Abstract: A carriage apparatus characterized by comprising a carriage configured to reciprocally move in a predetermined direction, a first motor arranged on a side of one end of a range of movement of the carriage and configured to drive the carriage, a second motor arranged on a side of the other end of the range of movement of the carriage, configured to drive the carriage, and has the same kind of driving characteristics as driving characteristics of the first motor, detection means for detecting a position of the carriage related to the predetermined direction, and control means for controlling driving of the first motor and the second motor by feeding back a detection result detected by the detection means.

Abstract: Provided is a heat-resistant imaging camera configured to move in a high temperature furnace and configured to capture high-definition images of the outer side or the inner side of a painted object passing in a high temperature drying furnace. Heat insulators (13a to 13f) are attached to all inner surfaces of an outer case (10) of a heat-resistant imaging camera (1) except a double glass window (21), and cold storage material packs (15a to 15e) are disposed inward of the heat insulators (13a to 13f) in layers so as to cover around a camera (2). Intrusive heat is absorbed by melting latent heat when the cold storage material packs (15a to 15e) are melted and changed in phase from a solid to a liquid at a specific temperature or higher, thereby ensuring heat resistance that maintains the camera (2) at a safely operatable temperature.

Abstract: Effectively control the temperature of a control unit of a railway equipment inspecting and measuring apparatus, and install the control unit of the railway equipment inspecting and measuring on the roof of the passenger car. The first space is formed between the control unit and the heat insulating case. The second space is formed between the heat insulating case and the cover. In the first space, heat is conducted between the air in the first space and the heat exchange element by the first heat conducting member, and the first fan causes circulation of the air in the first space. In the second space, heat is conducted between the air in the second space and the heat exchange element by the second heat conducting member, and the air inside the second space is diffused by blowing the air from a suction port into the second space with the second fan.

Abstract: Provided is a heat-resistant imaging camera configured to move in a high temperature furnace and configured to capture high-definition images of the outer side or the inner side of a painted object passing in a high temperature drying furnace. Heat insulators (13a to 13f) are attached to all inner surfaces of an outer case (10) of a heat-resistant imaging camera (1) except a double glass window (21), and cold storage material packs (15a to 15e) are disposed inward of the heat insulators (13a to 13f) in layers so as to cover around a camera (2). Intrusive heat is absorbed by melting latent heat when the cold storage material packs (15a to 15e) are melted and changed in phase from a solid to a liquid at a specific temperature or higher, thereby ensuring heat resistance that maintains the camera (2) at a safely operatable temperature.

Abstract: In a method of manufacturing a liquid-cooling cold plate, cast molding is performed after embedding a metal pipe for supplying a cooling liquid inside a casting mold. Fixing brackets to be attached to the metal pipe is provided to maintain a positional relationship between a plurality of portions of the metal pipe embedded in the casting mold. The casting molding is performed by pouring molten metal into the casting mold while the fixing metal parts are attached to the metal pipe.

Abstract: Effectively control the temperature of a control unit of a railway equipment inspecting and measuring apparatus, and install the control unit of the railway equipment inspecting and measuring on the roof of the passenger car. The first space is formed between the control unit and the heat insulating case. The second space is formed between the heat insulating case and the cover. In the first space, heat is conducted between the air in the first space and the heat exchange element by the first heat conducting member, and the first fan causes circulation of the air in the first space. In the second space, heat is conducted between the air in the second space and the heat exchange element by the second heat conducting member, and the air inside the second space is diffused by blowing the air from a suction port into the second space with the second fan.

Abstract: In a sheet supply apparatus, a type of sheet to be used can be specified using a sensor that detects a sheet separated from a roll at the time of automatic sheet feeding. The sheet supplying apparatus includes a driving unit configured to cause a roll including a wound consecutive sheet to rotate in a first direction for feeding the sheet or a second direction opposite to the first direction, a sensor that detects the sheet separated from an outer circumferential surface of the roll, and a specifying unit. In a case in which the sensor detects a leading end portion of the sheet while the roll is being rotated in the second direction, the driving unit changes a rotation direction of the roll from the second direction to the first direction and feeds the sheet, and the specifying unit is configured to specify a type of the sheet on the basis of an output of the sensor while the roll is being rotated in the second direction.

Abstract: It is an object of the present invention to specify a type of sheet to be used using a sensor that detects a sheet separated from a roll at the time of automatic sheet feeding. A sheet supplying apparatus according to the present invention includes a driving unit configured to cause a roll including a wound consecutive sheet to rotate in a first direction for feeding the sheet or a second direction opposite to the first direction, a sensor that detects the sheet separated from an outer circumferential surface of the roll, wherein, in a case in which the sensor detects a leading end portion of the sheet while the roll is being rotated in the second direction, the driving unit changes a rotation direction of the roll from the second direction to the first direction and feeds the sheet, and wherein the sheet supplying apparatus further includes a specifying unit configured to specify a type of the sheet on the basis of an output of the sensor while the roll is being rotated in the second direction.

