Abstract: To provide a plating apparatus that prevents or reduces a diversion of an electric field. According to one embodiment, a plating apparatus for performing a plating process on a substrate held onto a substrate holder is provided. The plating apparatus includes a plating tank configured to receive the substrate holder holding the substrate, a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank, and a moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank.

Abstract: An imaging module includes: an object lens; an image-sensing device; a holder that holds the object lens and the image-sensing device, the holder having a butt-contact portion with which the object lens is able to be brought into contact from an object side; and an aperture stop arranged closer to the object than the butt-contact portion, wherein an area that is to be light-shielded by an outer-periphery of the aperture stop is larger than an internal diameter of the butt-contact portion.

Abstract: An operation control system for a hybrid vehicle capable of causing the vehicle to travel in parallel mode in which front wheels of the vehicle are driven by an engine and a front motor, capable of fuel cut control to stop fuel supply to the engine during deceleration of the vehicle, and capable of regenerative braking using the front motor, wherein when the vehicle traveling in parallel mode is to be decelerated and SOC of a traction battery is lower than or equal to an electricity-generation determination lower limit value Sbu, Sbd, a hybrid control unit performs first charging promotion control to brake the vehicle by regenerative braking while causing the engine to continue operating by continuing fuel supply.

Abstract: A tablet includes a base body and multiple medicine layers stacked inside the base body with a gap between each other in a first direction and including a drug active ingredient. The base body includes multiple inner layers located between adjacent medicine layers in the first direction. The inner layers have a solubility lower than that of the medicine layers.

Abstract: A ceramic electronic component includes a stack including ceramic layers and internal electrodes stacked alternately, and external electrodes provided on a surface of the stack and electrically connected to the internal electrodes. The internal electrodes include a melting trigger portion that melts earlier than any other portion. The ceramic layer adjacent to the internal electrode including the melting trigger portion includes a cavity. The cavity is provided at a position at which the cavity overlaps the melting trigger portion at least partially in a stacking direction of the internal electrodes. The cavity is open on a melting trigger portion side. A surface of at least one of the stack and the external electrodes is provided with an identifier that serves as a marker indicating use of the ceramic electronic component with the cavity vertically below the melting trigger portion.

Abstract: When an electronic mail is transmitted, a computer outputs to a display device a transmission confirmation screen on which a destination or an attached file name is displayed, the destination or the attached file name being different from a destination or an attached file name that has been set by a user in the electronic mail, and on which whether transmission of the electronic mail will be performed is selectable. Upon receipt of selection of whether the transmission will be performed, the computer outputs to the display device message information that varies according to a result of the selection of whether the transmission will be performed on the transmission confirmation screen.

Abstract: The present invention provides an agrochemical granule comprising: an oil-non-absorbing carrier; and a layer that coats the oil-non-absorbing carrier, wherein the layer comprises a synthetic pyrethroid compound, an organic solvent whose vapor pressure at 25° C. is equal to or lower than 1.0 Pa, an oil-absorbing carrier, a binding agent, a nonionic surfactant and a dodecylbenzenesulfonate, and having an excellent control efficacy against pest.

Abstract: The present invention provides an agrochemical granule comprising: an oil-non-absorbing carrier; and a layer that coats the oil-non-absorbing carrier, wherein the layer comprises a synthetic pyrethroid compound, an organic solvent whose vapor pressure at 25° C. is equal to or lower than 1.0 Pa, an oil-absorbing carrier, a binding agent, a nonionic surfactant and a dodecylbenzenesulfonate, and having an excellent control efficacy against pest.

Abstract: A multilayer electronic component includes first, second, and third ceramic layers, first and second inner electrodes, and a via-electrode. The first, second and third ceramic layers are sequentially stacked on each other. The first inner electrode is sandwiched between the first and second ceramic layers. The second inner electrode is sandwiched between the second and third ceramic layers. The via-electrode electrically connects the first and second inner electrodes. A projection is integrally provided with the via-electrode. The projection projects from the via-electrode towards an outer peripheral direction and is inserted into the second ceramic layer in a layered arrangement.

Abstract: In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.

