Patents by Inventor Takafumi Masuda
Takafumi Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240324174Abstract: A semiconductor memory device includes memory layers arranged in a first direction and a via-wiring extending in the first direction. The plurality of memory layers each include a semiconductor layer electrically connected to the via-wiring, a gate electrode opposed to surfaces of the semiconductor layer in the first direction, a memory portion disposed on one side in a second direction with respect to the semiconductor layer, a wiring disposed on the other side in the second direction with respect to the semiconductor layer, and a connection wiring connected to the gate electrode and the wiring. The connection wiring includes a first part extending in the second direction along a side surface of the gate electrode in the third direction and a second part continuous with the first part, extending in the third direction along a side surface of the wiring in the second direction.Type: ApplicationFiled: March 15, 2024Publication date: September 26, 2024Applicant: Kioxia CorporationInventors: Takafumi MASUDA, Mutsumi OKAJIMA, Nobuyoshi SAITO, Keiji IKEDA
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Publication number: 20240312911Abstract: A semiconductor memory device includes a memory layer and a via-wiring extending in a first direction. The memory layer includes a semiconductor layer electrically connected to the via-wiring, a gate electrode including parts opposed to surfaces of the semiconductor layer on one side and the other side in the first direction, a memory portion disposed on one side in a second direction with respect to the semiconductor layer, and a wiring disposed on the other side in the second direction with respect to the semiconductor layer. In a cross-sectional surface perpendicular to the first direction and including one of the parts of the gate electrode, the via-wiring includes a surface opposed to the gate electrode and a surface not opposed to the gate electrode. A part of the gate electrode is disposed on a memory portion side with respect to the via-wiring in the second direction.Type: ApplicationFiled: March 11, 2024Publication date: September 19, 2024Applicant: Kioxia CorporationInventors: Takafumi MASUDA, Mutsumi OKAJIMA, Nobuyoshi SAITO, Keiji IKEDA
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Publication number: 20240286394Abstract: Provided are a heat-sealable laminated film which has a high adhesion force at a laminated interface and a good bonded state when heat-sealed, and a roll thereof. A heat-sealable laminated film includes layer B, layer C, layer A, layer C, and layer B in this order. At least layer C, layer A, and layer C are laminated by co-extrusion. The layer A contains 100 to 70% by mass of a polymer A1 containing 90-100 mol % of a constitutional unit derived from 4-methyl-1-pentene with respect to all constitutional units. The layer B contains 100 to 70% by mass of a heat-sealable polyolefin B1. The layer C contains 50% by mass or more of a copolymer C1 containing 60-99 mol % of a constitutional unit derived from 4-methyl-1-pentene and 1-40 mol % of a constitutional unit derived from an ?-olefin having 2 or more and 20 or less carbon atoms other than 4-methyl-1-pentene.Type: ApplicationFiled: June 2, 2022Publication date: August 29, 2024Applicant: TOYOBO CO., LTD.Inventors: Yoshitaka TANAKA, Shigeyuki WATANABE, Daiki FUNAOKA, Takafumi MASUDA
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Publication number: 20240260253Abstract: A semiconductor memory device comprises: a substrate; memory layers arranged in a first direction intersecting with a surface of the substrate; and a first via wiring extending in the first direction. The memory layers each comprise: a first semiconductor layer electrically connected to the first via wiring; a first gate electrode facing surfaces on one side and the other side in the first direction of the first semiconductor layer; a memory portion which is provided on one side in a second direction intersecting with the first direction with respect to the first semiconductor layer, and is electrically connected to the first semiconductor layer; and a first wiring which is provided on the other side in the second direction with respect to the first semiconductor layer, is electrically connected to the first gate electrode, and extends in a third direction intersecting with the first direction and the second direction.Type: ApplicationFiled: January 25, 2024Publication date: August 1, 2024Applicant: Kioxia CorporationInventors: Mutsumi OKAJIMA, Takafumi MASUDA, Nobuyoshi SAITO, Keiji IKEDA
