Patents by Inventor Takahiro Daikoku

Takahiro Daikoku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10532401
    Abstract: In a method of manufacturing a liquid-cooling cold plate, cast molding is performed after embedding a metal pipe for supplying a cooling liquid inside a casting mold. Fixing brackets to be attached to the metal pipe is provided to maintain a positional relationship between a plurality of portions of the metal pipe embedded in the casting mold. The casting molding is performed by pouring molten metal into the casting mold while the fixing metal parts are attached to the metal pipe.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: January 14, 2020
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Satoru Ujiie, Takahiro Daikoku
  • Publication number: 20190297750
    Abstract: Effectively control the temperature of a control unit of a railway equipment inspecting and measuring apparatus, and install the control unit of the railway equipment inspecting and measuring on the roof of the passenger car. The first space is formed between the control unit and the heat insulating case. The second space is formed between the heat insulating case and the cover. In the first space, heat is conducted between the air in the first space and the heat exchange element by the first heat conducting member, and the first fan causes circulation of the air in the first space. In the second space, heat is conducted between the air in the second space and the heat exchange element by the second heat conducting member, and the air inside the second space is diffused by blowing the air from a suction port into the second space with the second fan.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 26, 2019
    Applicant: HITACHI HIGH-TECH FINE SYSTEMS CORPORATION
    Inventors: Hideyasu SUZUKI, Takeshi KUROKAWA, Tomohiko KAI, Masaki ARAKI, Tomoya SASAKI, Takeshi IGA, Tomoharu ISOZAKI, Noritake SHIZAWA, Keishin HAMAOKA, Takahiro DAIKOKU
  • Patent number: 10421299
    Abstract: In a sheet supply apparatus, a type of sheet to be used can be specified using a sensor that detects a sheet separated from a roll at the time of automatic sheet feeding. The sheet supplying apparatus includes a driving unit configured to cause a roll including a wound consecutive sheet to rotate in a first direction for feeding the sheet or a second direction opposite to the first direction, a sensor that detects the sheet separated from an outer circumferential surface of the roll, and a specifying unit. In a case in which the sensor detects a leading end portion of the sheet while the roll is being rotated in the second direction, the driving unit changes a rotation direction of the roll from the second direction to the first direction and feeds the sheet, and the specifying unit is configured to specify a type of the sheet on the basis of an output of the sensor while the roll is being rotated in the second direction.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: September 24, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takahiro Daikoku, Masashi Kamada, Masato Eiyama, Yuki Igarashi, Masashi Negishi, Ryoya Shinjo, Ryo Kobayashi, Tomohiro Suzuki
  • Publication number: 20180257407
    Abstract: It is an object of the present invention to specify a type of sheet to be used using a sensor that detects a sheet separated from a roll at the time of automatic sheet feeding. A sheet supplying apparatus according to the present invention includes a driving unit configured to cause a roll including a wound consecutive sheet to rotate in a first direction for feeding the sheet or a second direction opposite to the first direction, a sensor that detects the sheet separated from an outer circumferential surface of the roll, wherein, in a case in which the sensor detects a leading end portion of the sheet while the roll is being rotated in the second direction, the driving unit changes a rotation direction of the roll from the second direction to the first direction and feeds the sheet, and wherein the sheet supplying apparatus further includes a specifying unit configured to specify a type of the sheet on the basis of an output of the sensor while the roll is being rotated in the second direction.
    Type: Application
    Filed: February 22, 2018
    Publication date: September 13, 2018
    Inventors: Takahiro Daikoku, Masashi Kamada, Masato Eiyama, Yuki Igarashi, Masashi Negishi, Ryoya Shinjo, Ryo Kobayashi, Tomohiro Suzuki
  • Publication number: 20180078997
    Abstract: In a method of manufacturing a liquid-cooling cold plate, cast molding is performed after embedding a metal pipe for supplying a cooling liquid inside a casting mold. Fixing brackets to be attached to the metal pipe is provided to maintain a positional relationship between a plurality of portions of the metal pipe embedded in the casting mold. The casting molding is performed by pouring molten metal into the casting mold while the fixing metal parts are attached to the metal pipe.
