Abstract: A cultivation support system for supporting cultivation of a plant includes a growth information acquisition unit configured to acquire information on the growing condition of the plant, a growing condition evaluation unit configured to evaluate the growing condition of the plant on a scale of levels, a work content determination unit configured to determine optimum cultivation work for the growing condition of the plant, a work instruction information creation unit configured to create work instruction information indicating work to be performed by a person engaged in the cultivation of the plant, based on the cultivation work determined by the work content determination unit, and an output unit configured to output the work instruction information created by the work instruction information creation unit.

Abstract: A plant biosensor includes a solar radiation sensor that measures a solar radiation amount with which the plant is irradiated, a sap flow sensor that measures a flow rate of sap flowing in a body of the plant, and an absorbed nutrient sensor that measures a nutritional state of the plant.

Abstract: The technique includes: a plan determination device (3) that determines a cultivation plan of a plant; an environment/work controller (4) that controls an ambient environment of the plant and that gives a worker a work instruction; and a management execution device (2) that controls a relationship between a planned index value related to the cultivation plan and an actual index value of the cultivation of the plant. The management execution device gives achievement/prediction information on the index value and work content information to the plan determination device, obtains index value plan information from the plan determination device, gives change information on a work content and a control plan of the plant ambient environment to the environment/work controller, and obtains actual work content information, record information on the index value of the plant and plant ambient environment, and environment/biological body record information from the environment/work controller.

Abstract: A method for bonding wafers includes forming a first bonding part on a surface of a first wafer by stacking a diffusion preventing layer formed of a material having low wettability with AuSn above the first wafer and forming a bonding layer on a surface of the diffusion preventing layer such that the bonding layer stays back of an edge of the diffusion preventing layer, forming a second bonding part on a surface of a second wafer, and bonding the first bonding part and the second bonding part by eutectic bonding with an AuSn solder under a condition that the first wafer and the second wafer are opposed to each other.

Abstract: According to an aspect, a device includes a touch screen display and a controller. The touch screen display displays a screen of an application executed in the foreground. When the first gesture is performed on the touch screen display while a first application is executed in the foreground and a second application is executed in the background, the controller causes the first application to perform an operation according to the first gesture. When the second gesture is performed on the touch screen display while the first application is executed in the foreground and the second application is executed in the background, the controller executes the second application in the foreground.

Abstract: A method for bonding wafers includes forming a first bonding part on a surface of a first wafer by stacking a diffusion preventing layer formed of a material having low wettability with AuSn above the first wafer and forming a bonding layer on a surface of the diffusion preventing layer such that the bonding layer stays back of an edge of the diffusion preventing layer, forming a second bonding part on a surface of a second wafer, and bonding the first bonding part and the second bonding part by eutectic bonding with an AuSn solder under a condition that the first wafer and the second wafer are opposed to each other.

Abstract: According to an aspect, a device includes a touch screen display and a controller. The touch screen display displays a screen of an application executed in the foreground. When the first gesture is performed on the touch screen display while a first application is executed in the foreground and a second application is executed in the background, the controller causes the first application to perform an operation according to the first gesture. When the second gesture is performed on the touch screen display while the first application is executed in the foreground and the second application is executed in the background, the controller executes the second application in the foreground.

Abstract: An electrode structure has a Cu electrode that provided in a surface of a substrate, a diffusion preventing film that is made of a material in which a diffusion coefficient of Sn is equal to or lower than 3×10?23 cm2/sec, the whole Cu electrode being covered with the diffusion preventing film, and a solder layer that is provided above the diffusion preventing film, the solder layer being made of Au—Sn solder.

Abstract: In an electrode portion structure in which an electrode is formed in an end portion of a through-wiring, disconnection is prevented in an electrode portion. A through-hole that vertically pierces a substrate is made in the substrate, and a through-electrode is provided in the through-hole. The through-electrode is projected in s curved-surface manner from an upper surface of the substrate. The upper surface of the substrate 12 is coated with an insulating film, and a contact hole is made in the insulating film while aligned with the through-electrode. An opening diameter of the contact hole is lower than a sectional diameter of the through-electrode, and surroundings of an upper surface of the through-electrode are coated with the contact hole. A thickness Ddiel of the insulating film is equal to or lower than a projection length Dp of the through-electrode from the upper surface of the substrate at an opening edge of the contact hole.