Patents by Inventor Takaaki Hirai

Takaaki Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190179296
    Abstract: A time-series data processing device (10) includes: a protruding data extracting unit (2) for extracting, from time-series data (1) which is a sequence of values obtained from sequential observation with the elapse of time, protruding data including an ascending leg a value of which continuously rises with respect to time and a descending leg a value of which continuously drops with respect to time; an occurrence pattern defining unit (3) for defining an occurrence pattern of protruding data in the time-series data (1); and an occurrence pattern detecting unit (4) for detecting, as a segment (5), one or more pieces of protruding data matching the occurrence pattern defined by the occurrence pattern defining unit (3), from among a set of pieces of protruding data extracted by the protruding data extracting unit (2).
    Type: Application
    Filed: October 6, 2016
    Publication date: June 13, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Makoto IMAMURA, Takaaki NAKAMURA, Norio HIRAI
  • Patent number: 9870924
    Abstract: A diffusion agent composition used in forming an impurity diffusion agent layer on a semiconductor substrate, and containing an impurity diffusion component, a silicon compound, and a solvent containing a solvent having a boiling point of 100° C. or less, a solvent having a boiling point of 120-180° C., and a solvent having a boiling point of 300° C.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: January 16, 2018
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Atsushi Murota, Takaaki Hirai
  • Patent number: 9620367
    Abstract: A diffusion agent composition including an impurity-diffusing component (A); a binder resin (B) that thermally decomposes and disappears below a temperature at which the impurity-diffusing component (A) begins to thermally diffuse; SiO2 fine particles (C); and an organic solvent (D) that contains an organic solvent (D1) having a boiling point of at least 100° C.
    Type: Grant
    Filed: August 18, 2010
    Date of Patent: April 11, 2017
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takaaki Hirai, Atsushi Murota, Katsuya Tanitsu
  • Patent number: 8475690
    Abstract: An embodiment of the present invention relates to a diffusing agent composition used in printing an impurity-diffusing component onto a semiconductor substrate, wherein the diffusing agent composition contains: a hydrolysis product of alkoxysilane (A); a component (B) containing at least one selected from the group consisting of a hydrolysis product of alkoxy titanium, a hydrolysis product of alkoxy zirconium, titania fine particle, and zirconia fine particle; an impurity-diffusing component (C); and an organic solvent (D).
    Type: Grant
    Filed: October 4, 2010
    Date of Patent: July 2, 2013
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Takashi Kamizono, Toshiro Morita, Atsushi Murota, Motoki Takahashi, Katsuya Tanitsu, Takaaki Hirai
  • Publication number: 20130061922
    Abstract: A diffusion agent composition used in forming an impurity diffusion agent layer on a semiconductor substrate, and containing an impurity diffusion component, a silicon compound, and a solvent containing a solvent having a boiling point of 100° C. or less, a solvent having a boiling point of 120-180° C., and a solvent having a boiling point of 300° C.
    Type: Application
    Filed: April 12, 2011
    Publication date: March 14, 2013
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Atsushi Murota, Takaaki Hirai
  • Patent number: 8372938
    Abstract: A mask material composition that is used for diffusion barrier of an impurity diffusing component into a semiconductor substrate includes a siloxane resin (A1) containing a constituent unit represented by the following formula (a1): wherein R1 is a single bond or C1-C5 alkylene group; and R2 is a C6-C20 aryl group.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: February 12, 2013
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Motoki Takahashi, Toshiro Morita, Takaaki Hirai
  • Patent number: 8372512
    Abstract: The present invention provides a method for producing polylactic acid-based resin foamed particles for in-mold foam-molding from which a polylactic acid-based resin foam-molded article excellent in heat resistance and mechanical strength can be obtained by in-mold foam-molding. In the method of the present invention for producing polylactic acid-based resin foamed particles for in-mold foam-molding, a rotary blade is rotated at a given rotation speed while being always in contact with the front end surface of a nozzle and a polylactic acid-based resin extrudate extrusion-foamed through a nozzle is cut with the rotary blade, so that it is possible to cut the polylactic acid-based resin extrudate surely to obtain substantially spherical polylactic acid-based resin foamed particles.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: February 12, 2013
    Assignee: Sekisui Plastics Co., Ltd.
    Inventors: Takaaki Hirai, Katsunori Nishijima, Tetsuya Ochiai
  • Publication number: 20120160306
    Abstract: A diffusion agent composition including an impurity-diffusing component (A); a binder resin (B) that thermally decomposes and disappears below a temperature at which the impurity-diffusing component (A) begins to thermally diffuse; SiO2 fine particles (C); and an organic solvent (D) that contains an organic solvent (D1) having a boiling point of at least 100° C.
