Patents by Inventor Takaaki Morita

Takaaki Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084091
    Abstract: An object is to provide a porous film which has excellent removal performance of viruses and the like and a long lifetime, a virus removal method which uses the porous film as a filter, a method for producing a virus-free product which uses the porous film as a filter and a device which includes the porous film as a filter. In a porous film including a structure of spherical pores communicating with each other, an interconnected pore is an opening of the spherical pores communicating with each other, and the pore diameter of the interconnected pore is set to 10 nm or more and 35 nm or less, and the number of spherical pores which are present between one surface of the porous film and the other surface thereof and are 50 nm or more and 200 nm or less is set to 200 or more and 1000 or less.
    Type: Application
    Filed: August 18, 2023
    Publication date: March 14, 2024
    Inventor: Takaaki MORITA
  • Publication number: 20230335965
    Abstract: Disclosed is a laser device including: a rod-shaped laser medium extending in a first direction; a first light source unit including a first base having a first notch through which the laser medium passes and a plurality of excitation light sources attached to the first base; and a holder supporting the laser medium and the first light source unit. At least one of the first base and the holder includes a first regulating part configured to regulate a position of the first base with respect to the holder.
    Type: Application
    Filed: August 19, 2021
    Publication date: October 19, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takuto IGUCHI, Yoshinori KATO, Takaaki MORITA, Kazuki KAWAI
  • Publication number: 20230318245
    Abstract: Disclosed is a laser device includes: a rod-shaped laser medium extending in a first direction; a first light source unit including a first base and a plurality of excitation light sources; a second light source unit arranged side by side with the first light source unit in a second direction intersecting with the first direction, the second light source unit including a second base and a plurality of excitation light sources; and a holder supporting the laser medium, the first light source unit, and the second light source unit. At least one of the first base and the holder includes a first regulating part configured to regulate a position of the first base with respect to the holder, and at least one of the second base and the holder includes a second regulating part configured to regulate a position of the second base with respect to the holder.
    Type: Application
    Filed: August 19, 2021
    Publication date: October 5, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takuto IGUCHI, Yoshinori KATO, Takaaki MORITA, Kazuki KAWAI
  • Patent number: 11546989
    Abstract: A multilayer board insulating sheet contains a reducing agent.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: January 3, 2023
    Assignee: TDK CORPORATION
    Inventors: Seiko Komatsu, Takaaki Morita, Seiichi Tajima
  • Patent number: 11445605
    Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: September 13, 2022
    Assignee: TDK CORPORATION
    Inventors: Takaaki Morita, Seiko Komatsu, Seiichi Tajima, Wakiko Sato
  • Patent number: 11412621
    Abstract: A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: August 9, 2022
    Assignee: TDK CORPORATION
    Inventors: Takaaki Morita, Seiichi Tajima, Takashi Kariya
  • Patent number: 11382218
    Abstract: In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: July 5, 2022
    Assignee: TDK CORPORATION
    Inventors: Takaaki Morita, Seiichi Tajima, Takashi Kariya
  • Patent number: 11335614
    Abstract: In an electric component embedded structure, a first electrode terminal provided on a first main surface includes an intra-area terminal, and the intra-area terminal is electrically connected to an overlap portion of an overlap wiring in a formation area of an electric component. Accordingly, a decrease in mounting area of the electric component embedded structure is achieved. The intra-area terminal can be electrically connected to a second electrode terminal provided on a second main surface via a first via-conductor, the overlap wiring, and a second via-conductor. The intra-area terminal is connected to a wiring (an overlap wiring) of a first insulating layer without additionally providing a rewiring layer causing an increase in thickness, and the increase in thickness is curbed, whereby a decrease in size of the electric component embedded structure is achieved.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: May 17, 2022
    Assignee: TDK CORPORATION
    Inventors: Takaaki Morita, Kenichi Yoshida, Mitsuhiro Tomikawa
  • Patent number: 11114810
    Abstract: A laser device includes a first laser medium and a second laser medium that have a first surface and a second surface opposite to the first surface, and receive input of excitation light and seed light from the first surface side to amplify the seed light, a holder that holds the first laser medium and the second laser medium; and a pair of cooling units that cool the first laser medium and the second laser medium according to change in volume of a refrigerant.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: September 7, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Koichi Iyama, Yasuki Takeuchi, Yuma Hatano, Takaaki Morita, Takuto Iguchi, Yoshinori Kato, Takashi Sekine
  • Publication number: 20210057296
    Abstract: In an electric component embedded structure, a first electrode terminal provided on a first main surface includes an intra-area terminal, and the intra-area terminal is electrically connected to an overlap portion of an overlap wiring in a formation area of an electric component. Accordingly, a decrease in mounting area of the electric component embedded structure is achieved. The intra-area terminal can be electrically connected to a second electrode terminal provided on a second main surface via a first via-conductor, the overlap wiring, and a second via-conductor. The intra-area terminal is connected to a wiring (an overlap wiring) of a first insulating layer without additionally providing a rewiring layer causing an increase in thickness, and the increase in thickness is curbed, whereby a decrease in size of the electric component embedded structure is achieved.
