Patents by Inventor Takahiro Hayashi

Takahiro Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10813217
    Abstract: Disclosed is a wiring board including: an insulating substrate; a plurality of connection terminals arranged on the insulating substrate; and a plurality of non-conductive protruding parts respectively arranged on areas of the insulating substrate except areas on which the plurality of connection terminals are arranged. The non-conductive protruding parts has a height greater than that of the connection terminals.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: October 20, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takahiro Hayashi, Tomoaki Mizutani
  • Patent number: 10697643
    Abstract: In a cooker according to the present disclosure, a convection heater for executing a convection mode and a circulation fan are disposed in a convection forming space that is in communication with a heating chamber, and a fan driver is disposed outside of the convection forming space. The cooker includes a leakage suppression mechanism for suppressing a microwave leak from the convection forming space. The leakage suppression mechanism is formed by a coaxial seal for setting a distance between opposing faces, i.e., between a circulation fan shaft passing through a first wall forming the convection forming space and the first wall to a predetermined distance or smaller. Therefore, a microwave leak from a mechanism for executing the convection mode is suppressed, and heat cooking with a microwave-heating mode can highly effectively be performed.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: June 30, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Seiichi Yamashita, Takahiro Hayashi
  • Patent number: 10665768
    Abstract: A thermoelectric conversion module package includes: a thermoelectric conversion module including a first and a second substrate opposed to each other, a plurality of thermoelectric elements arranged between the first and second substrates, and a first and a second lead wire drawn out from one of the first and second substrates; and a package including a first metal foil covering the first substrate of the thermoelectric conversion module, a second metal foil covering the second substrate of the thermoelectric conversion module, a resin portion hermetically connecting the first metal foil and the second metal foil along an outer edge portion of the thermoelectric conversion module, and an insertion portion for hermetically passing the first and second lead wires through the resin portion.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: May 26, 2020
    Assignees: YAMAHA CORPORATION, TOPPAN PRINTING CO., LTD., TOYOTA TSUSHO CORPORATION
    Inventors: Tetsutsugu Hamano, Takahiro Hayashi, Yuma Horio, Tomoaki Taniguchi, Yuki Muroi, Takashi Nakamura
  • Patent number: 10609772
    Abstract: In a microwave heating device of the present disclosure, inverter unit drives first and second microwave generators. Cooling unit cools first and second microwave generators and inverter unit. First and second waveguides supplies, to cavity, microwaves generated by first and second microwave generators. First and second microwave generators are disposed side by side in a right-left direction below a bottom surface of cavity. Inverter unit and cooling fan are disposed from the first and second microwave generators toward a front side in order, and first and second waveguides are provided so as to extend in a front-back direction from first and second microwave generators, respectively. According to the present disclosure, the microwave heating device can be further downsized in a right-left direction.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: March 31, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takahiro Hayashi, Yuichi Otsuki, Seiichi Yamashita, Mikio Fukui, Toshifumi Kamiya
  • Publication number: 20200061614
    Abstract: A microfluidic chip includes a flow passage plate, a flat plate, and an annular seal. In the flow passage plate, a recess forming a flow passage for liquid and a communication hole communicating with the recess are formed. The flat plate is stacked on or under the flow passage plate to close the recess for defining the flow passage. In the flat plate, a communication through-hole communicating with the recess is formed. The annular seal is located on, or formed on, an outer surface of at least one of the flow passage plate and the flat plate, the annular seal surrounding at least one of the communication hole and the communication through-hole. The annular seal is made of an elastomer.
    Type: Application
    Filed: September 19, 2018
    Publication date: February 27, 2020
    Applicant: NOK CORPORATION
    Inventors: Takayuki KOMORI, Takahiro HAYASHI
  • Publication number: 20200029431
    Abstract: A wiring substrate has a substrate body formed by a single or a plurality of insulating layers and having front and back surfaces located at opposite sides of the substrate body; a plurality of pads formed on at least one of the front surface, the back surface and an inner layer surface that is located between the front and back surfaces, and having a staggered arrangement in plan view; and a plurality of via conductors formed at each of the pads, extending in a thickness direction of the substrate body with the plurality of via conductors being parallel to each other and connecting the pads located on different surfaces. Arrangement, in plan view, of the plurality of via conductors connecting to the pad and arrangement, in plan view, of the plurality of via conductors connecting to an adjacent pad located on the same surface are different from each other.
    Type: Application
    Filed: July 8, 2019
    Publication date: January 23, 2020
    Inventor: Takahiro HAYASHI
  • Publication number: 20190378966
    Abstract: A thermoelectric conversion module includes: a substrate; a plurality of thermoelectric elements including an N-type element and a P-type element; a bonding layer including silver and disposed between the substrate and the plurality of thermoelectric elements; a first electrode that connects the N-type element with the bonding layer, the first electrode including a first nickel layer and an aluminum layer that is disposed between the first nickel layer and the N-type element; and a second electrode that connects the P-type element with the bonding layer, the second electrode including a second nickel layer.
