Abstract: The present embodiment relates to a light-emitting device or the like having a structure capable of reducing one power of ±1st-order light with respect to the other power. The light-emitting device includes a substrate, a light-emitting portion, and a phase modulation layer including a base layer and a plurality of modified refractive index regions. Each of the plurality of modified refractive index regions has a three-dimensional shape defined by a first surface facing the substrate, a second surface positioned on a side opposite to the substrate with respect to the first surface, and a side surface. In the three-dimensional shape, at least one of the first surface, the second surface, and the side surface has a portion inclined with respect to a main surface.

Abstract: The embodiment relates to a light-emitting device in which a positional relationship between a modified refractive index region's gravity-center position and the associated lattice point differs from a conventional device, and a production method. In this device, a stacked body including a light-emitting portion and a phase modulation layer optically coupled to the light-emitting portion is on a substrate. The phase modulation layer includes a base layer and plural modified refractive index regions in the base layer. Each modified refractive index region's gravity-center position locates on a virtual straight line passing through a corresponding reference lattice point among lattice points of a virtual square lattice on the base layer's design plane. A distance between the reference lattice point and the modified refractive index region's gravity center along the virtual straight line is individually set such that this device outputs light forming an optical image.

Abstract: A clip main body of a clip may include a head portion, a pair of inner legs continuous with the head portion, and a pair of elastically deformable outer legs respectively continuous with distal end portions of the inner legs. The outer legs are configured such that when an extraction force is applied to the clip main body in an attached condition in which the clip main body connected to a coupling rib of an attachment base is inserted into and held in an attaching hole of an object member while pressing portions formed in distal end portions of the outer legs are respectively pressed to bearing surfaces formed in a bearing member, the pressing portions of the outer legs are respectively disengaged from the bearing surfaces of the bearing member before most-bulged portions formed in the outer legs pass through a rear surface-side periphery of the attaching hole.

Abstract: A semiconductor light emitting element that can form a useful beam pattern is provided. A semiconductor laser element LD includes an active layer 4, a pair of cladding layers 2 and 7 between which the active layer 4 is interposed, and a phase modulation layer 6 optically coupled to the active layer 4. The phase modulation layer 6 includes a base layer 6A and different refractive index regions 6B that are different in refractive index from the base layer 6A. The different refractive index regions 6B desirably arranged in the phase modulation layer 6 enable emission of laser light including a dark line with no zero-order light.

Abstract: A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 ?m and 10 ?m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.

Abstract: A signal transmission cable includes: at least one conductor including at least one wire; a covering layer coating the at least one conductor, the covering layer being made of an insulator; a coating layer coating a periphery of the covering layer; and a plated layer coating the coating layer, the plated layer being made of a material including a metallic material.

Abstract: The present embodiment relates to a semiconductor light emitting element having a structure that enables removal of zero-order light from output light of an S-iPM laser. The semiconductor light emitting element includes an active layer, a pair of cladding layers, and a phase modulation layer. The phase modulation layer has a base layer and a plurality of modified refractive index regions each of which is individually arranged at a specific position. One of the pair of cladding layers includes a distributed Bragg reflector layer which has a transmission characteristic with respect to a specific optical image outputted along an inclined direction with respect to a light emission surface and has a reflection characteristic with respect to the zero-order light outputted along a normal direction of the light emission surface.

Abstract: A linear shape member is composed of a linear shape electrical insulating body comprising irregularities on a surface, and a plating layer coating the surface of the electrical insulating body. An average irregularities spacing Sm of the irregularities is not more than 20.0 ?m.

Abstract: A linear shape member is composed of a linear shape electrical insulating body made of a fluoropolymer resin and including a plurality of crack shape grooves on a surface thereof, and a plating layer coating the surface of the electrical insulating body. The surface of the electrical insulating body meets at least either one of two conditions: that the surface of the electrical insulating body is not lower than 40 nm in arithmetic mean roughness Ra; and that the surface of the electrical insulating body is not lower than 80 nm in root mean square roughness Rms.

Abstract: A cable is composed of a linear shape conductor, a first electrical insulating member coating a periphery of the conductor, a shield made of a plating layer coating a surface of the first electrical insulating member, a second electrical insulating member coating a surface of the shield, and an exposed shield portion provided in at least one end portion of the cable with the second electrical insulating member being removed therefrom and the shield being exposed therein during termination. An adhesion strength between the shield and the second electrical insulating member in the exposed shield portion is lower than an adhesion strength between the shield and the second electrical insulating member in an other part of the surface of the shield.

Abstract: The present embodiment relates to a light-emitting device that enables reduction in attenuation or diffraction effect caused by a semiconductor light-emitting device with respect to modulated light outputted from a spatial light modulator, and the light-emitting device includes the semiconductor light-emitting device that outputs light from a light output surface and the reflection type spatial light modulator that modulates the light. The spatial light modulator includes a light input/output surface having the area larger than the area of a light input surface of the semiconductor light-emitting device, modulates light taken through a region facing the light output surface of the semiconductor light-emitting device in the light input/output surface, and outputs the modulated light from another region of the light input/output surface to a space other than the light input surface of the semiconductor light-emitting device.

