Abstract: A coating film has a multilayer structure including stacked nanosheets of an inorganic oxide and has a thickness of a certain level or more, as well as a composite material containing a metallic material and the coating film provided on the metallic material.

Abstract: A machine component, made of steel or cast iron and having a circular hole that opens in a first surface, includes a plurality of first quench-hardened regions that include the first surface and are arranged apart from each other along a first circle surrounding the hole when viewed in a plane in a direction perpendicular to the first surface, and a base region that is a region other than the first quench-hardened regions.

Abstract: A thermal excitation acoustic-wave-generating device includes a first acoustic wave source that includes a first heating element and a substrate that includes a main surface along which the first heating element is disposed, a second acoustic wave source that includes a second heating element and a facing body that includes a main surface along which the second heating element is disposed, and a pair of electrodes connected to the first and second heating elements. The first and second acoustic wave sources are arranged such that the first and second heating elements are separated from each other and face each other. The pair of electrodes are disposed between the first and second acoustic wave sources.

Abstract: A machine component, made of steel or cast iron and having a circular hole that opens in a first surface, includes a plurality of first quench-hardened regions that include the first surface and are arranged apart from each other along a first circle surrounding the hole when viewed in a plane in a direction perpendicular to the first surface, and a base region that is a region other than the first quench-hardened regions.

Abstract: A disc brake pad includes a lining and a back plate supporting a back surface of the lining. A first torque transmitting portion, which transmits a brake tangential force that acts toward one circumferential side at a time of braking, is provided at a part of the back plate projecting radially outward from an outer peripheral edge of the lining. A second torque transmitting portion, which transmits a brake tangential force that acts toward the other circumferential side at the time of braking, is provided at a part of the other circumferential end portion of the back plate that is located radially inward from an action line of the brake tangential force acting at the time of braking.

Abstract: When an incoming call is received, a voice recognition control device automatically decides a first language (Japanese) as a language corresponding to call information. A voice recognizing device recognizes voice information during a call when an incoming call is received using a first voice recognition engine corresponding to the first language. After the incoming call is received, the voice recognition control device switches the first language to a second language (English) in response to a switching instruction to instruct switching from the first language to the second language, and recognizes the voice information during a call after the incoming call is received using a second voice recognition engine corresponding to the second language.

Abstract: A brake system that includes a brake caliper and a brake pad. The brake caliper includes a bridge. The bridge includes a lateral member that connects an inboard side of the brake caliper and an outboard side of the brake caliper. The brake pad includes an upper pad abutment. During forward braking, the brake pad rotates until that the upper pad abutment contacts the lateral member and torque from the brake pad is distributed from the brake pad at least to the inboard side the outboard side of the brake caliper.

Abstract: A composite disc rotor includes a disc main body, a coupling bracket and coupling units. Each of the coupling units includes a bobbin, a clip and a coupling bolt. A head part of the bobbin includes a torque receiving portion inserted in the notch and a projection projected in a circumferential direction from an end of the torque receiving portion. A pipe part of the bobbin is extended from the head part and is fitted in a coupling through hole of the disc main body. The clip includes a connecting portion between the torque receiving portion and the notch and a pressing portion extended from the connecting portion between the head part and the coupling bracket. The coupling bolt is inserted into each of through hole of the bobbin to fix the coupling bracket to the coupling unit.

Abstract: A tool holder is provided that prevents chattering in a large-sized cutting tool. A tool holder 1 includes an anti-vibration device provided in a radially outer portion of a body. The anti-vibration device has a ring-shaped first anti-vibration member and a second anti-vibration member. The anti-vibration device is fixed to the body together with a cutting tool T1 by means of a bolt. Four O-rings are arranged on both sides of the first anti-vibration member, and the damper property is adjusted by pressing a pressing plate with adjuster bolts. An appropriate gap is formed between the first anti-vibration member and the body and between the first anti-vibration member and the second anti-vibration member.

Abstract: A test apparatus for testing semiconductor integrated circuits includes a test head, a probe card holder for detachably holding a probe card that probes a semiconductor device, a heater for heating the probe card, and a heater holder that holds the heater in direct contact with the probe card when the probe card is held by the probe card holder. The test apparatus heats the probe card efficiently and thereby reduces test time and cost.

Abstract: A tool holder is provided that prevents chattering in a large-sized cutting tool. A tool holder 1 includes an anti-vibration device provided in a radially outer portion of a body. The anti-vibration device has a ring-shaped first anti-vibration member and a second anti-vibration member. The anti-vibration device is fixed to the body together with a cutting tool T1 by means of a bolt. Four O-rings are arranged on both sides of the first anti-vibration member, and the damper property is adjusted by pressing a pressing plate with adjuster bolts. An appropriate gap is formed between the first anti-vibration member and the body and between the first anti-vibration member and the second anti-vibration member.

Abstract: A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.

Abstract: The pad clip 14d is arranged between pins 12, 12 made to bridge an outer body portion and an inner body portion constituting a caliper and the two pads 10b, 11b. An engaging plate portion 27 is engaged with the respective pins 12, 12 without play. Press pieces 28, 28 formed by folding to bend both end portions in a rotational direction of the engaging plate portion in directions in which the more proximate to the two pads 10b, 11b, the more directed to an outer side in a radial direction are brought into elastic contact with outer peripheral edges of both end portions in a rotational direction of pressure plates 13b, 13b of the two pads 10b, 11b. Thereby, amounts of projecting portions in correspondence with the respective press pieces 28, 28 in a state of a material plate before being folded to bend from the engaging plate portion 27 can be restrained.

Abstract: A test apparatus for testing semiconductor integrated circuits includes a test head, a probe card holder for detachably holding a probe card that probes a semiconductor device, a heater for heating the probe card, and a heater holder that holds the heater in direct contact with the probe card when the probe card is held by the probe card holder. The test apparatus heats the probe card efficiently and thereby reduces test time and cost.

Abstract: A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.

Abstract: A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.

Abstract: First to third inner locking pieces 12 to 14 are provided at both ends of an inner shim plate 2a in a radial direction of a rotor so as to be bent toward the pad, respectively. First to third outer locking pieces 15, 17 and 18 are provided at both ends of an outer shim plate 1a in the radial direction of the rotor so as to be bent in the same direction as the locking pieces 12 to 14. An inner shim plate 2a is mounted on a pressure plate 10, and the first to third outer locking pieces 15, 17 and 18 are superimposed on the first to third inner locking pieces 12 to 14 such that main body parts 7 and 8 of the respective shim plates 2a and 1a are locked in the pad in the axial direction of the rotor.

Abstract: A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.

Abstract: A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.