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Publication number: 20240239088Abstract: Provided are a heat-sealable laminated film which has a high adhesion force at a laminated interface and has a good bonded state when being heat-sealed, and a roll obtained by rolling the heat-sealable laminated film. A heat-sealable laminated film includes a layer B, a layer A, and a layer B laminated by co-extrusion in this order. The layer A contains 100 to 70% by mass of a polymer A1 containing 90 to 100 mol % of a constitutional unit derived from 4-methyl-1-pentene with respect to all constitutional units. The layer B contains 99 to 30% by mass of a heat-sealable polyolefin B1 and 1 to 70% by mass of a copolymer B2 containing 60 to 89 mol % of a constitutional unit derived from 4-methyl-1-pentene and 11 to 40 mol % of a constitutional unit derived from an ?-olefin having 2 or more and 20 or less carbon atoms other than 4-methyl-1-pentene.Type: ApplicationFiled: June 2, 2022Publication date: July 18, 2024Applicant: TOYOBO CO., LTD.Inventors: Yoshitaka TANAKA, Shigeyuki WATANABE, Daiki FUNAOKA, Takafumi MASUDA
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Publication number: 20240087616Abstract: A semiconductor memory device comprises: memory layers arranged in a first direction; and a first and a second via wirings having different positions in a second direction. The memory layer comprises: a first transistor electrically connected to the first via wiring; a memory portion electrically connected to the first transistor; a wiring electrically connected to the first transistor; a second transistor electrically connected to the second via wiring; and an electrode provided in a current path between the second transistor and the wiring. The second transistor comprises: a semiconductor layer electrically connected to the electrode and the second via wiring; and a gate electrode facing the semiconductor layer. The semiconductor layer faces at least one of surfaces on one side or the other side in the first direction of the gate electrode. The electrode includes a portion arranged with the second via wiring in a third direction.Type: ApplicationFiled: September 8, 2023Publication date: March 14, 2024Applicant: Kioxia CorporationInventors: Takafumi MASUDA, Nobuyoshi SAITO, Mutsumi OKAJIMA, Keiji IKEDA
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Publication number: 20240081042Abstract: A semiconductor memory device comprises: a first memory layer; and a first via wiring and a second via wiring extending in a first direction, and having different positions from each other in a second direction. The first memory layer comprises: a first transistor electrically connected to the first via wiring; a memory portion electrically connected to the first transistor; a first wiring electrically connected to the first transistor; a second transistor electrically connected to the second via wiring and the first wiring; a first electrode electrically connected to the second transistor; and a second electrode electrically connected to the first wiring and first electrode. A length of the second electrode in the first direction is larger than one or both of a length of the first wiring in the first direction and a length of the first conductive layer in the first direction.Type: ApplicationFiled: September 1, 2023Publication date: March 7, 2024Applicant: Kioxia CorporationInventors: Takafumi MASUDA, Mutsumi OKAJIMA, Nobuyoshi SAITO, Keiji IKEDA
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Publication number: 20240038280Abstract: A semiconductor memory device comprises: memory layers arranged in a first direction; and a first wiring extending in the first direction. The memory layers each comprise: a memory portion; a transistor; and a second wiring. The transistor comprises: a semiconductor layer electrically connected between the memory portion and the first wiring; a gate electrode facing the semiconductor layer and electrically connected to the second wiring; and a gate insulating film provided between the semiconductor layer and the gate electrode. The semiconductor layer faces surfaces of the gate electrode on one side and the other side in the first direction. In a cross section perpendicular to the first direction and including a part of the transistor corresponding to one of the memory layers, the first wiring comprises: a first surface in contact with the transistor; and a second surface not in contact with the transistor.Type: ApplicationFiled: March 16, 2023Publication date: February 1, 2024Applicant: Kioxia CorporationInventors: Takafumi MASUDA, Mutsumi OKAJIMA, Nobuyoshi SAITO, Keiji IKEDA
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Publication number: 20240002700Abstract: The invention provides a thermal adhesive laminated oriented film containing a substrate layer comprising a resin composition containing 99.9 to 60% by mass of a polyamide resin or a polymethylpentene resin and 0.1 to 40% by mass of a modified polyolefin resin; and a thermal adhesive layer containing a thermal adhesive polyolefin resin and provided on each of both surfaces of the substrate layer so as to be in direct contact therewith by coextrusion. When a machine direction is defined as an X axis, a transverse direction is defined as a Y axis, and a thickness direction is defined as a Z axis, the film is stretched and oriented in at least one direction of the X axis or the Y axis, and has a thermal deformation rate at 150° C. of 4% or less in both directions of the X axis and the Y axis.Type: ApplicationFiled: November 11, 2021Publication date: January 4, 2024Applicant: TOYOBO CO., LTD.Inventors: Yoshitaka TANAKA, Shigeyuki WATANABE, Nobuhiro YOSHIMURA, Ryo UMEKI, Takafumi MASUDA, Daiki FUNAOKA
