Patents by Inventor Takahiro Tominaga
Takahiro Tominaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12219735Abstract: A cooling device, including at least one of following: a casing and a flow channel that is disposed inside the casing, the casing including a metal portion and a resin portion that is bonded to at least a portion of the metal portion; a casing that includes a metal, a flow channel that is disposed inside the casing, and a component that includes a resin and is bonded to a surface of the casing, and a method of manufacturing the cooling device including the steps of a first process of bonding the component to the first metal member by injection molding and a second process of connecting the second metal member with the first metal member to which the component is bonded.Type: GrantFiled: May 15, 2020Date of Patent: February 4, 2025Assignee: MITSUI CHEMICALS, INC.Inventors: Takahiro Tominaga, Kazuki Kimura
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Patent number: 11865750Abstract: A composite structure includes: a metal member; and a thermoplastic resin member bonded to the metal member, in which the metal member has a fine uneven structure at least on a metal surface to which the thermoplastic resin member is bonded, a hardness of the thermoplastic resin member measured by a type A durometer in accordance with JIS K6253 is in a range of equal to or more than A60 and equal to or less than A95, and an acid value of the thermoplastic resin member is equal to or more than 1 mgKOH/g and equal to or less than 100 mgKOH/g. The thermoplastic resin member preferably contains a urethane-based thermoplastic elastomer, an amide-based thermoplastic elastomer, and an acid-modified polyolefin.Type: GrantFiled: August 7, 2019Date of Patent: January 9, 2024Assignee: MITSUI CHEMICALS, INC.Inventors: Takahiro Tominaga, Kazuki Kimura
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Publication number: 20230341195Abstract: A heat exchange device includes a heat exchange main body portion, a joint member, and a resin sealing portion. The heat exchange main body portion has an internal flow path through which a heat exchange medium flows, and a metal wall portion including a through-hole communicating with the internal flow path. The joint member has a protruding portion and a hollow portion. The protruding portion includes an opening through which the heat exchange medium is supplied or discharged. The protruding portion protrudes toward an outside of the heat exchange main body portion through the through-hole. The hollow portion is formed for causing the opening and the internal flow path to communicate with each other. The resin sealing portion seals a gap between an inner peripheral surface of the through-hole and an outer peripheral surface of the protruding portion.Type: ApplicationFiled: July 13, 2021Publication date: October 26, 2023Applicant: MITSUI CHEMICALS, INC.Inventors: Takahiro TOMINAGA, Kazuki KIMURA
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Publication number: 20230145824Abstract: A member for electric conduction, comprising a metal member and a resin member that is joined to at least a part of a surface of the metal member, the metal member having a roughness index, which is obtained by dividing a true surface area (m2) measured by a krypton adsorption method by a geometric surface area (m2), of 4.0 or more.Type: ApplicationFiled: January 29, 2021Publication date: May 11, 2023Applicant: MITSUI CHEMICALS, INC.Inventors: Kazuki KIMURA, Tomoki TORII, Takahiro TOMINAGA, Kai MORIMOTO, Shinji NAKAJIMA, Isao WASHIO, Nobuyoshi SHIMBORI, Junya SHIMAZAKI, Jingjun ZHANG, Akinori AMANO, Haruka DOI
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Publication number: 20220247003Abstract: A cooling device including: a resin flow path which is provided with a space portion serving as a flow path in at least one surface; a metal cooling panel for cooling a heating element, which covers the space portion and of which at least a part is in contact with the resin flow path; and a resin bonding member for bonding the resin flow path and the metal cooling panel, in which the metal cooling panel has a fine uneven structure at least on a surface of a bonding portion with the resin bonding member, and the metal cooling panel and the resin bonding member are bonded by allowing a part of the resin bonding member to enter into the fine uneven structure.Type: ApplicationFiled: June 12, 2020Publication date: August 4, 2022Applicant: MITSUI CHEMICALS, INC.Inventors: Kazuki KIMURA, Takahiro TOMINAGA, Mizue KURIYAGAWA, Tomoki TORII, Kyohei NOMOTO
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Publication number: 20220224001Abstract: Provided is an electronic device housing including a metal member and a plastic antenna cover that are joined and integrated by insert molding. In this electronic device housing, the plastic antenna cover is a molded product of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250° C.Type: ApplicationFiled: April 21, 2020Publication date: July 14, 2022Applicant: MITSUI CHEMICALS, INC.Inventors: Takahiro TOMINAGA, Kai MORIMOTO, Kazuki KIMURA, Wataru MAKIGUCHI, Kosuke UEDA
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Patent number: 11375632Abstract: A dissimilar material joint including a joined portion between a resin rib and a metal base, in which the metal base forms a protrusion protruding inside of the resin rib on at least a part of the joined portion.Type: GrantFiled: February 26, 2019Date of Patent: June 28, 2022Assignee: MITSUI CHEMICALS, INC.Inventors: Takahiro Tominaga, Kazuki Kimura, Masaki Misumi, Nobuyoshi Shinbori
