Abstract: A heating portion is cooled by a fluid, thereby effecting a temperature control. The temperature of the fluid is measured at the time of starting of a system, and the measured fluid temperature is compared with a set temperature. In accordance with the result of the comparison, the timing of starting the operation of LSI chips and the timing of starting the operation of a refrigerator are controlled.

Abstract: A packaged semiconductor device having heat transfer leads carrying a semiconductor chip directly or indirectly through a chip pad and extended to the exterior of the plastic or ceramics seal of the package, and a heat transfer cap held in surface contact with the extended heat transfer leads and covering upper side of the package. The heat generated in the semiconductor chip is transmitted to the upper side of the package and to the printed circuit board only through metallic parts so that the heat transfer is enhanced to remarkably reduce thermal resistance, thus enabling packaging of a semiconductor chip having a large heat generation rate.

Abstract: A dry etching apparatus is disclosed, in which the temperature of an article to be etched, placed on a wafer table, is controlled by a liquefied gas and a heater and the height of the surface of the liquefied gas can be varied arbitrarily. This apparatus enables the controlling of the temperature of the article to be done with a high accuracy over a wide range of low levels. Therefore, a low-temperature dry etching operation, which cannot otherwise be attained by a conventional apparatus of this kind, can be carried out.

Abstract: In a system for cooling electronic circuit devices to be tested, e.g., LSIs a cooling fluid is sprayed against the cooling surface of an electronic circuit device to cool the device, and also air is supplied in the opposite direction to the flow of the cooling fluid to form an air curtain, thereby preventing the cooling fluid from depositing on the electric circuitry of the devices.

Abstract: In a sealed structure consisting of ceramic members opposing each other and a frame coupled to the ceramic members and defining an He-tight chamber with the ceramic members, the melting point of a joint member for bonding one of the ceramic members to the frame is lower than the melting point of another joint member for bonding the other of the ceramic members to the frame so that rebonding can be made.

Abstract: The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer is provided at the surface part of the contact interface of a heat generating element or a heat sink element, and a liquid such as oil is contained in cavities formed in the porous layer, the heat generating element and the heat sink element being held in close contact by the surface tension of the liquid, whereby heat generated by the heat generating element is transferred to the heat sink element.

Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.

Abstract: In a heat transfer wall having a number of fine and elongate tunnels adjacent to each other with a minute distance under the surface thereof being in contact with liquid on the heat transfer wall, and a number of fine openings for communicating the tunnels to the outside thereof defined on ceilings of the tunnels along the longitudinal directions thereof with each minute distance, a tongue-like projection is provided which protrudes from an edge of the opening or vicinity of the opening across the opening 1 whereby a flow of fluid passing through the openings provided with the projections is controlled so that heat transfer performance characteristics are improved.

Abstract: In order to adapt a thermal head for a thermal printer to a raised speed, the thickness .delta.(.mu.m) of a heat accumulating layer in the head is set at: ##EQU1## where k: temperature conductivity of the heat accumulating layer,t.sub.p : heating duration of the thermal head, andt.sub.O : printing cycle of the thermal head.

Abstract: A heat-conducting cooling module for cooling a semiconductor substrate in an integrated circuit package assembly in which a semiconductor substrate is mounted on a base board by small solder pellets, and which contains a single substrate or laminated substrates. A heat-conducting relay member is provided between the semiconductor substrate and a housing so as to be pressed onto the semiconductor substrate. At least either one of the housing or the heat-conducting relay member is made of a sintered product which includes silicon carbide as a chief component.

Abstract: In a perforated heat conductive surface structure having voids under an outer surface and openings in the outer surface, in order to obtain a high performance in particular at a low pressure and low temperature region, there is provided a heat transfer wall in which a thickness of a wall at a ceiling of each void and a length of a passage of the respective openings are increased in predetermined ranges.

Abstract: In a heat transfer wall provided with a plurality of cells and restricted holes, the cells are formed in a plurality of laminated layers in a direction from an outer surface of the heat transfer wall to an inside thereof, and the cells of the upper and lower layers and the outside of the outer surface are communicated to one another through the holes.

