Patents by Inventor Tae Hun Lee
Tae Hun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180225396Abstract: The present disclosure relates to an ensemble-based reservoir characterization method using multiple Kalman gains and dynamic data selection. The method includes preparing available data; generating initial ensembles by using the prepared static data; clustering and separating the generated initial models on the basis of a distance-based method; selecting the dynamic data; dynamically simulating the selected dynamic data by using the generated ensembles; calculating multiple Kalman gains by using initial models clustered in the same group as the selected dynamic data; updating ensemble members by means of the selected dynamic data and the multiple Kalman gains; and predicting a movement of a reservoir by using the updated models, and evaluating uncertainty thereof. Therefore, multiple Kalman gains are calculated and a final model is obtained using the selected dynamic data, and a reliable uncertainty evaluation and a future movement prediction can be performed within a short time by using the final model.Type: ApplicationFiled: March 6, 2017Publication date: August 9, 2018Applicant: Korea Institute Of Geoscience And Mineral ResourcesInventors: Kyung Book LEE, Jong Geun CHOE, Won Suk LEE, Hyun Suk LEE, Tae Woong AHN, Tae Hun LEE
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Patent number: 10036732Abstract: The present invention relates to an ultrasonic inspection device for small bore pipes comprising: a first arc-shaped frame part and a second arc-shaped frame part which surround the circumference of a pipe when combined with the pipe, and which have one side thereof rotationally connected to each other by means of a rotary connecting pin; an adjustment part that connects the other side of the first arc-shaped frame part and the other side of the second arc-shaped frame part to each other and is capable of adjusting the diameter of the bore formed by the first arc-shaped frame part and the second arc-shaped frame part according to the diameter of the pipe; a probe fixing part for fixing a probe to the first arc-shaped frame part such that the probe comes into contact with the surface of the pipe; an encoder part which is provided to the second arc-shaped frame part and maintains an encoder at a predetermined distance from the pipe; and a plurality of roller parts which are provided to the first arc-shaped framType: GrantFiled: August 19, 2014Date of Patent: July 31, 2018Assignee: Korea Hydro & Nuclear Power Co., Ltd.Inventors: Byoung Sik Yoon, Yong Sik Kim, Jeong Seok Lee, Tae Hun Lee
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Patent number: 9954940Abstract: A device for improving the use efficiency of a content delivery network (CDN) service and an operating method of a service distribution device are provided. The operating method includes receiving a service request signal from one or more electronic devices, determining an available domain for the service request signal based on the amount of idle traffic of one or more service domains in response to the reception of the service request signal, and transmitting a service response signal that includes the available domain information to the one or more electronic devices.Type: GrantFiled: November 25, 2015Date of Patent: April 24, 2018Assignee: Samsung Electronics Co., Ltd.Inventors: Kyoung-Heun Shin, Jae-Hyon Roh, Tae-Hun Lee
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Publication number: 20180062608Abstract: A bulk acoustic resonator includes: a substrate including an upper surface on which a substrate protection layer is disposed; and a membrane layer forming a cavity together with the substrate, wherein a thickness deviation of either one or both of the substrate protection layer and the membrane layer is 170 ? or less.Type: ApplicationFiled: July 12, 2017Publication date: March 1, 2018Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Kyung LEE, Tae Yoon KIM, Dae Ho KIM, Chang Hyun LIM, Tae Hun LEE, Sang Kee YOON, Jong Woon KIM, Won HAN, Moon Chul LEE
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Publication number: 20180048281Abstract: A bulk acoustic filter device includes: a substrate; a cavity forming layer disposed on the substrate so as to form a cavity; a lower electrode disposed on the cavity; a piezoelectric layer disposed on the lower electrode; an upper electrode disposed on the piezoelectric layer; and a temperature compensation layer disposed below the lower electrode and in the cavity portion.Type: ApplicationFiled: April 14, 2017Publication date: February 15, 2018Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Moon Chul LEE, Jae Chang LEE, Chang Hyun LIM, Tae Hun LEE, Tae Kyung LEE, Tae Yoon KIM
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Publication number: 20180019726Abstract: A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.Type: ApplicationFiled: June 30, 2017Publication date: January 18, 2018Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung HAN, Jae Chang LEE, Won HAN, Tae Yoon KIM, Jong Woon KIM, Tae Kyung LEE, Moon Chul LEE, Tae Hun LEE, Sung Min CHO, In Young KANG