    Type: Application
    Filed: June 5, 2019
    Publication date: December 12, 2019
    Inventors: Kazushi SAKURAUCHI, Takahiro HAYASHI
  • Publication number: 20190373727
    Abstract: A wiring board includes: a wiring-board body including a first surface and a second surface opposite to the first surface, and including at least one insulator layer; pads formed at at least one of an internal layer boundary plane and the first surface and the second surface defining a first plane; and via conductors connected to corresponding ones of the pads, and arranged in parallel to extend in a thickness direction of the wiring-board body. Each of first and second ones of the pads adjacent to each other in planar view at the first plane is connected to corresponding ones of the via conductors. The via conductors corresponding to the first pad are arranged differently from the via conductors corresponding to the second pad, in planar view.
    Type: Application
    Filed: May 11, 2018
    Publication date: December 5, 2019
    Inventors: Takahiro HAYASHI, Takuya HANDO
  • Patent number: 10476085
    Abstract: A unit cell that constitutes a fuel cell stack is obtained by sandwiching an electrolyte mem-brane/electrode structure with a cathode-side separator and an anode-side separator. A first resin member is provided along the entire periphery of the cathode-side separator in the outer peripheral portion of the cathode-side separator. Surfaces of the cathode-side separator are provided with sealing parts that cover a part of the first resin member and constitute a first sealing member.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: November 12, 2019
    Assignees: Honda Motor Co., Ltd., NOK Corporation
    Inventors: Satoshi Oyama, Go Morimoto, Satoru Terada, Shuhei Goto, Akihito Giga, Takahiro Hayashi, Takeshi Masaka, Satomi Yogo, Shotaro Koga
  • Patent number: 10378409
    Abstract: An object of the present disclosure is to provide an exhaust gas purification catalyst demonstrating superior storage of NOx contained in exhaust gas. The exhaust gas purification catalyst of the present disclosure has a substrate, a first catalyst layer containing a catalytic metal for NOx reduction and a NOx storage material and formed on the substrate, and a second catalyst layer containing a catalytic metal for NOx oxidation and formed on the first catalyst layer. In the exhaust gas purification catalyst of the present disclosure, the value obtained by dividing the volume of all large pores having a pore volume of 1000 ?m3 or more by the total volume of all medium pores of having a pore volume of 10 ?m3 to 1000 ?m3 in the second catalyst layer is 2.44 or less.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: August 13, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Jota Yamauchi, Takahiro Hayashi, Masaya Ibe, Satoru Katoh, Tsuyoshi Hamaguchi, Toshiyuki Tanaka
  • Patent number: 10370506
    Abstract: Provided are a carbon fiber thermoplastic resin prepreg which is a carbon fiber prepreg obtained by impregnating a PAN-based carbon fiber in which the average fiber fineness of a single fiber is 1.0 dtex to 2.4 dtex with a thermoplastic resin, wherein the thermoplastic resin satisfies 20?(FM/FS)?40 (where FM: flexural modulus (MPa) of a resin sheet comprising only the thermoplastic resin, and FS: flexural strength (MPa) of the resin sheet), a method for manufacturing the same, and a carbon fiber composite material employing the carbon fiber prepreg.
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: August 6, 2019
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Masao Tomioka, Takahiro Hayashi, Saki Fujita, Takeshi Ishikawa, Keigo Yoshida, Takuya Teranishi, Atsushi Takahashi, Kenichi Watanabe, Morio Katagiri, Akinobu Sasaki, Masahiro Oosuka, Hiroshi Tategaki, Takayuki Kobayashi
  • Patent number: 10370507
    Abstract: Provided are a carbon fiber thermoplastic resin prepreg which is a carbon fiber prepreg obtained by impregnating a PAN-based carbon fiber in which the average fiber fineness of a single fiber is 1.0 dtex to 2.4 dtex with a thermoplastic resin, wherein the thermoplastic resin satisfies 20?(FM/FS)?40 (where FM: flexural modulus (MPa) of a resin sheet comprising only the thermoplastic resin, and FS: flexural strength (MPa) of the resin sheet), a method for manufacturing the same, and a carbon fiber composite material employing the carbon fiber prepreg.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: August 6, 2019
    Assignee: Mistubishi Chemical Corporation
    Inventors: Masao Tomioka, Takahiro Hayashi, Saki Fujita, Takeshi Ishikawa, Keigo Yoshida, Takuya Teranishi, Atsushi Takahashi, Kenichi Watanabe, Morio Katagiri, Akinobu Sasaki, Masahiro Oosuka, Hiroshi Tategaki, Takayuki Kobayashi
  • Patent number: 10363694
    Abstract: A method has the steps of forming a lot of potting portions made of a rubber-like elastic material at appropriate intervals in respect of an extending direction of the gasket main body in the one side in the thickness direction in the peripheral edge portion of the plate in such a manner as to be positioned in a forming area of the gasket main body, next, pinching a portion constructed by the peripheral edge portion of the plate and the potting portion between inner surfaces of a gasket forming cavity of the metal mold and bringing the other side in the thickness direction of the peripheral edge portion into close contact with the one inner surface of the cavity by positioning and arranging the plate within the metal mold and clamping the mold, and filling a liquid rubber material into the cavity and curing the liquid rubber material.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: July 30, 2019
    Assignee: NOK Corporation
    Inventor: Takahiro Hayashi
  • Patent number: 10368403
