Patents by Inventor Taiyun CHI

Taiyun CHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230158314
    Abstract: A method for minimally invasive deep brain simulation (DBS) involves obtaining a target location for the DBS, obtaining an anatomical model, and simulatively determining, for a set of antennas endocranially implanted at first positions and emitting electromagnetic waves differing by a frequency offset, a first envelope signal at the target location, using the anatomical model. The first envelope signal resulting from interference of the electromagnetic waves at the target location has an envelope signal frequency corresponding to the frequency offset.
    Type: Application
    Filed: November 1, 2022
    Publication date: May 25, 2023
    Applicant: William Marsh Rice University
    Inventors: Fatima Ahsan, Taiyun Chi, Raymond Cho, Sameer A. Sheth, Wayne Goodman, Behnaam Aazhang
  • Publication number: 20220264703
    Abstract: An microheater array system includes an integrated microheater array configured to generate a localized heat and having a plurality of pixels. Each pixel includes: an inductor; a stacked oscillator configured to generate a magnetic field at microwave frequencies with tunable intensity and frequency; and an electro-thermal loop. The microheater array system may further include a plurality of magnetic nanoparticles (MNPs).
    Type: Application
    Filed: February 14, 2022
    Publication date: August 18, 2022
    Inventors: Yingying Fan, Qingbo Zhang, Linlin Zhang, Gang Bao, Taiyun Chi
  • Patent number: 11296417
    Abstract: Reconfigurable antennas are provided. A reconfigurable antenna includes a plurality of antenna radiators and a plurality of feeds that are electrically or electromagnetically coupled to the plurality of antenna radiators. The plurality of feeds control current or voltage of the plurality of antenna radiators. Related methods of operating a reconfigurable antenna are also provided.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: April 5, 2022
    Assignee: Georgia Tech Research Corporation
    Inventors: Hua Wang, Taiyun Chi, Jongseok Park
  • Patent number: 11171682
    Abstract: According to one embodiment, an RF frontend IC device includes a first array of transceivers to transmit and receive RF signals of a first polarization associated with a first set of RF channels. The device includes a second array of transceivers to transmit and receive RF signals of a second polarization associated with a second set of RF channels. The device includes a first converter coupled to each transceiver of the first array of transceivers and a second converter coupled to each transceiver of the second array of transceivers. The first converter is to up-convert or down-convert a signal of the first polarization based on a LO signal. The second converter is to up-convert or down-convert a signal of the second polarization based on the LO signal. The first and second array of transceivers, and the first and second converters may be implemented within a single IC chip.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: November 9, 2021
    Assignees: SWIFTLINK TECHNOLOGIES INC., SWIFTLINK TECHNOLOGIES CO., LTD.
    Inventors: Taiyun Chi, Thomas Chen
  • Patent number: 10840959
    Abstract: According to one embodiment, a compact broadband radio frequency (RF) receiver circuit includes a low noise amplifier which includes a first amplifier stage, a second amplifier stage, an inter-stage network including a higher order filter network, where the inter-stage network is coupled between the first amplifier stage and the second amplifier stage, and a double resonance transformer network coupled to an output of the second amplifier stage. The RF receiver circuit includes a low pass filter and a mixer circuit coupled between the low noise amplifier and the low pass filter.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: November 17, 2020
    Assignees: SWIFTLINK TECHNOLOGIES INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Huy Thong Nguyen, Taiyun Chi, Min-Yu Huang, Hua Wang, Thomas Chen
  • Patent number: 10826457
    Abstract: According to one embodiment, a matching network circuit includes a first capacitor coupled, in parallel, to an input port of the matching network circuit; a broadband on-chip transformer coupled, in parallel, to the first capacitor, where the broadband on-chip transformer includes a primary winding and a secondary winding, where the secondary winding is a partial winding. The matching network circuit includes a second capacitor coupled, in series, in between the broadband on-chip transformer and an output port of the matching network circuit.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: November 3, 2020
    Assignees: SWIFTLINK TECHNOLOGIES INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Taiyun Chi, Hua Wang, Thomas Chen
  • Patent number: 10777891
    Abstract: According to one embodiment, an antenna includes multiple high-band (HB) radiation elements and a low-band (LB) radiation element. Each HB radiation element is configured to resonate or excite within a first frequency band to transmit and/or receive RF signals associated with the first frequency band. The LB band radiation element is configured to resonate or excite within a second frequency band to transmit and/or receive RF signals associated with the second frequency band. The HB radiation elements are arranged such that the distance between any two of the HB radiation elements is at least a half of a wavelength associated with the first frequency band. The LB radiation element is surrounded by the HB radiation element, for example, in a symmetrical manner.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: September 15, 2020
    Assignees: SWIFTLINK TECHNOLOGIES INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Hua Wang, Thomas Chen, Taiyun Chi
  • Patent number: 10778200
    Abstract: An RF frontend IC device includes an RF transceiver to transmit and receive RF signals and a frequency synthesizer to perform frequency synthetization to operate within a predetermined frequency band. The frequency synthesizer generates an LO signal to the RF transceiver to enable the RF transceiver to transmit and receive RF signals within the predetermined frequency band. The frequency synthesizer includes a QPG circuit to generate signals shifted in phases based on the LO signal and a phase shifting circuit to generate quadrant signals based on the signals shifted in phases. Each of the quadrant signals corresponds to one of the four quadrants in phases in the respective quadrant spaces. The phase shifting circuit includes multiple phase switches operable in a collaboration manner to further shift in phase based on the signal shifted in phases to generate the quadrant signals in proper quadrant spaces.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: September 15, 2020
    Assignee: SWIFTLINK TECHNOLOGIES INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Publication number: 20200274242
    Abstract: Reconfigurable antennas are provided. A reconfigurable antenna includes a plurality of antenna radiators and a plurality of feeds that are electrically or electromagnetically coupled to the plurality of antenna radiators. The plurality of feeds control current or voltage of the plurality of antenna radiators. Related methods of operating a reconfigurable antenna are also provided.