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Publication number: 20180019725Abstract: A bulk acoustic wave filter device and method thereof includes a first layer forming an air gap together with a substrate, a lower electrode disposed over the first layer, a piezoelectric layer disposed to cover a portion of the lower electrode, an upper electrode disposed over the piezoelectric layer, a frame layer disposed below the upper electrode, and a lower electrode reinforcing layer disposed on the lower electrode, other than portions in which the piezoelectric layer is disposed. The lower electrode reinforcing layer is formed by separating the lower electrode reinforcing layer from the upper electrode or the frame layer upon one of the upper electrode and the frame layer being formed.Type: ApplicationFiled: June 15, 2017Publication date: January 18, 2018Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Hyun LIM, Han Tae KIM, Tae Hun LEE, Tae Kyung LEE, Tae Yoon Kim
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Publication number: 20180013401Abstract: An acoustic resonator including a substrate, an active vibration region including, sequentially stacked on the substrate, a lower electrode, a piezoelectric layer, and an upper electrode, and a horizontal resonance suppressing part formed from and disposed in the piezoelectric layer, the horizontal resonance suppressing part having piezoelectric physical properties that are different from piezoelectric physical properties of the piezoelectric layer.Type: ApplicationFiled: December 27, 2016Publication date: January 11, 2018Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hun LEE, Won HAN, Moon Chul LEE, Sung HAN
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Patent number: 9857258Abstract: A pressure sensor includes a sensor, an elastic support portion, a membrane, and a pressure detector. The sensor is accommodated in a frame of a base substrate. The elastic support portion is elastically connecting the sensor to the frame. The membrane is disposed on a surface of the sensor. The pressure detector is disposed on the membrane and configured to detect a variation in pressure based on a movement of the membrane.Type: GrantFiled: November 5, 2015Date of Patent: January 2, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hun Lee, Chang Hyun Lim, June Kyoo Lee, Dae Hun Jeong
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Publication number: 20170366156Abstract: An acoustic wave filter device includes a lower electrode disposed between a substrate and a piezoelectric layer, an upper electrode disposed on the piezoelectric layer, and an insulating layer disposed on the upper electrode. The insulating layer exposes portions of the upper electrode.Type: ApplicationFiled: December 20, 2016Publication date: December 21, 2017Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won HAN, Tae Hun LEE, Dae Hun JEONG, Moon Chul LEE, Sang Uk SON
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Publication number: 20170237409Abstract: An acoustic resonator includes: a substrate; a resonance part mounted on the substrate and including resonance part electrodes, the resonance part being configured to generate acoustic waves; a cavity disposed between the resonance part and the substrate; a frame part disposed on at least one electrode among the resonance part electrodes, and being configured to reflect the acoustic waves; and a connection electrode configured to connect the at least one electrode to an external electrode, and having a thickness less than a thickness of the at least one electrode.Type: ApplicationFiled: September 23, 2016Publication date: August 17, 2017Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Won HAN, Moon Chul LEE, Jae Chang LEE, Sang Uk SON, Tae Hun LEE
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Publication number: 20170179170Abstract: A pixel of a complementary metal-oxide-semiconductor (CMOS) image sensor includes a semiconductor substrate having a first surface and a third surface formed by removing part of the semiconductor substrate from a second surface, an active region which is formed between the first surface and the third surface and which contains a photoelectric conversion element generating charges in response to light incident on the substrate at the third surface, and a trench-type isolation region formed from either of the first and third surfaces to isolate the active region from an adjacent active region. The trench-type isolation region is filled with first material in a process that leaves a void in the material, the void is filled or partially filled with second material, and then a layer of third material is formed over the resulting structure composed of the first and second materials.Type: ApplicationFiled: March 2, 2017Publication date: June 22, 2017Inventors: YOUNG WOO CHUNG, TAE HUN LEE, HEE GEUN JEONG
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Publication number: 20170101307Abstract: There is provided a semiconductor package that comprises a board; a semiconductor chip disposed on the board and having an installation recess; an adhesive layer disposed within the installation recess; and a sensor unit disposed on the adhesive layer.Type: ApplicationFiled: June 14, 2016Publication date: April 13, 2017Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Hyun LIM, Tae Hun LEE, Dae Hun JEONG