Abstract: The present embodiment relates to a semiconductor light emitting element having a structure that enables removal of zero-order light from output light of an S-iPM laser. The semiconductor light emitting element includes an active layer, a pair of cladding layers, and a phase modulation layer. The phase modulation layer has a base layer and a plurality of modified refractive index regions each of which is individually arranged at a specific position. One of the pair of cladding layers includes a distributed Bragg reflector layer which has a transmission characteristic with respect to a specific optical image outputted along an inclined direction with respect to a light emission surface and has a reflection characteristic with respect to the zero-order light outputted along a normal direction of the light emission surface.

Abstract: A clip may have a clip main body that is configured to be coupled to a coupling rib of an attachment base formed in an attaching article and to be inserted into an attaching hole formed in an object member. The clip main body may include a head portion, a pair of engagement legs continuous with the head portion and elastically deformable inward and outward about the head portion, and a pair of retainer members continuous with the head portion and respectively configured to engage the coupling rib of the attachment base. The engagement legs respectively have first bent portions, second bent portions, and engagement portions positioned between the first and second bent portions and configured to engage an inner peripheral edge of the attaching hole. The engagement legs respectively have space-limiting portions that are respectively formed in inner surfaces thereof along the second bent portions thereof.

Abstract: A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 ?m and 10 ?m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.

Abstract: A metasurface is capable of modulating input light including a wavelength in a range of 880 nm to 40 ?m. The metasurface includes: a GaAs substrate including a light input surface into which input light is input and a light output surface facing the light input surface; an interlayer having a lower refractive index than GaAs and disposed on the light output surface side of the GaAs substrate; and a plurality of V-shaped antenna elements disposed on a side of the interlayer which is opposite to the GaAs substrate side and including a first arm and a second arm continuous with one end of the first arm.

Abstract: Provided is a differential signal transmission cable, a multi-core cable, and a method of manufacturing a differential signal transmission cable that can suppress an increase in differential-to-common mode conversion quantity. The differential signal transmission cable includes two signal lines, an insulation layer covering a periphery of the two signal lines, and a plating layer covering the insulation layer. Differential-to-common mode conversion quantity of the differential signal transmission cable has a maximum value of ?26 dB or less, in a frequency band of 50 GHz or less. In the method of manufacturing a differential signal transmission cable, dry ice blasting is performed on an outer peripheral surface of the insulation layer, and then corona discharge exposure is performed on the outer peripheral surface.

Abstract: The present embodiment relates to a semiconductor light-emitting element or the like including a structure for suppressing deterioration in the quality of an optical image caused by an electrode blocking a part of light outputted from a phase modulation layer. The semiconductor light-emitting element includes a phase modulation layer having a basic layer and a plurality of modified refractive index regions, and the phase modulation layer includes a first region at least partially overlapping the electrode along a lamination direction and a second region other than the first region. Among the plurality of modified refractive index regions, only one or more modified refractive index regions in the second region are disposed so as to contribute to formation of an optical image.

Abstract: A differential transmission cable module used for transmitting a differential signal between electronic devices. The module includes a cable including one inner conductor, a dielectric covering the inner conductor, and an outer conductor covering the dielectric, a sending-end substrate provided at one end of the cable, and a receiving-end substrate provided at an other end of the cable. The sending-end substrate includes two sending-end signal conductors, a sending-end ground conductor, and a sending-end signal converter for converting a differential signal transmitted through the sending-end conductors into a differential signal transmitted through the inner and outer conductors. The receiving-end substrate includes two receiving-end signal conductors, a receiving-end ground conductor, and a receiving-end signal converter for converting the differential signal transmitted through the inner and outer conductors into a differential signal transmitted through the receiving-end conductors.

Abstract: A connector connecting structure can block liquid leakage outside a liquid-filled case and reduce the size of the device including a number of elements and a liquid sealed case and the number of electrical connection points. A connector connecting structure is provided with a connector AT connector (first connector) fixed to an AT case, an ECU connector (second connector) connected to the AT connector (first connector), a first sealing member sealing a space between the AT case (liquid sealed case) and the AT connector (first connector), and a second sealing member sealing a space between an ECU side housing (second housing) and a male-type terminal (second terminal).

Abstract: In a semiconductor light emitting element provided with an active layer 4, a pair of cladding layers 2, 7 between which the active layer 4 is interposed, and a phase modulation layer 6 optically coupled to the active layer 4, the phase modulation layer 6 includes a base layer 6A and a plurality of different refractive index regions 6B having different refractive indices from the base layer 6A. When an XYZ orthogonal coordinate system having a thickness direction of the phase modulation layer 6 as a Z-axis direction is set and a square lattice of a virtual lattice constant a is set in an XY plane, each of the different refractive index regions 6B is disposed so that a centroid position G thereof is shifted from a lattice point position in a virtual square lattice by a distance r, and the distance r is 0<r?0.3a.