    Type: Application
    Filed: January 6, 2017
    Publication date: August 27, 2020
    Inventors: Hua Wang, Taiyun Chi, Jongseok Park
  • Publication number: 20200244302
    Abstract: According to one embodiment, an RF frontend IC device includes a first array of transceivers to transmit and receive RF signals of a first polarization associated with a first set of RF channels. The device includes a second array of transceivers to transmit and receive RF signals of a second polarization associated with a second set of RF channels. The device includes a first converter coupled to each transceiver of the first array of transceivers and a second converter coupled to each transceiver of the second array of transceivers. The first converter is to up-convert or down-convert a signal of the first polarization based on a LO signal. The second converter is to up-convert or down-convert a signal of the second polarization based on the LO signal. The first and second array of transceivers, and the first and second converters may be implemented within a single IC chip.
    Type: Application
    Filed: January 30, 2019
    Publication date: July 30, 2020
    Inventors: Taiyun CHI, Thomas CHEN
  • Patent number: 10707817
    Abstract: According to one embodiment, a low noise amplifier (LNA) circuit includes a first stage which includes: a first transistor; a second transistor coupled to the first transistor; a first inductor coupled in between an input port and a gate of the first transistor; and a second inductor coupled to a source of the first transistor, where the first inductor and the second inductor resonates with a gate capacitance of the first transistor for a dual-resonance. The LNA circuit includes a second stage including a third transistor; a fourth transistor coupled between the third transistor and an output port; and a passive network coupled to a gate of the third transistor. The LNA circuit includes a capacitor coupled in between the first and the second stages, where the capacitor transforms an impedance of the passive network to an optimal load for the first amplifier stage.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 7, 2020
    Assignees: SPEEDLINK TECHNOLOGY INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Min-Yu Huang, Hua Wang, Thomas Chen, Taiyun Chi
  • Patent number: 10553551
    Abstract: A flip chip IC device utilized in RF transceivers includes a bare die having a number of metalized pads and each metalized pad has a solder ball deposited thereon. The flip chip IC device further includes a substrate having a number of connector pads corresponding to the metalized pads. The connector pads are connected to one or more electronic components disposed on the substrate via a number of connector strips. The bare die is flipped up-side-down such that the metalized solder pads are aligned and connected with the connector pads of the substrate via the solder balls. At least one of the connector strips includes a strip section having an uneven strip width configured to compensate an impedance of a transmission line formed based on a connection between a metalized pad of the bare die and a connector pad of the substrate to match predetermined impedance.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: February 4, 2020
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Patent number: 10536182
    Abstract: A packaged integrated circuit device includes a transceiver with one or more oscillators therein. The oscillators can be configured as harmonic or fundamental-frequency oscillators for signal transmitting, or they can be configured as regenerative receivers for signal receiving. An antenna is provided in the package and, preferably, on the same chip IC chip as the transceiver. The antenna includes one or more feeds, which are coupled to the one or more oscillators. A dual-function varactor/envelope detector is provided, which is electrically coupled to the one or more oscillators. A control circuit is provided, which is configured to drive nodes of the transceiver and the dual-function varactor/envelope detector with a first plurality of reference voltages during operation of the transceiver as a radio transmitter (with varactor) and a second plurality of reference voltages during operation of the transceiver as a radio receiver (with envelope detector).