    Type: Application
    Filed: August 18, 2010
    Publication date: June 28, 2012
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takaaki Hirai, Atsushi Murota, Katsuya Tanitsu
  • Patent number: 8076054
    Abstract: A composition for forming an adhesive layer which results in strong adhesion force between a substrate and a photosensitive resin layer, and which does not cause transfer of the constituting components to the substrate, a relief printing plate using the same, and a method for manufacturing a relief printing plate are provided. The composition of the present invention comprises (a) a carboxyl group-containing polymer, and (b) an oxazoline group-containing polymer. Adhesive layer 20 formed using the composition of the present invention can be preferably used as an adhesive layer that adheres between substrate 10 and photosensitive resin layer 30 in a relief printing plate.
    Type: Grant
    Filed: February 19, 2007
    Date of Patent: December 13, 2011
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Yoshiaki Katayose, Takaaki Hirai, Syunji Nakazato
  • Publication number: 20110108095
    Abstract: A mask material composition that is used for diffusion barrier of an impurity diffusing component into a semiconductor substrate includes a siloxane resin (A1) containing a constituent unit represented by the following formula (a1): wherein R1 is a single bond or C1-C5 alkylene group; and R2 is a C6-C20 aryl group.
    Type: Application
    Filed: November 4, 2010
    Publication date: May 12, 2011
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Motoki TAKAHASHI, Toshiro MORITA, Takaaki HIRAI
  • Publication number: 20110079262
    Abstract: An embodiment of the present invention relates to a diffusing agent composition used in printing an impurity-diffusing component onto a semiconductor substrate, wherein the diffusing agent composition contains: a hydrolysis product of alkoxysilane (A); a component (B) containing at least one selected from the group consisting of a hydrolysis product of alkoxy titanium, a hydrolysis product of alkoxy zirconium, titania fine particle, and zirconia fine particle; an impurity-diffusing component (C); and an organic solvent (D).
    Type: Application
    Filed: October 4, 2010
    Publication date: April 7, 2011
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takashi KAMIZONO, Toshiro MORITA, Atsushi MUROTA, Motoki TAKAHASHI, Katsuya TANITSU, Takaaki HIRAI
  • Publication number: 20100175744
    Abstract: A diffusing agent composition is used for ink-jet printing and contains a P-type impurity-diffusing component (A), a water-soluble polymer compound (B) having an alcoholic hydroxyl group, and a solvent (C) containing an organic solvent having a surface tension of at most about 30 mN/m.
    Type: Application
    Filed: January 4, 2010
    Publication date: July 15, 2010
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takaaki Hirai, Katsuya Tanitsu
  • Publication number: 20100136338
    Abstract: The present invention provides a method for producing polylactic acid-based resin foamed particles for in-mold foam-molding from which a polylactic acid-based resin foam-molded article excellent in heat resistance and mechanical strength can be obtained by in-mold foam-molding. In the method of the present invention for producing polylactic acid-based resin foamed particles for in-mold foam-molding, a rotary blade is rotated at a given rotation speed while being always in contact with the front end surface of a nozzle and a polylactic acid-based resin extrudate extrusion-foamed through a nozzle is cut with the rotary blade, so that it is possible to cut the polylactic acid-based resin extrudate surely to obtain substantially spherical polylactic acid-based resin foamed particles.
    Type: Application
    Filed: March 27, 2008
    Publication date: June 3, 2010
    Inventors: Takaaki Hirai, Katsunori Nishijima, Tetsuya Ochiai
  • Publication number: 20070248909
    Abstract: The present invention provides a photosensitive composition for use in producing a printing plate, and a photosensitive printing original plate laminate and a printing plate using the photosensitive composition, having durability to various types of printing inks and having excellent printability. The photosensitive composition includes at least a binder resin, a photopolymerizable monomer and a photopolymerization initiator, wherein a combination of an elastomer resin and a terpene resin is used as the binder resin. By using the elastomer resin and the terpene resin in combination, the resultant photosensitive composition has a remarkably improved durability to various types of printing inks, especially to ink components contained in such as UV curing ink or oil-based ink, or to printing inks such as alignment layer solution.