Abstract: A method for manufacturing an electronic component, and a device for manufacturing the electronic component, which can easily achieve alignment by inserting multilayer chips into cavities formed in a pallet, and form external electrodes with a high degree of dimensional accuracy. A plurality of multilayer chips each composed of a laminated body with a plurality of ceramic layers and a plurality of internal electrode layers is inserted into each of a plurality of cavities formed in a pallet, and the plurality of multilayer chips is aligned by moving each of the plurality of multilayer chips to one of inner wall surfaces forming the cavity. A conductive ink is applied onto ends of the plurality of aligned multilayer chips, including the upper surface of the pallet, and the conductive ink applied is dried to form external electrodes on the plurality of multilayer chips.

Abstract: A ceramic electronic component which is easily downsized, has reduced difficulty in handling, and is hardly chipped in a chip; and a method for producing the ceramic electronic component. The method includes the steps of: forming an uncured ceramic pattern which forms a ceramic layer after firing and has a circular plane shape by applying a ceramic slurry, which contains a ceramic material, to a predetermined location one time or a plurality of times repeatedly using a non-contact-type printing device such as an ink-jet printer; and forming uncured internal electrode patterns which form internal electrodes after firing and each have a circular plane shape by applying an electrode paste, which contains an internal electrode material, to a predetermined location one time or a plurality of times repeatedly using an ink-jet printer.

Abstract: A multilayer electronic component includes first, second, and third ceramic layers, first and second inner electrodes, and a via-electrode. The first, second and third ceramic layers are sequentially stacked on each other. The first inner electrode is sandwiched between the first and second ceramic layers. The second inner electrode is sandwiched between the second and third ceramic layers. The via-electrode electrically connects the first and second inner electrodes. A projection is integrally provided with the via-electrode. The projection projects from the via-electrode towards an outer peripheral direction and is inserted into the second ceramic layer in a layered arrangement.

Abstract: A multilayer electronic component includes outer electrodes each including an outer electrode main body electrically conducted to an internal electrode and entering portions that project from the outer electrode main body as a base end and enter into the electronic component element through an end surface of the electronic component element. The entering portions each include a slope relative to a principal surface in a flat region including a major portion of the internal electrode.

Abstract: An electronic component includes a first external electrode disposed on a first end surface and a second external electrode disposed on a second end surface. The first external electrode includes a first conductive layer including ceramic particles. The second external electrode includes a second conductive layer including ceramic particles. An end portion of a first internal electrode is located inside the first conductive layer. The electronic component includes little or no cracks and has a low equivalent series resistance (ESR).

Abstract: A ceramic electronic component includes an electronic component ceramic main body and internal electrodes disposed within the electronic component main body. The internal electrodes include through holes passing through the internal electrodes in the thickness direction. Ceramic columns are disposed in the through holes and connect the ceramic on one side of the internal electrodes and the ceramic on the other side thereof. An area ratio of the ceramic columns to ends of the internal electrodes located within the electronic component main body is greater than an area ratio of ceramic columns to central portions of the internal electrodes.

Abstract: A multilayer ceramic electronic component includes a multilayer body including ceramic layers and inner electrode layers, the inner electrode layers being disposed on interfaces between the ceramic layers, and an outer electrode on an external surface of the multilayer body and electrically connected to first end portions of the inner electrode layers exposed to the external surface of the multilayer body. Each of the ceramic layers includes a thin portion with a continuously reducing thickness near the first end portion. Each inner electrode layer includes a thick portion near a connection with the outer electrode, the thick portion having a thickness continuously increasing toward the connection on a first side in accordance with a shape of the thin portion in the ceramic layer.

Abstract: In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.

Abstract: A multilayer electronic component includes outer electrodes each including an outer electrode main body electrically conducted to an internal electrode and entering portions that project from the outer electrode main body as a base end and enter into the electronic component element through an end surface of the electronic component element. The entering portions each include a slope relative to a principal surface in a flat region including a major portion of the internal electrode.

Abstract: A method for manufacturing an electronic component, and a device for manufacturing the electronic component, which can easily achieve alignment by inserting multilayer chips into cavities formed in a pallet, and form external electrodes with a high degree of dimensional accuracy. A plurality of multilayer chips each composed of a laminated body with a plurality of ceramic layers and a plurality of internal electrode layers is inserted into each of a plurality of cavities formed in a pallet, and the plurality of multilayer chips is aligned by moving each of the plurality of multilayer chips to one of inner wall surfaces forming the cavity. A conductive ink is applied onto ends of the plurality of aligned multilayer chips, including the upper surface of the pallet, and the conductive ink applied is dried to form external electrodes on the plurality of multilayer chips.