Abstract: A seam welding device sandwiches between a first roller electrode and a second roller electrode a laminate, which is formed by laminating a plurality of workpieces and disposing the thinnest workpiece, which has the smallest thickness among the workpieces, on the outside, to carry out seam welding. The second roller electrode, which is in contact with the thinnest workpiece, is disposed further along the direction of welding progress than the first roller electrode.

Abstract: A seam welding device sandwiches between a first roller electrode and a second roller electrode a laminate, which is formed by laminating a plurality of workpieces and disposing the thinnest workpiece, which has the smallest thickness among the workpieces, on the outside, to carry out seam welding. The second roller electrode, which is in contact with the thinnest workpiece, is disposed further along the direction of welding progress than the first roller electrode.

Abstract: It is an object of the present invention to provide a seam welding warpage prevention method and apparatus capable of preventing warpage caused by cooling contraction after welding, in a case where workpieces are different from one another in material and thickness, and thus not uniform in thermal contraction. In the seam welding warpage prevention method for welding a plurality of workpieces W1 and W2 that are not uniform in thermal contraction with respect to an energizing direction, the workpieces W1 and W2 are clamped with a pair of roller electrodes 23 and 33 while applying current. The welding is performed in a state where the roller electrode 33 that abuts on the workpiece W2 having higher thermal contraction is offset in an advancing direction ahead of the roller electrode 23 that abuts on the workpiece W1 having lower thermal contraction.

Abstract: There is provided a device and method for arranging a vial, which can efficiently arrange a plurality of vials in the same arrangement place. A device for arranging a vial includes an arm member 150 for sandwiching one vial 1 and a carrying means 58 for carrying the vial 1 sandwiched by the arm member 150 to a vial arranging section 202. A layout of the vials 1 in the vial arranging section 202 can be set according to the number (n) of the vials 1 carried into the same vial arranging section 202. The carrying means 58 can advance and retract the arm member 150 in at least two or more directions in the vial arranging section 202.

Abstract: There is provided a device and method for arranging a vial, which can efficiently arrange a plurality of vials in the same arrangement place. A device for arranging a vial includes an arm member 150 for sandwiching one vial 1 and a carrying means 58 for carrying the vial 1 sandwiched by the arm member 150 to a vial arranging section 202. A layout of the vials 1 in the vial arranging section 202 can be set according to the number (n) of the vials 1 carried into the same vial arranging section 202. The carrying means 58 can advance and retract the arm member 150 in at least two or more directions in the vial arranging section 202.

Abstract: There is provided a device and method for arranging a vial, which can efficiently arrange a plurality of vials in the same arrangement place. A device for arranging a vial includes an arm member 150 for sandwiching one vial 1 and a carrying means 58 for carrying the vial 1 sandwiched by the arm member 150 to a vial arranging section 202. A layout of the vials 1 in the vial arranging section 202 can be set according to the number (n) of the vials 1 carried into the same vial arranging section 202. The carrying means 58 can advance and retract the arm member 150 in at least two or more directions in the vial arranging section 202.

Abstract: According to one embodiment, a semiconductor device includes a stacked structure that is formed by laminating a first insulating film, first conductive layer, second insulating film and second conductive layer on a semiconductor substrate and in which the first and second conductive layers are connected with a via electrically, an interlayer insulating film formed to electrically separate the second conductive layer into a first region including a connecting portion with the first conductive layer and a second region that does not include the connecting portion, a first contact plug formed on the first region and a second contact plug formed on the second region. An isolation insulating film is buried in portions of the substrate, first insulating film and first conductive layer in one peripheral portion on the second region side of the stacked structure and the second contact plug is formed above the isolation insulating film.

Abstract: A seam welding apparatus and a seam welding method perform a seaming process on workpieces of various shapes having flange sections, by preventing a welding track formed by upper and lower rotary electrodes from becoming displaced from a welding reference line established on the flange section. The seam welding apparatus includes two rotary electrodes for gripping the flange section therebetween while seam-welding the flange section, a support for synchronizing movements of the two rotary electrodes with each other in a widthwise direction of the flange section, a turning mechanism for pressing at least one of the two rotary electrodes toward the workpiece body, a roller that abuts against an end face of the flange section, and roller adjusting means for positionally adjusting the roller.

Abstract: A semiconductor device has a circuit element region formed on a semiconductor substrate, and a protective pattern formed so as to surround the circuit element region.

Abstract: An inspection system for inspecting a processing accuracy of a work piece is provided. The inspection system includes a supporting mechanism which supports the work piece in a same posture as a posture in which the work piece is assembled to a body; a load reproduction device which applies a load to the work piece along a substantially vertical direction; and a measurement device which measures positions of at least one characteristic portion of the work piece while the load is being applied to the work piece.

