. Kreidler, Tadashi Nomura
  • Publication number: 20150013862
    Abstract: A window cover for an automobile integrally includes: a front sheet to cover an outer surface of an automobile windshield; and a pair of side sheets to cover outer surfaces of left and right front door glasses, respectively. The side sheets are fixed to a vehicle body by a fixing device. The device includes a plate-shaped tab fixed to a rear edge of each side sheet. The tab is fixed by being inserted into a clearance between a rear edge of each of the front door glasses and a front edge of a rear door glass of a rear door placed rearward of the rear edge. Accordingly, convenience is improved because the cover can be easily attached to the vehicle body with the front and rear doors remaining closed, and workability is not deteriorated because the cover is not twisted or entwined when the front doors are opened or closed.
    Type: Application
    Filed: June 23, 2014
    Publication date: January 15, 2015
    Applicant: HONDA ACCESS CORP.
    Inventors: Tadashi Nomura, Daisuke Watanabe
  • Publication number: 20140268587
    Abstract: An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Tadashi Nomura, Akihiko Kamada
  • Publication number: 20140262442
    Abstract: A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.
    Type: Application
    Filed: February 14, 2014
    Publication date: September 18, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Tadashi Nomura, Yoichi Takagi, Nobuaki Ogawa, Akihiko Kamada
  • Patent number: 8500330
    Abstract: A packaging bag is provided with a bag body and thermoplastic resin-made reinforcing members provided at the outer edge of the bag body. A window is provided in each reinforcing member. In forming the packaging bag, the bag body is placed between a pair of molds respectively having recesses to clamp these two molds so that a corresponding pair of the recesses are opposed to each other. Thereafter, in order to form the reinforcing members at the outer edge of the bag body, melted or softened thermoplastic resin is injected to fill cavities formed by the recesses of the thus clamped molds. Each of the cavities of the molds is formed so as to coincide with an outer shape of the corresponding reinforcing member. A projection extends from the bottom face of each recess at a part of the cavity corresponding to a part of each reinforcing member on which the window is provided.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: August 6, 2013
    Assignee: Oshio Industry Co., Ltd.
    Inventors: Tadashi Nomura, Masakazu Sato