    Type: Application
    Filed: October 25, 2018
    Publication date: February 25, 2021
    Applicant: TDK CORPORATION
    Inventors: Takaaki MORITA, Kenichi YOSHIDA, Mitsuhiro TOMIKAWA
  • Patent number: 10905013
    Abstract: In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: January 26, 2021
    Assignee: TDK CORPORATION
    Inventors: Takaaki Morita, Seiichi Tajima, Takashi Kariya
  • Publication number: 20210014966
    Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.
    Type: Application
    Filed: June 30, 2020
    Publication date: January 14, 2021
    Applicant: TDK CORPORATION
    Inventors: Takaaki MORITA, Seiko KOMATSU, Seiichi TAJIMA, Wakiko SATO
  • Publication number: 20200315008
    Abstract: A multilayer board insulating sheet contains a reducing agent.
    Type: Application
    Filed: March 9, 2020
    Publication date: October 1, 2020
    Applicant: TDK CORPORATION
    Inventors: Seiko KOMATSU, Takaaki MORITA, Seiichi TAJIMA
  • Publication number: 20200315034
    Abstract: A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.
    Type: Application
    Filed: March 9, 2020
    Publication date: October 1, 2020
    Applicant: TDK CORPORATION
    Inventors: Takaaki MORITA, Seiichi TAJIMA, Takashi KARIYA
  • Publication number: 20190373739
    Abstract: In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.
    Type: Application
    Filed: May 24, 2019
    Publication date: December 5, 2019
    Applicant: TDK CORPORATION
    Inventors: Takaaki MORITA, Seiichi TAJIMA, Takashi KARIYA
  • Publication number: 20190373742
    Abstract: In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.
    Type: Application
    Filed: May 24, 2019
    Publication date: December 5, 2019
    Applicant: TDK CORPORATION
    Inventors: Takaaki Morita, Seiichi Tajima, Takashi Kariya
  • Publication number: 20190372296
    Abstract: A laser device includes a first laser medium and a second laser medium that have a first surface and a second surface opposite to the first surface, and receive input of excitation light and seed light from the first surface side to amplify the seed light, a holder that holds the first laser medium and the second laser medium; and a pair of cooling units that cool the first laser medium and the second laser medium according to change in volume of a refrigerant.
    Type: Application
    Filed: May 29, 2019
    Publication date: December 5, 2019
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Koichi IYAMA, Yasuki TAKEUCHI, Yuma HATANO, Takaaki MORITA, Takuto IGUCHI, Yoshinori KATO, Takashi SEKINE
  • Patent number: 10374377
    Abstract: A plate-like laser medium has a through-hole for providing a flow of a cooling medium. The laser medium unit includes the plurality of laser media. A laser beam amplification device includes a laser medium unit 10, an excitation light source 21 that causes excitation light to enter the laser medium unit 10, a through-hole 16a of a window member as a unit for supplying the cooling medium in a through-hole 14a of the laser medium 14, and a cooling medium flow path F1 arranged around the laser medium unit 10.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: August 6, 2019
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi Sekine, Yoshinori Kato, Yoshinori Tamaoki, Takashi Kurita, Toshiyuki Kawashima, Takaaki Morita
  • Publication number: 20180278007
    Abstract: A plate-like laser medium has a through-hole for providing a flow of a cooling medium. The laser medium unit includes the plurality of laser media. A laser beam amplification device includes a laser medium unit 10, an excitation light source 21 that causes excitation light to enter the laser medium unit 10, a through-hole 16a of a window member as a unit for supplying the cooling medium in a through-hole 14a of the laser medium 14, and a cooling medium flow path F1 arranged around the laser medium unit 10.
    Type: Application
    Filed: January 13, 2016
    Publication date: September 27, 2018
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi SEKINE, Yoshinori KATO, Yoshinori TAMAOKI, Takashi KURITA, Toshiyuki KAWASHIMA, Takaaki MORITA
  • Patent number: 10063026
    Abstract: A laser medium unit 10 in a laser beam amplification device includes a plurality of laser media 14. A cooling medium flow path F1 is provided around the laser medium unit 10 to cool the laser medium unit 10 from outside. A sealed space between the laser media 14 is filled with gas or liquid, and a laser beam for passing through the sealed space is not interfered by a cooling medium flowing outside. Therefore, a fluctuation of an amplified laser beam is prevented, and a quality such as stability and focusing characteristics of the laser beam is improved.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: August 28, 2018
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi Sekine, Yoshinori Kato, Yoshinori Tamaoki, Takashi Kurita, Toshiyuki Kawashima, Takaaki Morita