    Type: Application
    Filed: June 14, 2005
    Publication date: October 25, 2007
    Inventors: Toshiya Takagi, Takaaki Hirai
  • Publication number: 20070243486
    Abstract: A composition for forming an adhesive layer which results in strong adhesion force between a substrate and a photosensitive resin layer, and which does not cause transfer of the constituting components to the substrate, a relief printing plate using the same, and a method for manufacturing a relief printing plate are provided. The composition of the present invention comprises (a) a carboxyl group-containing polymer, and (b) an oxazoline group-containing polymer. Adhesive layer 20 formed using the composition of the present invention can be preferably used as an adhesive layer that adheres between substrate 10 and photosensitive resin layer 30 in a relief printing plate.
    Type: Application
    Filed: February 19, 2007
    Publication date: October 18, 2007
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yoshiaki Katayose, Takaaki Hirai, Syunji Nakazato
  • Publication number: 20070065751
    Abstract: A water-soluble photopolymer composition for flexographic printing is provided which can be water developed and can form a photosensitive original printing plate for flexographic printing having a good flexibility and impact resilience as well as an adequate Shore hardness value. The water-soluble photopolymer composition for flexographic printing contains a water-soluble resin component (A), a photopolymerizable monomer (B) and a photopolymerization initiator (C), in which the water-soluble resin component (A) includes a first partially saponified polyvinyl acetate having a saponification degree ranging from 20 to 70 mole % (A1) and a second partially saponified polyvinyl acetate having a saponification degree ranging from 70 to 95 mole % (A2).
    Type: Application
    Filed: September 14, 2006
    Publication date: March 22, 2007
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Yoshiaki Katayose, Takaaki Hirai
  • Publication number: 20030155063
    Abstract: A thermoplastic polyester resin is fed into a twin extruder, wherein a resin is heated for melting, thereby removing moisture in the resin by evacuating and sucking from a vent port thereof, injecting a foaming agent into the resin to which is pushed out as a foaming sheet and, after that, forming the foaming sheet which is divided into a forming body and a trimming loss, whereby the trimming loss is crushed to obtain crushed materials which are provided so as to put the materials into the twin extruder as collection materials and recycle them.
    Type: Application
    Filed: February 4, 2003
    Publication date: August 21, 2003
    Inventors: Susumu Ishiwatari, Masahiro Tsubone, Takaaki Hirai, Masahiro Shindo, Kiyoshi Yoshioka, Nobuyuki Tsujiwaki
  • Patent number: 6537404
    Abstract: A thermoplastic polyester resin is fed into a twin extruder, wherein a resin is heated for melting, thereby removing moisture in the resin by evacuating and sucking from a vent port thereof, injecting a foaming agent into the resin to which is pushed out as a foaming sheet and, after that, forming the foaming sheet which is divided into a forming body and a trimming loss, whereby the trimming loss is crushed to obtain crushed materials which are provided so as to put the materials into the twin extruder as collection materials and recycle them.
    Type: Grant
    Filed: February 22, 1999
    Date of Patent: March 25, 2003
    Assignee: Sekisui Kaseihin Kogyo Kabushiki Kaisha
    Inventors: Susumu Ishiwatari, Masahiro Tsubone, Takaaki Hirai, Masahiro Shindo, Kiyoshi Yoshioka, Nobuyuki Tsujiwaki
  • Patent number: 6527993
    Abstract: The present invention provides a process for producing a molded foam article of a crystalline aromatic polyester resin. The process is characterized by heating the surface temperature of a mold for cavity-molding to the temperature within a range of from (td+35) to (Tg+57)°C. (Tg is a glass transition temperature of the crystalline aromatic polyester resin prepuffs), thereby to mold prepuffs, and cooling the surface of the mold to a temperature not lowered than Tg for at least 20 seconds.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: March 4, 2003
    Assignee: Sekisui Plastics Co., Ltd.
    Inventors: Takaaki Hirai, Minoru Fujishima, Hiroyuki Ueno, Hideyasu Matsumura, Ikuo Morioka, Yukio Aramomi, Hiroyuki Yamagata
  • Patent number: 6254977
    Abstract: A thermoplastic polyester resin is fed into a twin extruder, wherein a resin is heated for melting, thereby removing moisture in the resin by evacuating and sucking from a vent port thereof, injecting a foaming agent into the resin to which is pushed out as a foaming sheet and, after that, forming the foaming sheet which is divided into a forming body and a trimming loss, whereby the trimming loss is crushed to obtain crushed materials which are provided so as to put the materials into the twin extruder as collection materials and recycle them.
    Type: Grant
    Filed: October 5, 1998
    Date of Patent: July 3, 2001
    Assignee: Sekisui Kaseihin Kogyo Kabushiki Kaisha
    Inventors: Susumu Ishiwatari, Masahiro Tsubone, Takaaki Hirai, Masahiro Shindo, Kiyoshi Yoshioka, Nobuyuki Tsujiwaki