Patents by Inventor Taishi Uchida

Taishi Uchida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250018157
    Abstract: A catheter shape retainer includes a retainer main body inserted and disposed in an inner lumen of a catheter to retain a cylindrical shape of the catheter, and a movement restrictor disposed closer to a distal portion of the retainer main body than a proximal portion of the retainer main body to restrict the catheter from moving toward the proximal portion of the retainer main body. When a portion of the retainer main body including the distal portion of the retainer main body is inserted into a living body, a portion of the retainer main body located outside the living body has a length longer than a total length of a puncture device.
    Type: Application
    Filed: September 26, 2024
    Publication date: January 16, 2025
    Applicant: TERUMO KABUSHIKI KAISHA
    Inventors: Takashi KITAOKA, Taishi NIIMI, Takayuki UCHIDA, Yu OSAWA
  • Publication number: 20240392175
    Abstract: A two-component thermally conductive silicone composition long with methods of producing and uses for the same. Where the two-component thermally conductive silicone includes a first liquid containing (A) a diorganopolysiloxane having an alkenyl group bonded to a silicon atom, (D) an addition catalyst, (E) a thermally conductive filler, and (F) a condensation catalyst. Where the two-component thermally conductive silicone includes a second liquid containing (A) the diorganopolysiloxane having an alkenyl group bonded to a silicon atom, (B) a diorganopolysiloxane having a hydrogen atom bonded to a silicon atom, (C) at least one selected from (C-1) an organosilicon compound having two or more groups that are at least one selected from a methoxy group and an ethoxy group and not having a hydrocarbon group having 3 or more carbon atoms or a vinyl group, and (C-2) a hydrolysate of the organosilicon compound (C-1), and (E) the thermally conductive filler.
    Type: Application
    Filed: August 17, 2022
    Publication date: November 28, 2024
    Applicant: WACKER CHEMIE AG
    Inventors: Nazuna Terashita, Yukihiko Asakawa, Takashi Nakamura, Kazuya Sakai, Yusuke Suzuki, Taishi Uchida