Abstract: According to an aspect of the present invention, there is provided a method for fabricating a nonvolatile semiconductor memory device including a memory cell being formed in a first region of a semiconductor substrate and a periphery circuit being formed in a second region of the semiconductor substrate, including forming a first gate electrode material film over the semiconductor substrate via a first gate insulator in the first region, etching the first gate electrode material film and the first gate insulator using a mask having a first opening in a first element isolation of the first region, etching the semiconductor substrate to a first depth to form a first isolation groove, forming a first insulation isolation layer in the first isolation groove, forming a second insulator on the first insulation isolation layer and on the first gate electrode, removing the second insulator by anisotropic etching, etching an upper portion of the first gate electrode to a second depth to form a first concave portion on

Abstract: It is an object of the present invention to provide a seam welding warpage prevention method and apparatus capable of preventing warpage caused by cooling contraction after welding, in a case where workpieces are different from one another in material and thickness, and thus not uniform in thermal contraction. In the seam welding warpage prevention method for welding a plurality of workpieces W1 and W2 that are not uniform in thermal contraction with respect to an energizing direction, the workpieces W1 and W2 are clamped with a pair of roller electrodes 23 and 33 while applying current. The welding is performed in a state where the roller electrode 33 that abuts on the workpiece W2 having higher thermal contraction is offset in an advancing direction ahead of the roller electrode 23 that abuts on the workpiece W1 having lower thermal contraction.

Abstract: An outer panel and an inner panel are integrated by placing peripheral parts of the outer panel on a top surface of a lower mold such that bending parts formed by bending the peripheral parts of the outer panel are set up upward; placing a central portion of the outer panel on a top surface of a lifting device; lifting the central portion of the outer panel by the lifting device to open leading end sides of the bending parts of the outer panel outward; placing the inner panel on the top surface of the outer panel so as to superimpose those onto each other; lowering the central portion of the outer panel by the lifting device; and pressing the bending parts toward the lower mold by an upper mold to further bend the bending parts, and making the bending parts to closely contact with the peripheral parts of the inner panel.

Abstract: According to one embodiment, a semiconductor memory device comprises a memory cell array, a controller. A memory cell array comprises bit lines, and memory cells configured to store different states, i.e., m values or n values. When storing the n values in a memory cell, the controller performs a first method of applying a bit-line voltage to a first bit line connected to the memory cell, and setting a second bit line adjacent to the first bit line at 0 V, in a read operation and in a verify operation. When storing the m values in the memory cell, the controller performs a second method of applying the bit-line voltage to all the bit lines in a read operation, and setting the first bit line and the second bit line at the bit-line voltage or 0 V in a verify operation, in accordance with whether the write is complete.

Abstract: According to one embodiment, a semiconductor device includes a stacked structure that is formed by laminating a first insulating film, first conductive layer, second insulating film and second conductive layer on a semiconductor substrate and in which the first and second conductive layers are connected with a via electrically, an interlayer insulating film formed to electrically separate the second conductive layer into a first region including a connecting portion with the first conductive layer and a second region that does not include the connecting portion, a first contact plug formed on the first region and a second contact plug formed on the second region. An isolation insulating film is buried in portions of the substrate, first insulating film and first conductive layer in one peripheral portion on the second region side of the stacked structure and the second contact plug is formed above the isolation insulating film.

Abstract: There is provided a device and method for arranging a vial, which can efficiently arrange a plurality of vials in the same arrangement place. A device for arranging a vial includes an arm member 150 for sandwiching one vial 1 and a carrying means 58 for carrying the vial 1 sandwiched by the arm member 150 to a vial arranging section 202. A layout of the vials 1 in the vial arranging section 202 can be set according to the number (n) of the vials 1 carried into the same vial arranging section 202. The carrying means 58 can advance and retract the arm member 150 in at least two or more directions in the vial arranging section 202.

Abstract: A seam welding apparatus and a seam welding method perform a seaming process on workpieces of various shapes having flange sections, by preventing a welding track formed by upper and lower rotary electrodes from becoming displaced from a welding reference line established on the flange section. The seam welding apparatus includes two rotary electrodes for gripping the flange section therebetween while seam-welding the flange section, a support for synchronizing movements of the two rotary electrodes with each other in a widthwise direction of the flange section, a turning mechanism for pressing at least one of the two rotary electrodes toward the workpiece body, a roller that abuts against an end face of the flange section, and roller adjusting means for positionally adjusting the roller.

Abstract: A semiconductor device has a circuit element region formed on a semiconductor substrate, and a protective pattern formed so as to surround the circuit element region.

Abstract: An inspection system for inspecting a processing accuracy of a work piece is provided. The inspection system includes a supporting mechanism which supports the work piece in a same posture as a posture in which the work piece is assembled to a body; a load reproduction device which applies a load to the work piece along a substantially vertical direction; and a measurement device which measures positions of at least one characteristic portion of the work piece while the load is being applied to the work piece.

Abstract: A writing device for display members is provided which can erasably writing patient information on a display member carried on the side of a drug carrier and automatically attach and detach it to and from the carrier. The writing device has an attach/detach/transfer unit for detaching, attaching and transferring a rewrite card to a carrier carrying the rewrite card, and a writing means connected to the attach/detach/transfer means for writing and displaying patient information on the rewrite card. The respective means are controlled based on prescription information to attach and detach the rewrite card to and from the side of the carrier.