    Type: Application
    Filed: February 22, 2016
    Publication date: March 22, 2018
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Satoru UJIIE, Takahiro DAIKOKU
  • Patent number: 7518233
    Abstract: A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in thermal expansion rate is fixed with solder 8 to the face of the wiring board 1 for mounting semiconductor devices 2; a rubber O-ring 15 is placed between the upper face of the frame 5 and the under face of the circumference of an air-cooled: heat sink 7; the plastic member 6 making possible relative sliding is placed between the upper face of the circumference of the heat sink 7 and the upper frame 10; the upper face of a plastic member 6 is restrained with the inside middle stage of an upper frame 10; and the lower part of the upper frame 10 and the frame 5 are fastened together with bolts 9.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: April 14, 2009
    Assignees: Hitachi, Ltd., Hitachi Information Technology Co., Ltd.
    Inventors: Kouichi Takahashi, Kenichi Kasai, Takahiro Daikoku, Takayuki Uda, Toshitada Netsu, Takeshi Yamaguchi, Takahiko Matsushita, Osamu Maruyama
  • Patent number: 6890799
    Abstract: According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: May 10, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Kenichi Kasai, Toshitada Netsu, Koichi Koyano, Takayuki Uda
  • Patent number: 6711017
    Abstract: Provided is a cooling apparatus for feeding liquid coolant to electronic elements as heat generating elements in an electronic system through a cooling pipe. The cooling pipe is in part flattened so as to form flattened portion which is made into contact with the electronic parts for cooling the latter. With this arrangement, the pipe line working is simplified while the number of joint parts in the pipe line is decreased so as to prevent leakage of the liquid coolant. Further, the heat-exchange capacity of a heat-exchanger unit is controlled in accordance with an atmospheric temperature, a temperature in the electronic system and a temperature of the liquid coolant in order to aim at preventing occurrence of freezing or dewing while enhancing the operating efficiency. Further, in an electronic apparatus having two electronic systems, a liquid coolant tank is commonly used for two electronic systems in order to prevent occurrence of dewing or freezing in a cooling system for the electronic system on resting.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: March 23, 2004
    Assignees: Hitachi Kokusai Electric Inc., Hitachi, Ltd.
    Inventors: Tateki Kurokawa, Akira Saito, Toshio Fukukawa, Mikio Harada, Takahiro Daikoku, Hideo Yazawa
  • Patent number: 6632780
    Abstract: There are provided a highly thermal conductive grease composition having both a thermal conductivity and a satisfactory dispense property, and a cooling device applied with same. The grease composition comprises from 70 to 90% by volume of an inorganic powder which is a mixture containing at least two kinds of inorganic powders different from each other in each average particle size, and from 10 to 30% by volume of a base oil containing a mineral oil or a synthetic oil, the base oil further containing a surfactant in an amount of from 0.2 to 2.0% by weight based on the weight of the inorganic powder.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: October 14, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Takao Uematsu, Yutaka Ito, Takahiro Daikoku, Akio Idei, Akihiro Yasuda
  • Publication number: 20030103333
    Abstract: According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.
    Type: Application
    Filed: January 7, 2003
    Publication date: June 5, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Kenichi Kasai, Toshitada Netsu, Koichi Koyano, Takayuki Uda
  • Patent number: 6528878
    Abstract: According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: March 4, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Kenichi Kasai, Toshitada Netsu, Koichi Koyano, Takayuki Uda
  • Publication number: 20030016498
    Abstract: Provided is a cooling apparatus for feeding liquid coolant to electronic elements as heat generating elements in an electronic system through a cooling pipe. The cooling pipe is in part flattened so as to form flattened portion which is made into contact with the electronic parts for cooling the latter. With this arrangement, the pipe line working is simplified while the number of joint parts in the pipe line is decreased so as to prevent leakage of the liquid coolant. Further, the heat-exchange capacity of a heat-exchanger unit is controlled in accordance with an atmospheric temperature, a temperature in the electronic system and a temperature of the liquid coolant in order to aim at preventing occurrence of freezing or dewing while enhancing the operating efficiency. Further, in an electronic apparatus having two electronic systems, a liquid coolant tank is commonly used for two electronic systems in order to prevent occurrence of dewing or freezing in a cooling system for the electronic system on resting.