Abstract: In a method of manufacturing a liquid-cooling cold plate, cast molding is performed after embedding a metal pipe for supplying a cooling liquid inside a casting mold. Fixing brackets to be attached to the metal pipe is provided to maintain a positional relationship between a plurality of portions of the metal pipe embedded in the casting mold. The casting molding is performed by pouring molten metal into the casting mold while the fixing metal parts are attached to the metal pipe.

Abstract: A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in thermal expansion rate is fixed with solder 8 to the face of the wiring board 1 for mounting semiconductor devices 2; a rubber O-ring 15 is placed between the upper face of the frame 5 and the under face of the circumference of an air-cooled: heat sink 7; the plastic member 6 making possible relative sliding is placed between the upper face of the circumference of the heat sink 7 and the upper frame 10; the upper face of a plastic member 6 is restrained with the inside middle stage of an upper frame 10; and the lower part of the upper frame 10 and the frame 5 are fastened together with bolts 9.

Abstract: According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

Abstract: Provided is a cooling apparatus for feeding liquid coolant to electronic elements as heat generating elements in an electronic system through a cooling pipe. The cooling pipe is in part flattened so as to form flattened portion which is made into contact with the electronic parts for cooling the latter. With this arrangement, the pipe line working is simplified while the number of joint parts in the pipe line is decreased so as to prevent leakage of the liquid coolant. Further, the heat-exchange capacity of a heat-exchanger unit is controlled in accordance with an atmospheric temperature, a temperature in the electronic system and a temperature of the liquid coolant in order to aim at preventing occurrence of freezing or dewing while enhancing the operating efficiency. Further, in an electronic apparatus having two electronic systems, a liquid coolant tank is commonly used for two electronic systems in order to prevent occurrence of dewing or freezing in a cooling system for the electronic system on resting.

Abstract: There are provided a highly thermal conductive grease composition having both a thermal conductivity and a satisfactory dispense property, and a cooling device applied with same. The grease composition comprises from 70 to 90% by volume of an inorganic powder which is a mixture containing at least two kinds of inorganic powders different from each other in each average particle size, and from 10 to 30% by volume of a base oil containing a mineral oil or a synthetic oil, the base oil further containing a surfactant in an amount of from 0.2 to 2.0% by weight based on the weight of the inorganic powder.

Abstract: According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

Abstract: According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

Abstract: Provided is a cooling apparatus for feeding liquid coolant to electronic elements as heat generating elements in an electronic system through a cooling pipe. The cooling pipe is in part flattened so as to form flattened portion which is made into contact with the electronic parts for cooling the latter. With this arrangement, the pipe line working is simplified while the number of joint parts in the pipe line is decreased so as to prevent leakage of the liquid coolant. Further, the heat-exchange capacity of a heat-exchanger unit is controlled in accordance with an atmospheric temperature, a temperature in the electronic system and a temperature of the liquid coolant in order to aim at preventing occurrence of freezing or dewing while enhancing the operating efficiency. Further, in an electronic apparatus having two electronic systems, a liquid coolant tank is commonly used for two electronic systems in order to prevent occurrence of dewing or freezing in a cooling system for the electronic system on resting.

Abstract: A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.

Abstract: A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.

Abstract: A highly reliable electronic apparatus free from condensation in the cabinet of the apparatus. The electronic apparatus has printed circuit boards on which heat emitting semiconductor devices are mounted and a fan. The electronic apparatus further comprises a hygrometer for measuring the relative humidity and dew-point temperature of the cooling air that is introduced into the cabinet through an opening, a surface temperature sensor for sensing the temperature of the surface of the semiconductor devices, an internal temperature sensor for sensing the internal temperature of the semiconductor device, dehumidifier and heater means made up of a heat pump and an outdoor unit, and a controller for controlling the dehumidifier means and the heater means so that the relative humidity is less than 100% and the dew-point temperature is less than the surface temperature of the semiconductor devices.

Abstract: The cooling apparatus has cooling fins attached to heat generating units of electronic devices and provided with a plurality of elemental fins. According to one embodiment, the cooling apparatus has a first cooling fin composed of elemental fins that are uniform in fin density in the height direction of the cooling fin from a fin base. The cooling apparatus also has a second cooling fin composed of elemental fins with a zero or small fin density at the lower portion close to a fin base of the cooling fin as compared with the fin density at the upper portion of the cooling fin. The first and second cooling fins are positioned adjacent to one another. Various different embodiments of cooling fins are disclosed.