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: January 14, 2020
    Assignee: GEORGIA TECH RESEARCH CORPORATION
    Inventors: Hua Wang, Taiyun Chi, Min-Yu Huang
  • Publication number: 20190372533
    Abstract: According to one embodiment, a low noise amplifier (LNA) circuit includes a first stage which includes: a first transistor; a second transistor coupled to the first transistor; a first inductor coupled in between an input port and a gate of the first transistor; and a second inductor coupled to a source of the first transistor, where the first inductor and the second inductor resonates with a gate capacitance of the first transistor for a dual-resonance. The LNA circuit includes a second stage including a third transistor; a fourth transistor coupled between the third transistor and an output port; and a passive network coupled to a gate of the third transistor. The LNA circuit includes a capacitor coupled in between the first and the second stages, where the capacitor transforms an impedance of the passive network to an optimal load for the first amplifier stage.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 5, 2019
    Inventors: Min-Yu HUANG, Hua WANG, Thomas CHEN, Taiyun CHI
  • Publication number: 20190363702
    Abstract: An RF frontend IC device includes an RF transceiver to transmit and receive RF signals and a frequency synthesizer to perform frequency synthetization to operate within a predetermined frequency band. The frequency synthesizer generates an LO signal to the RF transceiver to enable the RF transceiver to transmit and receive RF signals within the predetermined frequency band. The frequency synthesizer includes a QPG circuit to generate signals shifted in phases based on the LO signal and a phase shifting circuit to generate quadrant signals based on the signals shifted in phases. Each of the quadrant signals corresponds to one of the four quadrants in phases in the respective quadrant spaces. The phase shifting circuit includes multiple phase switches operable in a collaboration manner to further shift in phase based on the signal shifted in phases to generate the quadrant signals in proper quadrant spaces.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 28, 2019
    Inventors: Che-Chun KUO, Taiyun CHI, Thomas CHEN
  • Publication number: 20190356362
    Abstract: According to one embodiment, a compact broadband radio frequency (RF) frontend circuit includes a number of single-channel transceivers, a number of analog to digital converters (ADCs), where each of the ADCs is coupled to one of the single-channel transceivers, a number of digital to analog converters (DACs), where each of the DACs is coupled to one of the single-channel transceivers, and a digital signal processing (DSP) unit coupled to the ADCs and the DACs. The DSP unit is configured to generate a first set of digital data streams simultaneously and each of the first set of digital data streams is converted by a respective one of the DACs into an analog data stream to be transmitted to a remote device by a respective one of the single-channel transceiver.
    Type: Application
    Filed: May 15, 2018
    Publication date: November 21, 2019
    Inventors: Taiyun CHI, Hua WANG, Thomas CHEN
  • Publication number: 20190356348
    Abstract: According to one embodiment, a compact broadband radio frequency (RF) receiver circuit includes a low noise amplifier which includes a first amplifier stage, a second amplifier stage, an inter-stage network including a higher order filter network, where the inter-stage network is coupled between the first amplifier stage and the second amplifier stage, and a double resonance transformer network coupled to an output of the second amplifier stage. The RF receiver circuit includes a low pass filter and a mixer circuit coupled between the low noise amplifier and the low pass filter.
    Type: Application
    Filed: May 15, 2018
    Publication date: November 21, 2019
    Inventors: Huy Thong NGUYEN, Taiyun CHI, Min-Yu HUANG, Hua WANG, Thomas CHEN
  • Publication number: 20190348379
    Abstract: A flip chip IC device utilized in RF transceivers includes a bare die having a number of metalized pads and each metalized pad has a solder ball deposited thereon. The flip chip IC device further includes a substrate having a number of connector pads corresponding to the metalized pads. The connector pads are connected to one or more electronic components disposed on the substrate via a number of connector strips. The bare die is flipped up-side-down such that the metalized solder pads are aligned and connected with the connector pads of the substrate via the solder balls. At least one of the connector strips includes a strip section having an uneven strip width configured to compensate an impedance of a transmission line formed based on a connection between a metalized pad of the bare die and a connector pad of the substrate to match predetermined impedance.
    Type: Application
    Filed: May 8, 2018
    Publication date: November 14, 2019
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Patent number: 10476533
    Abstract: According to one embodiment, a transmit/receive (T/R) switch includes a transmit switch, between a transmit port and an antenna port, a receive switch, between a receive port and the antenna port, a transmit inductor, coupled in parallel between the transmit switch the transmit port, and a receive inductor, coupled in parallel between the transmit switch the transmit port. The T/R switch can be co-designed with a power amplifier (PA) output matching circuit.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 12, 2019
    Assignees: SPEEDLINK TECHNOLOGY INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Taiyun Chi, Hua Wang, Thomas Chen
  • Publication number: 20190334560
    Abstract: According to one embodiment, a transmit/receive (T/R) switch includes a transmit switch, between a transmit port and an antenna port, a receive switch, between a receive port and the antenna port, a transmit inductor, coupled in parallel between the transmit switch the transmit port, and a receive inductor, coupled in parallel between the transmit switch the transmit port. The T/R switch can be co-designed with a power amplifier (PA) output matching circuit.
    Type: Application
    Filed: April 27, 2018
    Publication date: October 31, 2019
    Inventors: Taiyun Chi, Hua Wang, Thomas Chen