Patents by Inventor Takahiko Nozaki

Takahiko Nozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10024511
    Abstract: A reliable semiconductor light-emitting apparatus including an optical fiber and a wavelength converting layer and a headlight using the semiconductor light-emitting apparatus can include a ferrule holder attaching the wavelength converting layer. The ferrule holder can also attach a first ferrule covering the optical fiber, which transmits light emitted from a semiconductor light-emitting chip toward the wavelength converting layer. When the light-emitting apparatus is used for the headlight, the apparatus can be easily incorporated into a prescribed position of the headlight with confidence via a lamp holder.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: July 17, 2018
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Naoto Suzuki, Takahiko Nozaki, Takeshi Waragaya
  • Patent number: 9461433
    Abstract: A light-emitting device can have high heat dissipation performance from a light-transmitting member and be capable of easily making alignment of the light-transmitting member and an incidence hole for light into the light-transmitting member. The light-emitting device can include: a base; a light-emitting element held by the base; a lens held by the base and disposed above the light-emitting element, configured to condense light emitted from the light-emitting element; a first tubular member disposed on the base; a second tubular member fitted into the first tubular member; a holder allowed to be inserted into the second tubular member and thereby fitted into the second tubular member and having a through hole through which light condensed by the lens passes; and a light-transmitting member formed on the holder so as to block the through hole.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: October 4, 2016
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventor: Takahiko Nozaki
  • Publication number: 20160146415
    Abstract: A reliable semiconductor light-emitting apparatus including an optical fiber and a wavelength converting layer and a headlight using the semiconductor light-emitting apparatus can include a ferrule holder attaching the wavelength converting layer. The ferrule holder can also attach a first ferrule covering the optical fiber, which transmits light emitted from a semiconductor light-emitting chip toward the wavelength converting layer. When the light-emitting apparatus is used for the headlight, the apparatus can be easily incorporated into a prescribed position of the headlight with confidence via a lamp holder.
    Type: Application
    Filed: November 25, 2015
    Publication date: May 26, 2016
    Inventors: Naoto Suzuki, Takahiko Nozaki, Takeshi Waragaya
  • Patent number: 9333901
    Abstract: An optical fiber bundle is used in a vehicle headlight, the optical fiber bundle being configured by binding a plurality of optical fibers. Each optical fiber can include a core having an incident end face on which a laser beam is made incident and an emission end face from which the laser beam is emitted. A clad can surround the core. Emission end faces of the respective plurality of optical fibers can be arranged adjacent to one another on a substantially same plane to create an emission end face group, an external shape of which is a substantial rectangle.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: May 10, 2016
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Yasushi Yatsuda, Takahiko Nozaki, Takeshi Waragaya
  • Patent number: 9080732
    Abstract: A light emitting device can include a base portion including a surface, a back surface, and a first through hole penetrating the surface and the back surface. A light-transmitting member can be fixed to the surface so as to cover the first through hole. A semiconductor light emitting element can emit light to pass through the first through hole and for irradiating the light-transmitting member. An optical system can be provided for condensing the light from the semiconductor light emitting element and locally irradiating the light-transmitting member with the light. A foil body can be provided and can include a second through hole for light emitted from the light-transmitting member to pass through and has elasticity. The light-transmitting member can be sandwiched between the foil body around the second through hole and the base portion with part of the light-transmitting member exposed from the second through hole.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: July 14, 2015
    Assignee: Stanley Electric Co., Ltd.
    Inventor: Takahiko Nozaki
  • Patent number: 9076952
    Abstract: A semiconductor light-emitting device including a favorable radiating structure can include a semiconductor light source sealed between a metallic cap having a light-emitting window and a metallic base attached on a heat sink plate. The semiconductor light-emitting device can also include a holder attaching the metallic base along the metallic cap between the holder and the heat sink plate to efficiently radiate heat generated from the light source, and a thermal interface material layer disposed between at least a top surface of the heat sink plate and an outer bottom surface of the holder so as to be able to enlarge each tolerance of parts composing the light-emitting device. Thus, the disclosed subject matter can provide semiconductor light-emitting devices including the favorable radiating structure, which can be employed for various lighting apparatuses including a headlight in a relatively small size by selecting the semiconductor light source incorporated in the devices.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: July 7, 2015
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Takao Saito, Takahiko Nozaki
  • Publication number: 20140376246
    Abstract: An optical fiber bundle is used in a vehicle headlight, the optical fiber bundle being configured by binding a plurality of optical fibers. Each optical fiber can include a core having an incident end face on which a laser beam is made incident and an emission end face from which the laser beam is emitted. A clad can surround the core. Emission end faces of the respective plurality of optical fibers can be arranged adjacent to one another on a substantially same plane to create an emission end face group, an external shape of which is a substantial rectangle.
