Patents by Inventor Takahide Mizawa
Takahide Mizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210189312Abstract: A composite pattern culture substrate which can be conveniently produced using readily available materials and can cultivate uniform spheroids with high viability. According to some embodiments of the present invention, a cell culture substrate having an adhesive portion and a non-adhesive portion is provided, wherein the adhesive portion and the non-adhesive portion have a concave-convex shape, and the contact angle of pure water on the non-adhesive portion is larger than that of the adhesive portion.Type: ApplicationFiled: January 19, 2017Publication date: June 24, 2021Applicant: SOKEN CHEMICAL & ENGINEERING CO., LTD.Inventors: Kaoru SUDA, Keisuke NIMIYA, Takahide MIZAWA
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Patent number: 9895838Abstract: A resin mold for nanoimprinting has a substrate, a resin layer formed upon the substrate and having a depressions and protrusions pattern on a surface, an inorganic substance layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the resin layer, and a mold release agent layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the inorganic substance layer. The resin of the resin layer includes constituent units derived from an epoxy group-containing unsaturated compound at a concentration of 1 to 50 percent relative to total constituent units, and the epoxy value is 7.0×10?4 to 4.0×10?2.Type: GrantFiled: May 17, 2017Date of Patent: February 20, 2018Assignee: Soken Chemical & Engineering Co., Ltd.Inventors: Hiroko Yamada, Takahide Mizawa
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Publication number: 20170252962Abstract: A resin mold for nanoimprinting has a substrate, a resin layer formed upon the substrate and having a depressions and protrusions pattern on a surface, an inorganic substance layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the resin layer, and a mold release agent layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the inorganic substance layer. The resin of the resin layer includes constituent units derived from an epoxy group-containing unsaturated compound at a concentration of 1 to 50 percent relative to total constituent units, and the epoxy value is 7.0×10?4 to 4.0×10?2.Type: ApplicationFiled: May 17, 2017Publication date: September 7, 2017Inventors: Hiroko Yamada, Takahide Mizawa
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Patent number: 9713900Abstract: A resin mold for nanoimprinting has a substrate, a resin layer formed upon the substrate and having a depressions and protrusions pattern on a surface, an inorganic substance layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the resin layer, and a mold release agent layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the inorganic substance layer. The resin of the resin layer includes constituent units derived from an epoxy group-containing unsaturated compound at a concentration of 1 to 50 percent relative to total constituent units, and the epoxy value is 7.0×10?4 to 4.0×10?2.Type: GrantFiled: August 3, 2011Date of Patent: July 25, 2017Assignee: Soken Chemical & Engineering Co., Ltd.Inventors: Hiroko Yamada, Takahide Mizawa
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Patent number: 9511535Abstract: A resin mold includes a resin layer having a depressions and protrusions pattern formed in the surface thereof, and a release layer including a mold release agent and formed of uniform thickness on at least the depressions and protrusions pattern of the aforementioned resin layer. The aforementioned resin layer has a solvent soluble resin, and an additive that has bleeding ability with respect to the solvent soluble resin, has a substituent group capable of coupling with the aforementioned mold release agent, and has a substituent group having compatibility with the aforementioned solvent soluble resin. The aforementioned additive is localized in the vicinity of the aforementioned resin layer surface. The group of the additive capable of coupling with the mold release agent condenses with the aforementioned mold release agent so that the aforementioned resin layer and release layer are bonded together.Type: GrantFiled: August 3, 2011Date of Patent: December 6, 2016Assignee: Soken Chemical & Engineering Co., Ltd.Inventors: Satoshi Uehara, Takahide Mizawa
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Patent number: 9393737Abstract: Disclosed is a resin mold for nanoimprinting, which has a resin layer having fine depressions and protrusions formed on the surface, wherein the resin layer is formed from 1 to 49 parts by weight of a silicone-based macromonomer and/or a fluorine-based macromonomer and 99 to 51 parts by weight of at least one polymerizable monomer selected from the group consisting of a (meth)acrylic monomer, a styrene-based monomer, an epoxy-based monomer, an olefin-based monomer and a polycarbonate-based resin-forming monomer. The silicone-based macromonomer and/or the fluorine-based macromonomer has a molecular weight of 600 to 10000 and has, at an end of molecule, a reactive group copolymerizable with the polymerizable monomer, and when the reactive group is copolymerized with the polymerizable group, silicone-based units or fluorine-based units that constitute the macromonomer form side chains on a trunk polymer formed from the polymerizable monomer and the macromonomer.Type: GrantFiled: August 3, 2011Date of Patent: July 19, 2016Assignee: Soken Chemical & Engineering Co., Ltd.Inventors: Satoshi Uehara, Takahide Mizawa
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Patent number: 9354512Abstract: Provided is a resin mold for imprinting which is free from transfer defects, has excellent releasability from a resin subjected to imprinting, and does not cause any defect by imprinting. The resin mold for imprinting includes a resin layer having a recessed and projected pattern surface, an inorganic material layer formed with a uniform thickness on at least the recessed and projected pattern surface of the resin layer, and a release agent layer formed with a uniform thickness on at least the recessed and projected pattern surface of the inorganic material layer.Type: GrantFiled: August 6, 2010Date of Patent: May 31, 2016Assignee: Soken Chemical & Engineering Co., Ltd.Inventors: Takahide Mizawa, Satoshi Uehara