    Type: Application
    Filed: July 17, 2002
    Publication date: January 23, 2003
    Inventors: Tateki Kurokawa, Akira Saito, Toshio Fukukawa, Mikio Harada, Takahiro Daikoku, Hideo Yazawa
  • Patent number: 6351384
    Abstract: A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: February 26, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Junri Ichikawa, Atsuo Nishihara, Kenichi Kasai
  • Patent number: 6281575
    Abstract: A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.
    Type: Grant
    Filed: July 7, 1999
    Date of Patent: August 28, 2001
    Assignee: Hitachi, LTD
    Inventors: Toru Nishikawa, Masahide Harada, Kaoru Katayama, Takeshi Miitsu, Takayuki Uda, Takahiro Daikoku
  • Patent number: 5934368
    Abstract: A highly reliable electronic apparatus free from condensation in the cabinet of the apparatus. The electronic apparatus has printed circuit boards on which heat emitting semiconductor devices are mounted and a fan. The electronic apparatus further comprises a hygrometer for measuring the relative humidity and dew-point temperature of the cooling air that is introduced into the cabinet through an opening, a surface temperature sensor for sensing the temperature of the surface of the semiconductor devices, an internal temperature sensor for sensing the internal temperature of the semiconductor device, dehumidifier and heater means made up of a heat pump and an outdoor unit, and a controller for controlling the dehumidifier means and the heater means so that the relative humidity is less than 100% and the dew-point temperature is less than the surface temperature of the semiconductor devices.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: August 10, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Tetsuya Tanaka, Toshio Hatada, Takayuki Atarashi, Junichi Kobayashi, Akihiro Takanashi, Takahiro Daikoku, Yutaka Watanabe, Shizuo Zushi
  • Patent number: 5818694
    Abstract: The cooling apparatus has cooling fins attached to heat generating units of electronic devices and provided with a plurality of elemental fins. According to one embodiment, the cooling apparatus has a first cooling fin composed of elemental fins that are uniform in fin density in the height direction of the cooling fin from a fin base. The cooling apparatus also has a second cooling fin composed of elemental fins with a zero or small fin density at the lower portion close to a fin base of the cooling fin as compared with the fin density at the upper portion of the cooling fin. The first and second cooling fins are positioned adjacent to one another. Various different embodiments of cooling fins are disclosed.
    Type: Grant
    Filed: February 14, 1997
    Date of Patent: October 6, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Shigeyasu Tsubaki
  • Patent number: 5774334
    Abstract: Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module.
    Type: Grant
    Filed: August 28, 1995
    Date of Patent: June 30, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Keizo Kawamura, Noriyuki Ashiwake, Takahiro Daikoku, Akio Idei, Kenichi Kasai, Hideyuki Kimura, Atsuo Nishihara, Toshio Hatada, Shigeyuki Sasaki
  • Patent number: 5751062
    Abstract: A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.
    Type: Grant
    Filed: December 13, 1995
    Date of Patent: May 12, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Fumiyuki Kobayashi, Noriyuki Ashiwake, Kenichi Kasai, Keizou Kawamura, Akio Idei
  • Patent number: 5705850
    Abstract: The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
    Type: Grant
    Filed: August 15, 1994
    Date of Patent: January 6, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Noriyuki Ashiwake, Takahiro Daikoku, Kenichi Kasai, Keizou Kawamura, Hideyuki Kimura, Atsuo Nishihara, Toshio Hatada, Toshiki Iino
  • Patent number: RE35721
    Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: February 3, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Tadakatsu Nakajima, Noriyuki Ashiwake, Keizo Kawamura, Motohiro Sato, Fumiyuki Kobayashi, Wataru Nakayama