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Publication number: 20220124943Abstract: A cooling device, satisfying at least one of following (1) or (2): (1) comprising a casing and a flow channel that is disposed inside the casing, the casing comprising a metal portion and a resin portion that is bonded to at least a portion of the metal portion. (2) comprising a casing that comprises a metal, a flow channel that is disposed inside the casing, and a component that comprises a resin and is bonded to a surface of the casing.Type: ApplicationFiled: May 15, 2020Publication date: April 21, 2022Applicant: MITSUI CHEMICALS, INC.Inventors: Takahiro TOMINAGA, Kazuki KIMURA
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Publication number: 20220087062Abstract: A cooling unit (1) includes a resin tray (3), a metal plate (2) provided on one surface of the resin tray (3), and a flow path forming rib (5) provided in a space between the resin tray (3) and the metal plate (2), in which a top surface portion (3b) of a side wall portion (3a) of the resin tray (3) and the metal plate (2) are mechanically fastened via an elastic packing (4), the elastic packing (4) includes a bonding packing which is bonded to the metal plate (2) surface, and a fine uneven structure is formed on the metal plate (2) surface at least on a bonding portion with the bonding packing.Type: ApplicationFiled: December 25, 2019Publication date: March 17, 2022Applicant: MITSUI CHEMICALS, INC.Inventors: Mizue KURIYAGAWA, Kazuki KIMURA, Shinji NAKAJIMA, Takahiro TOMINAGA
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Publication number: 20210252756Abstract: The metal/resin composite structure (106) of the present invention includes a metal member (103), a resin member (105) which is integrated to the metal member (103) and is formed of a resin composition containing a thermoplastic resin, and an inorganic particle layer (107) which is provided between the metal member (103) and the resin member (105) and is formed of inorganic particles. Moreover, the metal member (103) has a fine uneven shape (104) at least on a surface of an integrating part with the resin member (105), the inorganic particle layer (107) is formed to cover a part or an entirety of the fine uneven shape (104) of the metal member (103), and the metal member (103) and the resin member (105) are integrated to each other through the inorganic particle layer (107).Type: ApplicationFiled: September 21, 2018Publication date: August 19, 2021Applicant: MITSUI CHEMICALS, INC.Inventors: Kazuki KIMURA, Yoshihiko TOMITA, Takahiro TOMINAGA, Junya SHIMAZAKI
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Publication number: 20210237322Abstract: A composite structure includes: a metal member; and a thermoplastic resin member bonded to the metal member, in which the metal member has a fine uneven structure at least on a metal surface to which the thermoplastic resin member is bonded, a hardness of the thermoplastic resin member measured by a type A durometer in accordance with JIS K6253 is in a range of equal to or more than A60 and equal to or less than A95, and an acid value of the thermoplastic resin member is equal to or more than 1 mgKOH/g and equal to or less than 100 mgKOH/g. The thermoplastic resin member preferably contains a urethane-based thermoplastic elastomer, an amide-based thermoplastic elastomer, and an acid-modified polyolefin.Type: ApplicationFiled: August 7, 2019Publication date: August 5, 2021Applicant: MITSUI CHEMICALS, INC.Inventors: Takahiro TOMINAGA, Kazuki KIMURA
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Publication number: 20210068285Abstract: A dissimilar material joint including a joined portion between a resin rib and a metal base, in which the metal base forms a protrusion protruding inside of the resin rib on at least a part of the joined portion.Type: ApplicationFiled: February 26, 2019Publication date: March 4, 2021Applicant: MITSUI CHEMICALS, INC.Inventors: Takahiro TOMINAGA, Kazuki KIMURA, Masaki MISUMI, Nobuyoshi SHINBORI
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Patent number: 6707622Abstract: A resin prism including two or more optical surfaces (11-13) that are not parallel to each other, a pair of side end faces (14, 15) substantially perpendicular to the optical surfaces (11-13), at least one reference block (17) projecting from either one of the pair of side end faces (14, 15) and having a circumferential end face (16) extending in a projecting direction of the reference block, a positioning portion (19, 20) formed on the circumferential end face (16) of the reference block (17), and a curved surface (18) for smoothly connecting the circumferential end face (16) of the reference block (17) and corresponding one of the pair of side end faces (14, 15), wherein the circumferential end face (16) and the corresponding one of the side end faces (14, 15) form an angle of 90° or more.Type: GrantFiled: July 25, 2001Date of Patent: March 16, 2004Assignee: Canon Kabushiki KaishaInventor: Takahiro Tominaga
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Publication number: 20020030900Abstract: A flow mark or residual stress occurring in the vicinity of a gate adversely affects the optical characteristics of a resin prism which is to be formed by injection molding. Thus, the molding conditions for the resin prism are strict, and accordingly the resin prism has poor moldability.Type: ApplicationFiled: July 25, 2001Publication date: March 14, 2002Inventor: Takahiro Tominaga