Patents by Inventor Taijiro MOMOSE

Taijiro MOMOSE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10410953
    Abstract: A power conversion device includes a semiconductor module with switching elements incorporated therein, a plurality of components electrically connected to the semiconductor module, and a laminated cooler provided with a plurality of cooling plates. A laminate is constituted by laminating at least the plurality of cooling plates and the semiconductor module, at least one among the plurality of cooling plates constituting the laminate is a large area cooling plate in which a projected area when viewed from the stacking direction is larger than the other cooling plates, and at least one of the components is a specific arrangement component which, when viewed from the stacking direction, is arranged in a specific position which overlaps the large area cooling plate, and, when viewed from a direction orthogonal to the stacking direction, overlaps with the laminate.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: September 10, 2019
    Assignee: DENSO CORPORATION
    Inventor: Taijiro Momose
  • Publication number: 20190182992
    Abstract: An electric power converter is provided which includes a stack body made of a stack of a plurality of electronic devices and cooling medium flow paths in which cooling medium flows. The electric power converter also includes a housing in which the stack body is disposed. The housing 3 has a stack facing wall which faces the stack body in a stacking direction. The stack facing wall has an in-wall flow path in which the cooling medium flows and which communicates the cooling medium flow paths. This structure enables the electric power converter to be reduced in size thereof.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 13, 2019
    Applicant: DENSO CORPORATION
    Inventors: Kazuya TAKEUCHI, Taijiro MOMOSE
  • Patent number: 10321611
    Abstract: A power conversion apparatus includes a semiconductor module, an electronic component, a cooling member, a casing and a pressurizing member. The electronic component includes a load application part that receives a load caused by pressurizing force on a surface in a pressurizing member side with respect to the lamination direction; a load supporting part that comes into contact with a contact part of the casing on a surface opposite to the pressurizing member side with respect to the lamination direction; and a fastening part fastened to a casing fastening part. The load supporting part is disposed between the load application part and the fastening part; moment of force around the load supporting part is produced in the electronic component by the load applied to the load application part; and the moment causes the electronic component to be pressed towards a pressed part of the casing.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: June 11, 2019
    Assignee: DENSO CORPORATION
    Inventors: Naoki Hirasawa, Ryota Tanabe, Taijiro Momose, Hiromi Ichijo
  • Publication number: 20180342959
    Abstract: An electrical power conversion apparatus includes a high-voltage bus bar, a low-voltage bus bar, and a relay bus bar which are integrated together in the form of a bus bar assembly. The high-voltage bus bar includes semiconductor-side high-voltage terminals and capacitor-side high-voltage terminals. The low-voltage bus bar includes semiconductor-side low-voltage terminals and capacitor-side low-voltage terminals. The relay bus bar includes a reactor-side relay terminal and a capacitor-side relay terminal 532. The capacitor-side high-voltage terminals, the capacitor-side low-voltage terminals, and the capacitor-side relay terminal are arranged in the form of a terminal array. The capacitor-side high-voltage terminals and the capacitor-side low-voltage terminals are arranged adjacent each other. The capacitor-side relay terminal is located at an end of an array of the capacitor-side high-voltage terminals and the capacitor-side low-voltage terminals.
    Type: Application
    Filed: May 29, 2018
    Publication date: November 29, 2018
    Applicant: DENSO CORPORATION
    Inventors: Naoki HIRASAWA, Ryota TANABE, Taijiro MOMOSE
  • Publication number: 20180332732
    Abstract: A power conversion apparatus includes a semiconductor module, an electronic component, a cooling member, a casing and a pressurizing member. The electronic component includes a load application part that receives a load caused by pressurizing force on a surface in a pressurizing member side with respect to the lamination direction; a load supporting part that comes into contact with a contact part of the casing on a surface opposite to the pressurizing member side with respect to the lamination direction; and a fastening part fastened to a casing fastening part. The load supporting part is disposed between the load application part and the fastening part; moment of force around the load supporting part is produced in the electronic component by the load applied to the load application part; and the moment causes the electronic component to be pressed towards a pressed part of the casing.
    Type: Application
    Filed: May 14, 2018
    Publication date: November 15, 2018
    Applicant: DENSO CORPORATION
    Inventors: Naoki HIRASAWA, Ryota TANABE, Taijiro MOMOSE, Hiromi ICHIJO
  • Publication number: 20180025961
    Abstract: A power conversion device includes a semiconductor module with switching elements incorporated therein, a plurality of components electrically connected to the semiconductor module, and a laminated cooler provided with a plurality of cooling plates. A laminate is constituted by laminating at least the plurality of cooling plates and the semiconductor module, at least one among the plurality of cooling plates constituting the laminate is a large area cooling plate in which s projected area when viewed from the stacking direction is larger than the other cooling plate, and at least one of the components is a specific arrangement component which, when viewed from the stacking direction, is arranged in a specific position which overlaps the large area cooling plate, and, when viewed from a direction orthogonal to the stacking direction, overlaps with the laminate.
    Type: Application
    Filed: July 20, 2017
    Publication date: January 25, 2018
    Applicant: DENSO CORPORATION
    Inventor: Taijiro MOMOSE