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Patent number: 11643527Abstract: A power transmission belt includes a belt body at least portion of which is made of a rubber composition containing a rubber component, cellulose-based fine fibers, and cotton powder.Type: GrantFiled: December 6, 2021Date of Patent: May 9, 2023Assignee: BANDO CHEMICAL INDUSTRIES, LTD.Inventors: Shogo Kobayashi, Hideyuki Kato, Takafumi Masuda
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Publication number: 20220089845Abstract: A power transmission belt includes a belt body at least portion of which is made of a rubber composition containing a rubber component, cellulose-based fine fibers, and cotton powder.Type: ApplicationFiled: December 6, 2021Publication date: March 24, 2022Applicant: BANDO CHEMICAL INDUSTRIES, LTD.Inventors: Shogo KOBAYASHI, Hideyuki KATO, Takafumi MASUDA
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Patent number: 10625569Abstract: An engine controller includes a reading section and a ratio-setting control section. The reading section is included in an air conditioner. The air conditioner draws an air into an air-conditioner housing, heats the air by a cooling water cooling the engine, and blows the air into a vehicle compartment. The reading section reads a state information that relates to a state of the air conditioner having an effect on an outside-air drawing ratio. The outside-air drawing ratio is a ratio of a volume of an outside air to a total volume of the outside air and an inside air. The ratio-setting control section decreases an amount of heat generated by the engine when the outside-air drawing ratio is a second ratio, which is smaller than a first ratio, to be smaller than an amount of heat generated by the engine when the outside-air drawing ratio is the first ratio.Type: GrantFiled: August 11, 2016Date of Patent: April 21, 2020Assignee: DENSO CORPORATIONInventors: Kouji Fujii, Hiroshi Nakajima, Takafumi Masuda, Masanori Morikawa
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Publication number: 20180272835Abstract: A vehicular air conditioning device includes a cabin air conditioning unit having a cabin side ventilator and a temperature adjusting unit, and a seat air conditioning unit having a seat side ventilator a ventilation duct that guides at least a portion of the air temperature adjusted by the temperature adjusting unit toward the seat side ventilator. A plurality of seat side blowout portions in a seat. The plurality of seat side blowout portions include a contact side blowout portion which is formed on a surface of a portion of the seat which come into contact with a passenger when the passenger sits in the seat, and a below knee side blowout portion which is formed on a portion of the seat that faces a below knee region of the passenger.Type: ApplicationFiled: June 29, 2016Publication date: September 27, 2018Inventors: Kouji FUJII, Hiroshi NAKAJIMA, Takafumi MASUDA, Masanori MORIKAWA
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Publication number: 20180251009Abstract: An engine controller includes a reading section and a ratio-setting control section. The reading section is included in an air conditioner. The air conditioner draws an air into an air-conditioner housing, heats the air by a cooling water cooling the engine, and blows the air into a vehicle compartment. The reading section reads a state information that relates to a state of the air conditioner having an effect on an outside-air drawing ratio. The outside-air drawing ratio is a ratio of a volume of an outside air to a total volume of the outside air and an inside air. The ratio-setting control section decreases an amount of heat generated by the engine when the outside-air drawing ratio is a second ratio, which is smaller than a first ratio, to be smaller than an amount of heat generated by the engine when the outside-air drawing ratio is the first ratio.Type: ApplicationFiled: August 11, 2016Publication date: September 6, 2018Inventors: Kouji FUJII, Hiroshi NAKAJIMA, Takafumi MASUDA, Masanori MORIKAWA
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Publication number: 20120219152Abstract: A key information management system includes one or more record reproduction apparatuses and a key information management server. Each record reproduction apparatus has a substrate which can be replaced, and a nonvolatile storage unit which is mounted on the substrate and stores substrate identification information and key information of an encryption key. The key information management server includes a storage unit for storing the substrate identification information and the key information of the substrate in association with product identification information of the record reproduction apparatus, and the key information management server permits access to the storage unit through authentication.Type: ApplicationFiled: January 25, 2012Publication date: August 30, 2012Applicant: SONY CORPORATIONInventors: Suguru Yorifuji, Kazumasa Miyazaki, Takafumi Masuda, Norihiko Sato, Toshihiko Suzuki