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Patent number: 9620546Abstract: A pixel of a complementary metal-oxide-semiconductor (CMOS) image sensor includes a semiconductor substrate having a first surface and a third surface formed by removing part of the semiconductor substrate from a second surface, an active region which is formed between the first surface and the third surface and which contains a photoelectric conversion element generating charges in response to light incident on the substrate at the third surface, and a trench-type isolation region formed from either of the first and third surfaces to isolate the active region from an adjacent active region. The trench-type isolation region is filled with first material in a process that leaves a void in the material, the void is filled or partially filled with second material, and then a layer of third material is formed over the resulting structure composed of the first and second materials.Type: GrantFiled: September 17, 2015Date of Patent: April 11, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Young Woo Chung, Tae Hun Lee, Hee Geun Jeong
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Patent number: 9608024Abstract: An image sensor such as a complementary metal-oxide-semiconductor (CMOS) image sensor and a method of manufacturing the same are provided. The CMOS image sensor includes: a semiconductor substrate including a first surface and a third surface formed by removing a part of the semiconductor substrate from a second surface opposite to the first surface; a plurality of active regions which are formed between the first surface and the third surface and each of which includes a photoelectric conversion element generating charges in response to light input through the third surface; and an isolation region vertically formed from either of the first and third surfaces to isolate the active regions from one another. When the CMOS image sensor is viewed from the above of the third surface, each of the active regions may have round corners and concave sides.Type: GrantFiled: October 1, 2015Date of Patent: March 28, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seung Wook Lee, Yi Tae Kim, Jong Eun Park, Jung Chak Ahn, Kyung Ho Lee, Tae Hun Lee, Hee Geun Jeong
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Publication number: 20170003187Abstract: A pressure sensor element includes a die; a concave groove formed in one surface of the die; a partition wall formed in the concave groove to be spaced apart from side walls, the partition wall partitioning the concave groove into a trench and a cavity; and a membrane formed on the die and covering the concave groove.Type: ApplicationFiled: February 17, 2016Publication date: January 5, 2017Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chang Hyun LIM, Dae Hun JEONG, Tae Hun LEE
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Publication number: 20170001857Abstract: Provided are sensor elements and a method of manufacturing the same. The sensor element includes a die, an active part including a frame surrounded by the die, a first trench disposed between the die and the active part, and a bridge connecting the die and the frame and a second trench being formed in the bridge, whereby electrical connection from the active part to an electrode pad may be secured and transfer of external stress to the active part may be significantly reduced through the second trench.Type: ApplicationFiled: March 3, 2016Publication date: January 5, 2017Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Hun JEONG, Chang Hyun LIM, Tae Hun LEE
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Publication number: 20160313201Abstract: A pressure sensor package includes a substrate, a pressure sensor, and a semiconductor circuit. The semiconductor circuit is disposed on one surface of the substrate and having a reception space open to one surface of the substrate. A pressure sensor is connected to the substrate and disposed in the reception space.Type: ApplicationFiled: January 7, 2016Publication date: October 27, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hun LEE, Chang Hyun LIM, Dae Hun JEONG
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Publication number: 20160273985Abstract: A pressure sensor includes a sensor, an elastic support portion, a membrane, and a pressure detector. The sensor is accommodated in a frame of a base substrate. The elastic support portion is elastically connecting the sensor to the frame. The membrane is disposed on a surface of the sensor. The pressure detector is disposed on the membrane and configured to detect a variation in pressure based on a movement of the membrane.Type: ApplicationFiled: November 5, 2015Publication date: September 22, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hun LEE, Chang Hyun LIM, June Kyoo LEE, Dae Hun JEONG
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Publication number: 20160256960Abstract: A multi-functional apparatus for testing and etching a substrate capable of increasing spatial efficiency and manufacturing efficiency by performing testing and etching operations in a same chamber body and a substrate processing apparatus including the same, the multi-functional apparatus including a chamber body having an entrance into which the substrate is injected in one of its sides and an exit from which the substrate is ejected in another one of its sides; a transfer unit disposed inside of the chamber body and for transferring the injected substrate in a direction from the entrance to the exit; a laser etching unit disposed on an upper portion of the transfer unit and for etching a part of the substrate disposed on the transfer unit; and a testing unit for testing the substrate disposed on the transfer unit.Type: ApplicationFiled: May 16, 2016Publication date: September 8, 2016Inventors: Sung-Hwan Kim, Sang-Su Kim, Byoung-Seong Jeong, Je-Hyun Song, Tae-Hun Lee, Sung-Won Yang, Tae-Hyung Kim