Abstract: A composite structure with an aluminum-based alloy layer containing boron carbide and a manufacturing method thereof are provided. The composite structure includes a substrate with an open hole in that surface and the aluminum-based alloy layer containing boron carbide. The aluminum-based alloy layer is disposed in the open hole and contains aluminum, boron, carbon, and oxygen, wherein the content of aluminum is between 4 at. % and 55 at. %, the content of boron is between 9 at. % and 32 at. %, the content of carbon is between 13 at. % and 32 at. %, the content of oxygen is between 2 at. % and 38 at. %, and the ratio of the content of boron to carbon is between 0.3 and 2.7.

Abstract: A composite structure with an aluminum-based alloy layer containing boron carbide and a manufacturing method thereof are provided. The composite structure includes a substrate with an open hole in that surface and the aluminum-based alloy layer containing boron carbide. The aluminum-based alloy layer is disposed in the open hole and contains aluminum, boron, carbon, and oxygen, wherein the content of aluminum is between 4 at. % and 55 at. %, the content of boron is between 9 at. % and 32 at. %, the content of carbon is between 13 at. % and 32 at. %, the content of oxygen is between 2 at. % and 38 at. %, and the ratio of the content of boron to carbon is between 0.3 and 2.7.

Abstract: A manufacturing method of the ESD protection device includes the following steps. A surface treatment is performed on the substrate. A link layer is formed on the substrate after the surface treatment, wherein a material of the link layer includes a metal material. A progressive layer is formed on the link layer, wherein a material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. A composite layer is formed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 to 1×108 ?/sq.

Abstract: A manufacturing method of the ESD protection device includes the following steps. A surface treatment is performed on the substrate. A link layer is formed on the substrate after the surface treatment, wherein a material of the link layer includes a metal material. A progressive layer is formed on the link layer, wherein a material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. A composite layer is formed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 to 1×108 ?/sq.

Abstract: A biodegradable iron-based alloy composition, a medical implant applying the iron-based alloy composition, and a manufacturing method of the medical implant are provided. The biodegradable iron-based alloy composition includes at least 98 wt % of iron and 2 wt % or less of an additional material. The additional material includes 0.1 wt %-0.8 wt % of Mn, 0.01 wt %-0.15 wt % of Mo, 0.1 wt %-0.3 wt % of Cr, 0.02 wt %-0.15 wt % of C, and 0.01 wt %-0.15 wt % of Si.

Abstract: An ESD protection composite structure includes a link layer, a progressive layer, and a composite layer. The link layer is used for disposing the ESD protection composite structure on a substrate, wherein a material of the link layer includes a metal material. The progressive layer is disposed on the link layer, wherein the material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. The composite layer is disposed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 ?/sq to 1×108 ?/sq.

Abstract: A surface-treated ceramic powder includes a plurality of ceramic particles and a surface-treating material. Each of the ceramic particles is at least partially coated by the surface-treating material, wherein the ceramic particles have an average particle diameter ranging from 10 micrometer (?m) to 100 ?m, and the surface-treating material is made of metal, metal oxide or the combination thereof.

Abstract: An ESD protection composite structure includes a link layer, a progressive layer, and a composite layer. The link layer is used for disposing the ESD protection composite structure on a substrate, wherein a material of the link layer includes a metal material. The progressive layer is disposed on the link layer, wherein the material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. The composite layer is disposed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 ?/sq to 1×108 ?/sq.

Abstract: A hydrophobic alloy film and a manufacturing method thereof are provided. The hydrophobic alloy film includes Al, Cu, O, and at least one selected from the group consisting of Fe, Co, Ni, and Cr, or Ti, Zr, O, and at least one selected from the group consisting of Fe, Co, Ni, and Cr. The content of each of Al and Ti is in the range of 40 at. % to 70 at. %. The content of each of Cu and Zr is in the range of 10 at. % to 40 at. %. The total content of at least one selected from the group consisting of Fe, Co, Ni, and Cr is in the range of 10 at. % to 30 at. %. The content of O is in the range of 10 at. % to 30 at. %. The hydrophobic alloy film has a quasicrystal structure and nanoparticles.

Abstract: An iron-based biodegradable component includes an iron element of 60 to 99.5 parts by weight and modifying material of 0.5 to 40 parts by weight, wherein the modifying material includes at least one of a zinc element of 0.1 to 5 parts by weight and a biodegradable ceramic material of 0.1 to 40 parts by weight.

Abstract: A metal/polymer composite material is disclosed, wherein the metal/polymer composite material comprises a polymer base and a metal heat-dissipation layer. The heat-dissipation layer comprises a roughed surface with an isotropic surface roughness. The metal heat-dissipation conformally blankets over the roughed surface.

Abstract: A surface-treated ceramic powder includes a plurality of ceramic particles and a surface-treating material. Each of the ceramic particles is at least partially coated by the surface-treating material, wherein the ceramic particles have an average particle diameter ranging from 10 micrometer (?m) to 100 ?m, and the surface-treating material is made of metal, metal oxide or the combination thereof.

Abstract: Disclosed is a shielding structure for an integrated inductor/transformer, configured under the integrated inductor or the transformer and upon a substrate. The shielding structure includes conductive units, first connecting portions, via holes, a second connecting portion and a grounding portion. Each conductive unit includes a first conductive portion and second conductive portions extending from the first conductive portion. The number of the second conductive portions is odd. The length of each second conductive portion progressively diminishes from a center of the first conductive portion to both of two ends of the first conductive portion. The first connecting portion connects the first conductive portions of the conductive units through via holes. The grounding portion is connected to one of the first conductive portions. The second connecting portion connects all longest second conductive portions together.

Abstract: A hydrophobic alloy film and a manufacturing method thereof are provided. The hydrophobic alloy film includes Al, Cu, O, and at least one selected from the group consisting of Fe, Co, Ni, and Cr, or Ti, Zr, O, and at least one selected from the group consisting of Fe, Co, Ni, and Cr. The content of each of Al and Ti is in the range of 40 at. % to 70 at. %. The content of each of Cu and Zr is in the range of 10 at. % to 40 at. %. The total content of at least one selected from the group consisting of Fe, Co, Ni, and Cr is in the range of 10 at. % to 30 at. %. The content of O is in the range of 10 at. % to 30 at. %. The hydrophobic alloy film has a quasicrystal structure and nanoparticles.

Abstract: Disclosed is a shielding structure for an integrated inductor/transformer, configured under the integrated inductor or the transformer and upon a substrate. The shielding structure comprises conductive units, first connecting portions, via holes, a second connecting portion and a grounding portion. Each conductive unit comprises a first conductive portion and second conductive portions extending from the first conductive portion. The number of the second conductive portions is odd. The length of each second conductive portion progressively diminishes from a center of the first conductive portion to both of two ends of the first conductive portion. The first connecting portion connects the first conductive portions of the conductive units through via holes. The grounding portion is connected to one of the first conductive portions. The second connecting portion connects all longest second conductive portions together.

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

Abstract: A metal/polymer composite material is disclosed, wherein the metal/polymer composite material comprises a polymer base and a metal heat-dissipation layer. The heat-dissipation layer comprises a roughed surface with an isotropic surface roughness. The metal heat-dissipation conformally blankets over the roughed surface.

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.