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Patent number: 7894279Abstract: A semiconductor storage device precharging a bit line pair to a ground potential includes a sense amplifier connected between the bit line pair, a storage cell connected to one of the bit line pair and storing data, a first transistor controlling a conduction state between the other of the bit line pair and a reference cell node, a second transistor connected between a reference voltage source generating a reference voltage and the reference cell node, the second transistor exclusively controlled from the first transistor, and a capacitor setting a potential of the reference cell node.Type: GrantFiled: October 16, 2008Date of Patent: February 22, 2011Assignee: Renesas Electronics CorporationInventors: Takafumi Masuda, Kenichi Serizawa, Hiroyuki Takahashi
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Patent number: 7763692Abstract: An ultraviolet-curing resin composition of (a) 5 to 35 parts by mass of a chlorinated polyolefin with a chlorine content of 15 to 40 mass %, (b) 15 to 60 parts by mass of an alicyclic hydrocarbon mono(meth)acrylate, and (c) 5 to 80 parts by mass of a polypropylene glycol di(meth)acrylate; and, per 100 parts by mass of the total amount of components (a), (b) and (c), (d) 0 to 1100 parts by mass of an aliphatic hydrocarbon di(meth)acrylate and (e) 0 to 600 parts by mass of a polyfunctional monomer having 3 to 6 (meth)acryloyl groups in its molecule; and, per 100 parts by mass of the total amount of components (b), (c), (d) and (e), (f) 1 to 15 parts by mass of a photoinitiator; and the composition as an active ingredient in paints, inks, adhesives, sealing agents and primers.Type: GrantFiled: November 1, 2004Date of Patent: July 27, 2010Assignees: Toyo Kasei Kogyo Company Limited, Osaka Municipal Technical Research InstituteInventors: Toshiyuki Tamai, Mitsuru Watanabe, Kenji Kashihara, Takafumi Masuda
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Publication number: 20100094441Abstract: There is provided an image selection apparatus, an image selection method and a program. The image selection apparatus includes a selection number designation portion to designate a selection number of images, an image analysis portion 228 to analyze a plurality of images and extract a feature amount of each image, a first selection portion to select at least the selection number of images from the plurality of images based on the feature amount of each image extracted by the image analysis portion, a second selection portion to select images from the plurality of images by a given method different from a method of the first selection portion, and a selection control portion to cause the second selection portion, rather than the first selection portion, to select images if the selection number is larger than a first set number.Type: ApplicationFiled: August 19, 2008Publication date: April 15, 2010Inventors: Daisuke Mochizuki, Takaomi Kimura, Tomohiko Gotoh, Tamaki Kojima, Takafumi Masuda
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Patent number: 7560157Abstract: The adhesive composition of the present invention to be used for bonding a thermoplastic elastomer and a glass article, comprising a chlorinated polyolefin, an epoxy group-containing compound and a silane coupling agent, is excellent in initial adhesive properties and is also excellent in durability, and exhibits sufficient adhesive strength for bonding a thermoplastic elastomer molding and a window glass. Further, a glass plate with a thermoplastic elastomer molding, made by using the adhesive composition, is provided.Type: GrantFiled: February 28, 2005Date of Patent: July 14, 2009Assignees: Asahi Glass Company, Limited, Toyo Kasei Kogyo Co., Ltd.Inventors: Takayuki Kasahara, Yuji Masaki, Yasuhiro Shibuya, Takafumi Masuda, Tatsuo Tsuneka, Shoji Maekawa
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Publication number: 20090129175Abstract: A semiconductor storage device precharging a bit line pair to a ground potential includes a sense amplifier connected between the bit line pair, a storage cell connected to one of the bit line pair and storing data, a first transistor controlling a conduction state between the other of the bit line pair and a reference cell node, a second transistor connected between a reference voltage source generating a reference voltage and the reference cell node, the second transistor exclusively controlled from the first transistor, and a capacitor setting a potential of the reference cell node.Type: ApplicationFiled: October 16, 2008Publication date: May 21, 2009Applicant: NEC ELECTRONICS CORPORATIONInventors: TAKAFUMI MASUDA, Kenichi Serizawa, Hiroyuki Takahashi