Patents by Inventor Takahiro Nanjo
Takahiro Nanjo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11260493Abstract: A substrate processing apparatus which causes a processing tape to abut against a processing object, including: a tape supply reel configured to supply the processing tape; a tape recovery reel configured to recover the processing tape; a recovery motor configured to apply a torque to the tape recovery reel; a tape feed motor configured to feed the processing tape between the tape supply reel and the tape recovery reel; and a control unit configured to control the tape feed motor, wherein the control unit controls the torque of the recovery motor depending on a change in an outer diameter of a roll of the processing tape wound by the tape recovery reel such that tension applied to the processing tape is constant, using a feed length of the tape fed by the tape feed motor and a thickness of the processing tape.Type: GrantFiled: January 11, 2019Date of Patent: March 1, 2022Assignee: EBARA CORPORATIONInventors: Minoru Harada, Takahiro Nanjo, Hiroyuki Takenaka, Naoki Matsuda
-
Publication number: 20220005716Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.Type: ApplicationFiled: July 9, 2019Publication date: January 6, 2022Inventors: Akihiro Yazawa, Takashi Koba, Kenichi Kobayashi, Kenichi Akazawa, Fong-Jie Du, Makoto Kashiwagi, Asagi Matsugu, Takahiro Nanjo, Hideharu Aoyama, Takashi Mitsuya, Tetsuji Togawa
-
Publication number: 20190217438Abstract: A substrate processing apparatus which causes a processing tape to abut against a processing object, including: a tape supply reel configured to supply the processing tape; a tape recovery reel configured to recover the processing tape; a recovery motor configured to apply a torque to the tape recovery reel; a tape feed motor configured to feed the processing tape between the tape supply reel and the tape recovery reel; and a control unit configured to control the tape feed motor, wherein the control unit controls the torque of the recovery motor depending on a change in an outer diameter of a roll of the processing tape wound by the tape recovery reel such that tension applied to the processing tape is constant, using a feed length of the tape fed by the tape feed motor and a thickness of the processing tape.Type: ApplicationFiled: January 11, 2019Publication date: July 18, 2019Inventors: Minoru Harada, Takahiro Nanjo, Hiroyuki Takenaka, Naoki Matsuda
-
Patent number: 10354900Abstract: Disclosed is a substrate transfer apparatus including: a pair of hands facing with each other; an opening/closing mechanism configured to move the pair of hands symmetrically in an opening/closing direction; a driving unit configured to transmit a power to the opening/closing mechanism; and a controller configured to control an operation of the driving unit. The opening/closing mechanism includes: a rotating body configured to rotate depending on a moving amount of the pair of hands in the opening/closing direction, and a sensor configured to detect a rotating amount of the rotating body. The controller controls an operation of the driving unit based on a signal from the sensor.Type: GrantFiled: November 21, 2016Date of Patent: July 16, 2019Assignee: Ebara CorporationInventors: Akihiro Yazawa, Kenichi Kobayashi, Takahiro Nanjo, Hiroyuki Takenaka
-
Publication number: 20170178940Abstract: Disclosed is a substrate transfer apparatus including: a pair of hands facing with each other; an opening/closing mechanism configured to move the pair of hands symmetrically in an opening/closing direction; a driving unit configured to transmit a power to the opening/closing mechanism; and a controller configured to control an operation of the driving unit. The opening/closing mechanism includes: a rotating body configured to rotate depending on a moving amount of the pair of hands in the opening/closing direction, and a sensor configured to detect a rotating amount of the rotating body. The controller controls an operation of the driving unit based on a signal from the sensor.Type: ApplicationFiled: November 21, 2016Publication date: June 22, 2017Inventors: Akihiro Yazawa, Kenichi Kobayashi, Takahiro Nanjo, Hiroyuki Takenaka
-
Patent number: 7208074Abstract: A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.Type: GrantFiled: December 22, 2003Date of Patent: April 24, 2007Assignee: Ebara CorporationInventors: Koji Mishima, Junji Kunisawa, Natsuki Makino, Norio Kimura, Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Takahiro Nanjo, Mitsuko Odagaki
-
Publication number: 20060027452Abstract: A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.Type: ApplicationFiled: September 27, 2005Publication date: February 9, 2006Inventors: Koji Mishima, Junji Kunisawa, Natsuki Makino, Norio Kimura, Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Takahiro Nanjo, Mitsuko Odagaki
-
Publication number: 20040134789Abstract: A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.Type: ApplicationFiled: December 22, 2003Publication date: July 15, 2004Inventors: Koji Mishima, Junji Kunisawa, Natsuki Makino, Norio Kimura, Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Takahiro Nanjo, Mitsuko Odagaki
-
Patent number: 6689257Abstract: A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.Type: GrantFiled: May 25, 2001Date of Patent: February 10, 2004Assignee: Ebara CorporationInventors: Koji Mishima, Junji Kunisawa, Natsuki Makino, Norio Kimura, Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Takahiro Nanjo, Mitsuko Odagaki
-
Publication number: 20020000371Abstract: A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to load and unload a substrate, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.Type: ApplicationFiled: May 25, 2001Publication date: January 3, 2002Inventors: Koji Mishima, Junji Kunisawa, Natsuki Makino, Norio Kimura, Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Takahiro Nanjo, Mitsuko Odagaki
-
Patent number: 6092542Abstract: A cleaning apparatus is used for cleaning a substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal panel with a cleaning member. The cleaning apparatus includes: a holding mechanism for holding a workpiece, an arm movable relative to the workpiece, a cleaning member mounted on the arm for cleaning the workpiece held by the holding mechanism, a moving mechanism for vertically moving the cleaning member with respect to the workpiece held by the holding mechanism, and a controller for controlling the moving mechanism to adjust the cleaning member to a setting height.Type: GrantFiled: March 26, 1999Date of Patent: July 25, 2000Assignee: Ebara CorporationInventors: Naoki Matsuda, Yoshiyuki Ohta, Kenya Ito, Takahiro Nanjo