Abstract: A wiring board includes: a flexible printed circuit board that includes: a base having a first opening; a wiring pattern formed on the base; and a cover lay that includes an adhesive layer adhering to the wiring pattern and that has a second opening; and a metal cover that covers at least a part of the first opening from below. The wiring pattern contacts the metal cover through the first opening, and is bonded to the metal cover. At least a part of the second opening overlaps the first opening in a plan view. A part of the cover lay overlaps the first opening in a plan view.

Abstract: A conductor-layer-equipped structure includes: a wiring body that includes a first resin layer, a first conductor layer provided on the first resin layer, and a second resin layer provided on the first resin layer so as to cover the first conductor layer; a cover glass that is in direct contact with one main surface of the wiring body or adheres to the one main surface of the wiring body via a first adhesion layer; and a liquid crystal panel that is in direct contact with the another main surface of the wiring body or adheres to the another main surface of the wiring body via a second adhesion layer. The first resin layer includes a material having optical isotropy. The second resin layer includes a material having optical isotropy. The material of the first resin layer and the material of the second resin layer have the same composition.

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer including a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer including a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Abstract: A wiring body includes an adhesive layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Abstract: A conductor-layer-equipped structure includes: a wiring body that includes a first resin layer, a first conductor layer provided on the first resin layer, and a second resin layer provided on the first resin layer so as to cover the first conductor layer; a cover glass that is in direct contact with one main surface of the wiring body or adheres to the one main surface of the wiring body via a first adhesion layer; and a liquid crystal panel that is in direct contact with the another main surface of the wiring body or adheres to the another main surface of the wiring body via a second adhesion layer. The first resin layer includes a material having optical isotropy. The second resin layer includes a material having optical isotropy. The material of the first resin layer and the material of the second resin layer have the same composition.

Abstract: A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1?H2|<T1/3 where H1 is a maximum height of the second conductor wire in a first region corresponding to the first conductor wire in a first predetermined sectional surface crossing the wiring body along the second conductor wire, H2 is a minimum height of the second conductor wire in a second region that is adjacent to the first region and has the same width as that of the first region in the first predetermined sectional surface, and T1 is a thickness of the first conductor wire in the first predetermined sectional surface.

Abstract: A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1?H2|<T1/3 where H1 is a maximum height of the second conductor wire in a first region corresponding to the first conductor wire in a first predetermined sectional surface crossing the wiring body along the second conductor wire, H2 is a minimum height of the second conductor wire in a second region that is adjacent to the first region and has the same width as that of the first region in the first predetermined sectional surface, and T1 is a thickness of the first conductor wire in the first predetermined sectional surface.

Abstract: A wiring body includes an adhesive :layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer including a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer including a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Abstract: A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1?H2|<T1/3 where H1 is a maximum height of the second conductor wire in a first region corresponding to the first conductor wire in a first predetermined sectional surface crossing the wiring body along the second conductor wire, H2 is a minimum height of the second conductor wire in a second region that is adjacent to the first region and has the same width as that of the first region in the first predetermined sectional surface, and T1 is a thickness of the first conductor wire in the first predetermined sectional surface.

Abstract: The method includes: preparing a first substrate including first wirings; preparing a mold having a stamping surface that includes convex portions formed depending on wiring patterns of a second substrate to be laminated on the first substrate and projections formed depending on via patterns; pressing, while heating, the mold against the second insulating sheet so that end portions of the projections are exposed at the other main surface side of the second insulating sheet; laminating, while heating, the second insulating sheet on a first insulating sheet so that the exposed end portions contact the first wirings; releasing, the mold from the second insulating sheet; and filling a conductive material in groove portions and holes formed in the second insulating sheet.

Abstract: Providing a mold and a manufacturing method therefor wherein protrusions are easy to be pressed into a resin base material and the protrusions are easy to be pulled out from the resin base material. The present invention provides a mold comprising a stamping surface (1a) formed depending on a via pattern and a protruding portion (21, 22) formed in convex shape from the stamping surface (1a), wherein the protruding portion has a base portion (111, 121) merging into a main surface of the stamping surface (1a) to have a curvature and a slope portion (113, 123) progressively decreasing in outer diameter thereof from the base portion (111, 121) to a top portion (112, 122) of the protruding portion (21, 22).

Abstract: A component-mounting printed board comprises: a resin base; an electronic component mounted on at least one of surfaces of the resin base; a through-hole electrode formed penetrating the resin base at a position corresponding to an electrode of the electronic component; the electrode of the electronic component and the through-hole electrode being directly joined, and an electrode pad of the through-hole electrode being formed in a surface on an opposite side to a side of a mounting surface on which the electronic component is mounted of the resin base.

Abstract: Providing a mold and a manufacturing method therefor wherein protrusions are easy to be pressed into a resin base material and the protrusions are easy to be pulled out from the resin base material. The present invention provides a mold comprising a stamping surface (1a) formed depending on a via pattern and a protruding portion (21, 22) formed in convex shape from the stamping surface (1a), wherein the protruding portion has a base portion (111, 121) merging into a main surface of the stamping surface (1a) to have a curvature and a slope portion (113, 123) progressively decreasing in outer diameter thereof from the base portion (111, 121) to a top portion (112, 122) of the protruding portion (21, 22).

Abstract: Wiring board bases 2 to 4 are provided with: insulating substrates 1a to 4a having conductive layers 1b to 4b provided on one surfaces thereof, respectively; through-holes 2e to 4e which are arranged on the insulating substrates and reach the conductive layers from the other surfaces; and conductive vias 2d to 4d connected to the conductive layers by filling the through-holes with a conductive paste. In a method for manufacturing a laminated wiring board, at least one of the wiring board bases is stacked. Before the through-hole is filled with the conductive paste, a surface portion, in the through-hole, of the conductive layer is smoothed and a smooth surface portion 2g is formed.

Abstract: The method includes: preparing a first substrate including first wirings; preparing a mold having a stamping surface that includes convex portions formed depending on wiring patterns of a second substrate to be laminated on the first substrate and projections formed depending on via patterns; pressing, while heating, the mold against the second insulating sheet so that end portions of the projections are exposed at the other main surface side of the second insulating sheet; laminating, while heating, the second insulating sheet on a first insulating sheet so that the exposed end portions contact the first wirings; releasing, the mold from the second insulating sheet; and filling a conductive material in groove portions and holes formed in the second insulating sheet.

Abstract: A wiring board having high connection reliability is provided. The wiring board comprises: an insulating base material (30); wiring patterns (51-57) formed on one main surface of the insulating base material (30); and vias (11V, 12V) which penetrate from the one main surface side of the insulating base material (30) to the other main surface side and which is conductive with the wiring patterns (51-57), wherein the vias (11V, 12V) have connection base portions (111V, 121V) which merge into the wiring patterns (51-57) to have certain curvatures, and cone-like portions (113V, 123V) of which the outer diameters become thinner as approaching top head portions (112V, 122V) of the vias (11V, 12V) from the connection base portions (111V, 121V).

Abstract: Providing a mold and a manufacturing method therefor wherein protrusions are easy to be pressed into a resin base material and the protrusions are easy to be pulled out from the resin base material. The present invention provides a mold comprising a stamping surface (1a) formed depending on a via pattern and a protruding portion (21, 22) formed in convex shape from the stamping surface (1a), wherein the protruding portion has a base portion (111, 121) merging into a main surface of the stamping surface (1a) to have a curvature and a slope portion (113, 123) progressively decreasing in outer diameter thereof from the base portion (111, 121) to a top portion (112, 122) of the protruding portion (21, 22).