Patents by Inventor Taei Uchida

Taei Uchida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYIMIDE FILM AND POLYIMIDE COMPOSITE SHEET
    Publication number: 20080038522
    Abstract: An aromatic polyimide film favorably employable for the chip-on-film (COF) system is composed of a polyimide derived from 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride and p-phenylenediamine and a powdery inorganic filler, in which the film has a thickness in the range of 25 to 35 ?m and does not have protrusions of 1 ?m or higher, and the filler has a mean diameter of less than 1 ?m.
    Type: Application
    Filed: October 15, 2007
    Publication date: February 14, 2008
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Kazuyuki HAMADA, Takashi AMANE, Yasuhiro NAGOSHI, Kazuhiro FUJIWARA, Kiyotaka KOBAYASHI, Taei UCHIDA, Norihisa KOMODA
  • Polyimide film and polyimide composite sheet
    Publication number: 20060068184
    Abstract: An aromatic polyimide film favorably employable for the chip-on-film (COF) system is composed of a polyimide derived from 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride and p-phenylenediamine and a powdery inorganic filler, in which the film has a thickness in the range of 25 to 35 ?m and does not have protrusions of 1 ?m or higher, and the filler has a mean diameter of less than 1 ?m.
    Type: Application
    Filed: September 29, 2005
    Publication date: March 30, 2006
    Applicant: Ube Industries, Ltd.
    Inventors: Kazuyuki Hamada, Takashi Amane, Yasuhiro Nagoshi, Kazuhiro Fujiwara, Kiyotaka Kobayashi, Taei Uchida, Norihisa Komoda