    Type: Application
    Filed: June 23, 2014
    Publication date: December 25, 2014
    Inventors: Yasushi Yatsuda, Takahiko Nozaki, Takeshi Waragaya
  • Publication number: 20140268787
    Abstract: A light-emitting device can have high heat dissipation performance from a light-transmitting member and be capable of easily making alignment of the light-transmitting member and an incidence hole for light into the light-transmitting member. The light-emitting device can include: a base; a light-emitting element held by the base; a lens held by the base and disposed above the light-emitting element, configured to condense light emitted from the light-emitting element; a first tubular member disposed on the base; a second tubular member fitted into the first tubular member; a holder allowed to be inserted into the second tubular member and thereby fitted into the second tubular member and having a through hole through which light condensed by the lens passes; and a light-transmitting member formed on the holder so as to block the through hole.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: Stanley Electric Co., Ltd.
    Inventor: Takahiko Nozaki
  • Publication number: 20140197445
    Abstract: A semiconductor light-emitting device including a favorable radiating structure can include a semiconductor light source sealed between a metallic cap having a light-emitting window and a metallic base attached on a heat sink plate. The semiconductor light-emitting device can also include a holder attaching the metallic base along the metallic cap between the holder and the heat sink plate to efficiently radiate heat generated from the light source, and a thermal interface material layer disposed between at least a top surface of the heat sink plate and an outer bottom surface of the holder so as to be able to enlarge each tolerance of parts composing the light-emitting device. Thus, the disclosed subject matter can provide semiconductor light-emitting devices including the favorable radiating structure, which can be employed for various lighting apparatuses including a headlight in a relatively small size by selecting the semiconductor light source incorporated in the devices.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 17, 2014
    Applicant: Stanley Electric Co., Ltd.
    Inventors: Takao Saito, Takahiko Nozaki
  • Patent number: 8757826
    Abstract: A light-emitting device having an LED element and a resin layer including a convex portion covering the LED element can suppress color unevenness to achieve light emission with uniform color distribution. The light-emitting device can include a substrate, an LED element mounted on the substrate, a resin layer which contains a wavelength conversion material and is formed on the substrate to cover the LED element, the resin layer including a convex portion directly covering the LED element and a flat thin film portion extending around the convex portion, and a reflective portion which is formed over the thin film portion around the convex portion. A diffusion portion can be formed to cover the convex portion of the resin layer.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: June 24, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Takaaki Sakai, Hiroshi Kotani, Takahiko Nozaki
  • Patent number: 8746932
    Abstract: In the production of a light emitting device, in which a plurality of light emitting element parts carrying LED elements are formed on a substrate, and the substrate is diced, generation of shaving dusts is suppressed at the time of the dicing, and breakage of the substrate during the production process can be prevented. In the process of forming a slit crossing a region for forming a light emitting element part in a metal substrate, a recess which serves as a resin reservoir can be formed so as to cross the slit. The slit can be filled with an insulating material, the recess can be filled with a resin, and they both can be cured. A light emitting element part can be formed in the region for forming the light emitting element part, the metal substrate can be cut into units comprising one or a plurality of the light emitting element parts, and can be mounted on a printed circuit board on which a pattern is formed.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: June 10, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Shunya Ide, Masanori Sato, Takahiko Nozaki, Takaaki Sakai, Hiroshi Kotani
  • Publication number: 20140153276
    Abstract: A light emitting device can include a base portion including a surface, a back surface, and a first through hole penetrating the surface and the back surface. A light-transmitting member can be fixed to the surface so as to cover the first through hole. A semiconductor light emitting element can emit light to pass through the first through hole and for irradiating the light-transmitting member. An optical system can be provided for condensing the light from the semiconductor light emitting element and locally irradiating the light-transmitting member with the light. A foil body can be provided and can include a second through hole for light emitted from the light-transmitting member to pass through and has elasticity. The light-transmitting member can be sandwiched between the foil body around the second through hole and the base portion with part of the light-transmitting member exposed from the second through hole.
    Type: Application
    Filed: December 3, 2013
    Publication date: June 5, 2014
    Applicant: Stanley Electric Co., Ltd.