Abstract: A thermal head is provided with a heat accumulating member disposed on a substrate, a plurality of heating resistors juxtaposed on the heat accumulating member in a manner to be spaced from each other, electrodes for supplying electric power to the heating resistors, and a protective member for preventing oxidation and wear of the heating resistors and the electrodes, these constituents being formed as layers. When the electric power is supplied to the electrodes, heat is generated by a heating portion of the heating resistor corresponding to the electrodes, and it is transmitted to a head surface via a thermally conductive member disposed in a printing dot portion of the protective member. The heat from the printing dot portion is used for effecting printing on a medium to-be-recorded through a thermosensitive sheet which lies in contact with the head surface.

Abstract: A liquid film evaporation type heat exchanger including a plurality of heat transfer units, with each unit including a plurality of flat heat transfer ducts of square cross section formed with a plurality of warm water passageways extending perpendicular to the direction of flow of a liquid medium, and a plurality of liquid distributing beams formed with a pluraity of cutouts. The heat transfer ducts and the liquid distributing beams being alternately arranged in the respective units, with the heat transfer units being arranged at locations spaced apart from each other in the direction of flow of the liquid medium. Vapor releasing ports are formed in positions between the adjacent heat transfer units. Each heat transfer duct has on either side surface thereof a porous material layer providing a heat exchange surface on which a film of the liquid medium is formed for evaporation.

Abstract: In a heat transfer surface having cavity groups and restricted opening groups in an outer surface region, the cavity groups are composed of a plurality of rows of void strip members. The cavity strip members are arranged in parallel on a base member of the heat transfer surface and are laminated in one or more layers. Each strip member has a number of elongate cavities laterally arranged in parallel. The elongate cavities are closed at upper surfaces and have at both ends openings. The adjacent cavities in the same layer are communicated with each other by communicating portions each provided between the cavity strip members and by the openings. The restricted opening groups are formed on the upper surfaces of the communicating portions. The restricted opening groups render the communicating portions in one layer, the communicating portions in another layer and the outside to communicate with each another. The method of manufacturing such a heat transfer surface is also disclosed.

Abstract: A cooling module for integrated circuit chips comprising a plurality of integrated circuit chips mounted on a wiring substrate, cooling members respectively provided for integrated circuit chips, each of the cooling members having therein space for circulating the coolant, and flexible pipes connected to respective cooling members, the coolant being caused to flow into or out of said space of said cooling member through the flexible pipes in order to remove heat from the integrated circuit chip.

Abstract: In a magnetic refrigerator comprising working substances for the magnetic refrigeration and a magnetic field generating device which magnetizes and demagnetizes these working substances, this magnetic refrigerator is provided with a plurality of superconducting coils arranged around the outer periphery of a rotor, a plurality of working substances are arranged around the periphery of said rotor, and the rotor is rotated so that the strength of magnetic fields impressed on the working substances is varied.

Abstract: A falling film evaporation type heat exchanger of the shell-tube type which includes an outer shell or main body portion and a plurality of individual heat transfer tubes disposed therein, with the heat transfer tubes extending substantially in a vertical direction. A liquid refrigerant is caused to freely fall from upper portions of the heat transfer tubes along the outer peripheral surfaces of the tubes and the evaporation of the thin refrigerant film, formed on the outer peripheral surface of the heat transfer tubes effects the transfer.

Abstract: A magnetic refrigerating apparatus including a working material for performing magnetic refrigeration, and a magnetic field system capable of varying the distribution or intensity of a magnetic field impressed on the working material. When the working material produces heat on the high temperature side, heat exchange is performed by boiling heat transfer through a refrigerant on the high temperature side; when the working material absorbs heat on the low temperature side, heat exchange is performed by condensation heat transfer through a refrigerant on the low temperature side.

Abstract: A plurality of winding units each composed of a wire element are serially arranged in the axial direction of the winding between an inner insulating sleeve and an outer insulating sleeve, and vertical cooling paths are formed on opposite sides of each winding unit and horizontal cooling paths are formed between adjacent winding units. The winding units are divided into a plurality of winding sub-units to define a central vertical cooling path therebetween, which central vertical cooling path includes a via flow path and a branch inducing flow path, whereby cooling fluid flows in opposite directions and at substantially the same speed in the horizontal cooling paths along upper and lower surfaces of each of the winding units having the branch inducing flow path. In this manner, the entire winding is uniformly cooled.