    Abstract: Heating cooker (30) of the present disclosure includes convection device (35) that includes fan (14), heater (13), a first air guide, and second air guide, is communicated with heating chamber (2) through a suction port and a discharge port provided in back wall (2d) of heating chamber (2), and supplies hot air to the heating chamber (2). Fan (14) sucks air inside heating chamber (2) from the suction port into convection device (35), and sends out the air from the discharge port into heating chamber (2). Heater (13) is provided in front of fan (14), and heats the sucked air. The first air guide is provided so as to surround heater (13), and guides the heated air to the discharge port. The second air guide is provided so as to surround fan (14) and the first air guide, and guides the heated air to the discharge port. A part of the second air guide is in contact with the first air guide, and another part of the second air guide is isolated from the first air guide.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: July 30, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takahiro Hayashi, Yuichi Otsuki, Seiichi Yamashita, Mikio Fukui, Toshifumi Kamiya
  • Patent number: 10350799
    Abstract: The purpose of this invention is to make it easy to handle all-rubber gaskets. To achieve this purpose, a gasket is characterized in that a gasket body of only rubber is combined with a carrier film that is made from a resin film to hold the gasket body in a non-adhesive state. A three-dimensional portion having a shape that is deformed along the external shape of the gasket body is provided at a position where the gasket body and a plane of the carrier film overlap, and a portion of the gasket body is contained in the three-dimensional section. The gasket body is used as a gasket for fuel cells incorporated into a fuel cell stack.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: July 16, 2019
    Assignee: NOK Corporation
    Inventors: Hidetoshi Saso, Yoshihiro Kurano, Takayuki Horimoto, Tetsuya Urakawa, Kenichi Oba, Takuro Nishimura, Hajime Yui, Takahiro Hayashi
  • Publication number: 20190081226
    Abstract: A thermoelectric conversion module package includes: a thermoelectric conversion module including a first and a second substrate opposed to each other, a plurality of thermoelectric elements arranged between the first and second substrates, and a first and a second lead wire drawn out from one of the first and second substrates; and a package including a first metal foil covering the first substrate of the thermoelectric conversion module, a second metal foil covering the second substrate of the thermoelectric conversion module, a resin portion hermetically connecting the first metal foil and the second metal foil along an outer edge portion of the thermoelectric conversion module, and an insertion portion for hermetically passing the first and second lead wires through the resin portion.
    Type: Application
    Filed: October 12, 2018
    Publication date: March 14, 2019
    Inventors: Tetsutsugu HAMANO, Takahiro HAYASHI, Yuma HORIO, Tomoaki TANIGUCHI, Yuki MUROI, Takashi NAKAMURA
  • Patent number: 10212765
    Abstract: In a heat cooking device equipped with a memory card attaching mechanism for inserting a memory card, the memory card attaching mechanism is configured to have, on a lower face of a main body of the heat cooking device, a card insertion port for inserting the memory card vertically upward. The card insertion port is configured to be hidden by a front grille panel attached to a machine chamber lying under the main body so as not to be exposed from the heat cooking device. Therefore, the reliable commercial heat cooking device that does not require a special waterproof measure can be provided.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: February 19, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Toshifumi Kamiya, Takahiro Hayashi
  • Patent number: 10210692
    Abstract: Provided is a coin storage cassette capable of preventing a coin payout failure without requiring a change in the structure of conventional coin handling apparatuses, even when an adapter tube for changing the apparent inner diameter of a coin tube is mounted. 1: An upper rear notch 61 is formed on the back face side of the adapter tube 6, projection-shaped attachment portions 64 are formed on opposing outside portions of the adapter tube 6, and groove-shaped attachment reception portions 32 are formed in the coin tube 21, each attachment portion 64 being engaged into a respective one of the attachment reception portions 32, and the attachment reception portions 32 restricting top-to-bottom and front-to-rear movement of the adapter tube 6; and the adapter tube 6 is detachable from the rear side of the coin storage cassette 1, while a cover 4 is widely opened.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: February 19, 2019
    Assignee: Nippon Conlux Co., Ltd.
    Inventor: Takahiro Hayashi
  • Patent number: 10140798
    Abstract: A coin tube in which coins falling from an upper side are loaded and stored, the coin tube includes: a coin posture conversion unit, configured to convert a falling posture of a coin, at a coin entry port. The coin posture conversion unit has a shape asymmetric to a center line cl in a progressing direction of the coin on the coin posture conversion unit. The coin tube can suppress generation of coin erection.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: November 27, 2018
    Assignee: NIPPON CONLUX CO., LTD.
    Inventors: Masashi Kondo, Fumio Yuzawa, Takahiro Hayashi
  • Patent number: 10123415
    Abstract: A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: November 6, 2018
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takahiro Hayashi, Seiji Mori, Tatsuya Ito