    Inventor: Takahiko Nozaki
  • Patent number: 8546827
    Abstract: A light emitting device that can radiate heat generated by a semiconductor light emitting element and/or a resin layer at not only a position directly under the light emitting element, but also a position remote from such a position with respect to the main plane direction is provided. In the light emitting device, a light emitting element is carried on a substrate, and a resin covers the light emitting element. An anisotropic heat conduction material showing a heat conductivity for the substrate main plane direction larger than that for the substrate thickness direction is carried on the substrate. A side of the anisotropic heat conduction material contacts with the resin. Thereby, the anisotropic heat conduction material can receive heat of the resin, conduct it along the main plane direction, and radiate it to the substrate at a position remote from the light emitting element and/or the resin.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: October 1, 2013
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Takahiko Nozaki, Hiroshi Kotani
  • Patent number: 8373177
    Abstract: An LED light source can include protection members to protect bonding wires. The LED can include a substrate including electrode patterns, a sub mount substrate located on the substrate, at least one flip LED chip mounted on the sub mount substrate and a phosphor rein covering the LED chip. The bonding wires can connect each of the electrode patterns to conductor patterns connecting to electrodes of the LED chip. The protection members can be located so as to surround both sides of the bonding wires. In addition, because each height of the protection members is higher than each maximum height of the bonding wires and is lower than a height of the phosphor resin, the protection members can protect the bonding wires from external pressure while the light flux is not reduced. Thus, the disclosed subject matter can provide a reliable LED light source having a favorable light distribution.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: February 12, 2013
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Hiroshi Kotani, Takahiko Nozaki
  • Publication number: 20120188772
    Abstract: A light-emitting device having an LED element and a resin layer including a convex portion covering the LED element can suppress color unevenness to achieve light emission with uniform color distribution. The light-emitting device can include a substrate, an LED element mounted on the substrate, a resin layer which contains a wavelength conversion material and is formed on the substrate to cover the LED element, the resin layer including a convex portion directly covering the LED element and a flat thin film portion extending around the convex portion, and a reflective portion which is formed over the thin film portion around the convex portion. A diffusion portion can be formed to cover the convex portion of the resin layer.
    Type: Application
    Filed: January 23, 2012
    Publication date: July 26, 2012
    Inventors: Takaaki Sakai, Hiroshi Kotani, Takahiko Nozaki
  • Publication number: 20110133236
    Abstract: A light emitting device that can radiate heat generated by a semiconductor light emitting element and/or a resin layer at not only a position directly under the light emitting element, but also a position remote from such a position with respect to the main plane direction is provided. In the light emitting device, a light emitting element is carried on a substrate, and a resin covers the light emitting element. An anisotropic heat conduction material showing a heat conductivity for the substrate main plane direction larger than that for the substrate thickness direction is carried on the substrate. A side of the anisotropic heat conduction material contacts with the resin. Thereby, the anisotropic heat conduction material can receive heat of the resin, conduct it along the main plane direction, and radiate it to the substrate at a position remote from the light emitting element and/or the resin.
    Type: Application
    Filed: December 3, 2010
    Publication date: June 9, 2011
    Inventors: Takahiko Nozaki, Hiroshi Kotani
  • Publication number: 20110116271
    Abstract: In the production of a light emitting device, in which a plurality of light emitting element parts carrying LED elements are formed on a substrate, and the substrate is diced, generation of shaving dusts is suppressed at the time of the dicing, and breakage of the substrate during the production process can be prevented. In the process of forming a slit crossing a region for forming a light emitting element part in a metal substrate, a recess which serves as a resin reservoir can be formed so as to cross the slit. The slit can be filled with an insulating material, the recess can be filled with a resin, and they both can be cured. A light emitting element part can be formed in the region for forming the light emitting element part, the metal substrate can be cut into units comprising one or a plurality of the light emitting element parts, and can be mounted on a printed circuit board on which a pattern is formed.
    Type: Application
    Filed: November 17, 2010
    Publication date: May 19, 2011
    Inventors: Shunya Ide, Masanori Sato, Takahiko Nozaki, Takaaki Sakai, Hiroshi Kotani
  • Publication number: 20110084299
    Abstract: An LED light source can include protection members to protect bonding wires. The LED can include a substrate including electrode patterns, a sub mount substrate located on the substrate, at least one flip LED chip mounted on the sub mount substrate and a phosphor rein covering the LED chip. The bonding wires can connect each of the electrode patterns to conductor patterns connecting to electrodes of the LED chip. The protection members can be located so as to surround both sides of the bonding wires. In addition, because each height of the protection members is higher than each maximum height of the bonding wires and is lower than a height of the phosphor resin, the protection members can protect the bonding wires from external pressure while the light flux is not reduced. Thus, the disclosed subject matter can provide a reliable LED light source having a favorable light distribution.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 14, 2011
    Inventors: HIROSHI KOTANI, Takahiko Nozaki
  • Patent number: 6921922
    Abstract: A substrate (2) is composed of laminated green sheets. The substrate (2) is provided with recesses (2f, 2g) formed on at least two locations deeper than implemented heights of ICs (4, 6) and elements (3, 5). A transmitter and a receiver are mounted in different recesses, which are individually covered with a mold resin to form a molded optical communication module (1), which operates fast and causes no optical and electrical crosstalk.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: July 26, 2005
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Katsumi Kobinata, Yoshiki Furukawa, Takahiko Nozaki
  • Publication number: 20040240773
    Abstract: A substrate (2) is composed of laminated green sheets. The substrate (2) is provided with recesses (2f, 2g) formed on at least two locations deeper than implemented heights of ICs (4, 6) and elements (3, 5). A transmitter and a receiver are mounted in different recesses, which are individually covered with a mold resin to form a molded optical communication module (1), which operates fast and causes no optical and electrical crosstalk.
    Type: Application
    Filed: September 10, 2003
    Publication date: December 2, 2004
    Inventors: Katsumi Kobinata, Yoshiki Furukawa, Takahiko Nozaki