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Publication number: 20140099474Abstract: A nanoimprint mold for a curved surface is provided and includes a silicone rubber elastic body having an Hs rubber hardness, in the case of a thickness of 250 ?m, of 10 to 55 and includes fine depressions and protrusions formed on the surface. According to the nanoimprint mold for a curved surface, a nanoimprint can be formed even on a curved surface.Type: ApplicationFiled: May 15, 2012Publication date: April 10, 2014Applicant: SOKEN CHEMICAL & ENGINEERING CO., LTD.Inventors: Takanori Takahashi, Hiroko Yamada, Takahide Mizawa, Ryota Kojima
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Publication number: 20140093692Abstract: Provided is a resin mold which is free from separation from another resin mold at the joined portions and does not impair appearance or function. Thus provided is a resin mold which is preferable for forming a large-area mold, a production process therefor, and uses thereof. The resin mold has a mold constituent to constitute one half of the resin mold having a fine depression-protrusion pattern formed on the surface by transferring, a mold constituent to constitute the other half thereof, and a connecting section between the mold constituent to constitute one half of the resin mold and the mold constituent to constitute the other half thereof, wherein the connecting section comprises an inclined plane, a production process for this resin mold, and uses of the resin mold.Type: ApplicationFiled: August 30, 2013Publication date: April 3, 2014Applicant: Soken Chemical & Engineering Co., Ltd.Inventors: Yukihiro Miyazawa, Takahide Mizawa
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Publication number: 20130134622Abstract: A resin mold includes a resin layer having a depressions and protrusions pattern formed in the surface thereof, and a release layer including a mold release agent and formed of uniform thickness on at least the depressions and protrusions pattern of the aforementioned resin layer. The aforementioned resin layer has a solvent soluble resin, and an additive that has bleeding ability with respect to the solvent soluble resin, has a substituent group capable of coupling with the aforementioned mold release agent, and has a substituent group having compatibility with the aforementioned solvent soluble resin. The aforementioned additive is localized in the vicinity of the aforementioned resin layer surface. The group of the additive capable of coupling with the mold release agent condenses with the aforementioned mold release agent so that the aforementioned resin layer and release layer are bonded together.Type: ApplicationFiled: August 3, 2011Publication date: May 30, 2013Applicant: SOKEN CHEMICAL & ENGINEERING CO., LTD.Inventors: Satoshi Uehara, Takahide Mizawa
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Publication number: 20130136818Abstract: Disclosed is a resin mold for nanoimprinting, which has a resin layer having fine depressions and protrusions formed on the surface and is characterized in that the resin layer is formed from 1 to 49 parts by weight of a silicone-based macromonomer and/or a fluorine-based macromonomer and 99 to 51 parts by weight of at least one polymerizable monomer selected from the group consisting of a (meth)acrylic monomer, a styrene-based monomer, an epoxy-based monomer, an olefin-based monomer and a polycarbonate-based resin-forming monomer, the silicone-based macromonomer and/or the fluorine-based macromonomer has a molecular weight of 600 to 10000 and has, at an end of molecule, a reactive group copolymerizable with the polymerizable monomer, and when the reactive group is copolymerized with the polymerizable group, silicone-based units or fluorine-based units that constitute the macromonomer form side chains on a trunk polymer formed from the polymerizable monomer and the macromonomer.Type: ApplicationFiled: August 3, 2011Publication date: May 30, 2013Applicant: SOKEN CHEMICAL & ENGINEERING CO., LTD.Inventors: Satoshi Uehara, Takahide Mizawa
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Publication number: 20130127090Abstract: A resin mold for nanoimprinting of the has a substrate, a resin layer formed upon the substrate and having a depressions and protrusions pattern on a surface, an inorganic substance layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the resin layer, and a mold release agent layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the inorganic substance layer. The resin of the resin layer includes constituent units derived from an epoxy group-containing unsaturated compound at a concentration of 1 to 50 percent relative to total constituent units, and the epoxy value is 7.0×10?4 to 4.0×10?2.Type: ApplicationFiled: August 3, 2011Publication date: May 23, 2013Applicant: SOKEN CHEMICAL & ENGINEERING CO., LTD.Inventors: Hiroko Yamada, Takahide Mizawa
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Publication number: 20120133077Abstract: Provided is a resin mold for imprinting which is free from transfer defects, has excellent releasability from a resin subjected to imprinting, and does not cause any defect by imprinting. The resin mold for imprinting includes a resin layer having a recessed and projected pattern surface, an inorganic material layer formed with a uniform thickness on at least the recessed and projected pattern surface of the resin layer, and a release agent layer formed with a uniform thickness on at least the recessed and projected pattern surface of the inorganic material layer.Type: ApplicationFiled: August 6, 2010Publication date: May 31, 2012Applicant: SOKEN CHEMICAL & ENGINEERING CO., LTD.Inventors: Takahide Mizawa, Satoshi Uehara