Abstract: A polyurethane foam is obtained by reacting, foaming, and curing raw material that includes a polyol, a polyisocyanate, a blowing agent, a catalyst, and an inorganic compound hydrate. The raw material includes, as the polyol, a polymeric polyol obtained by graft polymerization of a vinyl monomer onto a polyether polyol and a polyether polyol obtained by addition polymerization of an alkylene oxide to a polyhydric alcohol and having a mass average molecular weight of 400 to 1,000. The blending quantity of the inorganic compound hydrate is 10 to 80 parts by mass per 100 parts by mass of the polyol. Preferably, the raw material further includes, as the polyol, a polyether polyol obtained by addition polymerization of an alkylene oxide to a polyhydric alcohol and has a molecular weight of 2,000 to 4,000.

Abstract: An inner rotor brushless motor is miniaturized, flattened and made lighter without reducing motor performance. A rotor and a stator are enclosed inside a sealed case (i.e., a sealed space) assembled by covering an attachment base with a cup-shaped bracket. A motor substrate on which a motor driving circuit is formed is provided in a gap formed in an axial direction between (i) the rotor and the stator and (ii) a base portion inside a bracket opening of the bracket.

Abstract: An LED lamp 100 includes: an LED chip 10; a phosphor resin portion 12 that covers the LED chip 10; and a light-transmissive member 20 that covers the phosphor resin portion 12. The phosphor resin portion 12 includes: a phosphor for converting the emission of the LED chip 10 into light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive member 20 includes an upper surface portion 22 located over the LED chip 10 and a side surface portion 24 located around and below the upper surface portion 22. At least a part (low-transmittance part 26) of the side surface portion 24 of the light-transmissive member 20 has lower transmittance than the upper surface portion 22.

Abstract: An LED lamp according to the present invention includes: at least one LED chip 12 that is mounted on a substrate 11; a phosphor resin portion 13 that covers the LED chip 12; a lens 22 to act on the outgoing light of the phosphor resin portion 13; and an optical diffusion layer (light-transmissive resin portion 20), which is arranged between the phosphor resin portion 13 and the lens 22 and in which particles to scatter the light are dispersed.

Abstract: In a light emitting apparatus that includes a plurality of semiconductor light emitting devices 2 each having a light emitting face covered with a phosphor layer 3, a semiconductor assembly obtained by assembling a submount and the semiconductor light emitting devices is mounted on the substrate. Accordingly, chromaticity characteristics of the semiconductor assembly can be measured before the semiconductor assembly is mounted on the substrate. Therefore, even if using a plurality of semiconductor light emitting devices, a semiconductor assembly can be prepared on which the semiconductor light emitting devices each having uniform chromaticity characteristics are mounted before the semiconductor assembly is mounted on the substrate. And, a light emitting apparatus having suppressed dispersion of chromaticity can be manufactured.

Abstract: An LED lamp includes at least one LED chip mounted on the principal surface of a substrate and an optical wavelength converting portion, which includes a phosphor for converting the emission of the LED chip into light having a longer wavelength than that of the emission and which covers at least a portion of the LED chip. The side surface of the optical wavelength converting portion has at least one concave curved surface portion.

Abstract: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: An LED lamp according to the present invention includes: at least one LED chip 12 that is mounted on a substrate 11; a phosphor resin portion 13 that covers the LED chip 12; a lens 22 to act on the outgoing light of the phosphor resin portion 13; and an optical diffusion layer (light-transmissive resin portion 20), which is arranged between the phosphor resin portion 13 and the lens 22 and in which particles to scatter the light are dispersed.

Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

Abstract: A luminescent light source includes: a light-emitting element (1); a substrate (2) including a conductor pattern (4); and a phosphor layer material (3) containing a phosphor and a light-transmitting base material. In the luminescent light source, the light-emitting element (1) is connected to a conductor pattern (4b), and the phosphor layer material (3) covers the light-emitting element (1). Further, at least the light-transmitting base material in the phosphor layer material (3) is disposed between the light-emitting element (1) and the substrate (2). Thus, a luminescent light source can be provided that allows a gap between a light-emitting element such as a LED bare chip or the like and a substrate to be eliminated, thereby obtaining output light with even chromaticity and achieving high luminous efficiency.

Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: An LED illumination source comprises a heat dissipating substrate which includes a metal plate and at least two insulating layers thereon. LEI) bare chips are mounted on a surface of the substrate. An optical reflector with holes surrounds the LED bare chips. The optical reflector is provided on the surface of the substrate on which the LED bare chips are mounted. A resin encapsulates the entire optical reflector on the substrate, the resin molding each of the LED bare chips and functioning as an optical lens for each of the LED bare chips.

Abstract: A cover layer 21 made of a first transparent resin is formed on outer peripheries of bulbs 25 of plural fluorescent lamps 20 of a backlight 10 for liquid crystal display. The fluorescent lamps 20 are enclosed in the holder member 22 made of a second transparent resin so as to be juxtaposed with each other. The first transparent resin has lower hardness than that of the second transparent resin so as to absorb stresses applied to the fluorescent lamp 20. The first transparent resin has greater heat resistance than that of the second transparent resin so as to suppress alternation such as yellowing due to heat generated by the fluorescent lamps 22.

Abstract: According to the present invention, a substrate 11, a cluster of LED chips, which are arranged two-dimensionally on the substrate 11, and a plurality of phosphor resin portions 13a, 13b that cover the respective LED chips are provided. The phosphor resin portion 13a, 13b includes a phosphor for transforming the emission of its associated LED chip into a light ray having a longer wavelength than that of the emission. A size of the phosphor resin portions 13b, which cover the LED chips located in an outer region of the cluster, is set bigger than that of the other phosphor resin portions 13a, which cover the LED chips located in the remaining non-outer region.

Abstract: An LED lamp includes: a substrate; a cluster of LEDs, which are arranged two-dimensionally on the substrate; and an interconnection circuit, which is electrically connected to the LEDs. The LEDs include a first group of LEDs, which are located around the outer periphery of the cluster, and a second group of LEDs, which are located elsewhere in the cluster. The interconnection circuit has an interconnection structure for separately supplying drive currents to at least one of the LEDs in the first group and to at least one of the LEDs in the second group separately from each other.

Abstract: An LED lamp 100 according to the present invention includes: a substrate 20 with an upper surface; a plurality of LED chips 10, which are arranged on the upper surface of the substrate 20; and a reflector 30, which has reflective surfaces that reflect emissions of the respective LED chips 10 at least partially. The reflector 30 includes a resin and a framework that is made of a material having a higher flexural rigidity than the resin.

Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: According to the present invention, a substrate 11, a cluster of LED chips, which are arranged two-dimensionally on the substrate 11, and a plurality of phosphor resin portions 13a, 13b that cover the respective LED chips are provided. The phosphor resin portion 13a, 13b includes a phosphor for transforming the emission of its associated LED chip into a light ray having a longer wavelength than that of the emission. A size of the phosphor resin portions 13b, which cover the LED chips located in an outer region of the cluster, is set bigger than that of the other phosphor resin portions 13a, which cover the LED chips located in the remaining non-outer region.

Abstract: An LED illumination source is disclosed. The illumination source includes a metal base substrate including a line pattern and an insulating layer including a composite material with an inorganic filler and a resin composition. LED bare chips are mounted on one surface of the metal base substrate An optical reflector with holes to surround the bare chips is provided on the surface of the metal base substrate on which the LED bare chips are mounted. Stress relaxing means is provided between the metal base substrate and the optical reflector.