Patents by Inventor Takahiro Yaguchi

Takahiro Yaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8583388
    Abstract: A power integrity analyzer according to an exemplary aspect of the invention includes a parameter inputting unit that inputs parameters to a power-supply current waveform which indicates a variation of a power-supply current value on a time axis of an element, a conversion unit that converts the power-supply current waveform which indicates a variation on the time axis determined by the parameter to a power-supply current spectrum which indicates a variation of the power-supply current value on a frequency axis, an allowable value information storage unit that stores an allowable power-supply voltage fluctuation value of the element, and an impedance calculating unit that calculates a target impedance spectrum on the device indicating the variation of impedance value on the frequency axis based on the power-supply current spectrum and the allowable power-supply voltage fluctuation value.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: November 12, 2013
    Assignee: NEC Corporation
    Inventor: Takahiro Yaguchi
  • Patent number: 8516431
    Abstract: A design rule check system includes: a design rule check unit that performs a design rule checks on wiring information which indicates a wiring pattern of a net on the basis of a design rule which includes a constraint condition of a wiring pattern; and a screening processing unit which generates information about an error for each clock frequency of each net based on a result of the design rule check and outputs the information to an indicating device.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: August 20, 2013
    Assignee: NEC Informatec Systems, Ltd.
    Inventor: Takahiro Yaguchi
  • Publication number: 20110015883
    Abstract: A power integrity analyzer according to an exemplary aspect of the invention includes a parameter inputting unit that inputs parameters to a power-supply current waveform which indicates a variation of a power-supply current value on a time axis of an element, a conversion unit that converts the power-supply current waveform which indicates a variation on the time axis determined by the parameter to a power-supply current spectrum which indicates a variation of the power-supply current value on a frequency axis, an allowable value information storage unit that stores an allowable power-supply voltage fluctuation value of the element, and an impedance calculating unit that calculates a target impedance spectrum on the device indicating the variation of impedance value on the frequency axis based on the power-supply current spectrum and the allowable power-supply voltage fluctuation value.
    Type: Application
    Filed: July 12, 2010
    Publication date: January 20, 2011
    Inventor: TAKAHIRO YAGUCHI
  • Publication number: 20100275172
    Abstract: A design rule check system includes: a design rule check unit that performs a design rule checks on wiring information which indicates a wiring pattern of a net on the basis of a design rule which includes a constraint condition of a wiring pattern; and a screening processing unit which generates information about an error for each clock frequency of each net based on a result of the design rule check and outputs the information to an indicating device.
    Type: Application
    Filed: April 21, 2010
    Publication date: October 28, 2010
    Applicant: NEC INFORMATEC SYSTEMS, LTD.
    Inventor: Takahiro YAGUCHI
  • Patent number: 7356790
    Abstract: To estimate the number of layers required for drawing wirings out of a BGA component at a high speed. A layer number estimation device includes: a bottleneck line detection means, a wiring layer adding means, and a repeating means. The bottleneck line detection means detects a line as a bottleneck line, among a plurality of lines formed by connecting electrodes, where the number of electrodes located nearer the center side than the lines is greater comparing with the number of wirings capable of passing through the lines. The wiring layer adding means disposes electrodes, among the electrodes located nearer the center side than the bottleneck line, which remain after subtracting the number of wirings capable of passing through the bottleneck line, on the next wiring layer with vias. The repeating means causes the bottleneck line detection means and the wiring layer adding means to be executed to the next wiring layer.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: April 8, 2008
    Assignee: NEC Corporation
    Inventors: Yoshiaki Maruyama, Takahiro Yaguchi
  • Patent number: 7216327
    Abstract: A device for estimating the required number of board layer to provide necessary wiring in a printed circuit board or a LSI package, a system including the device, a method and a program for estimating the same. In this system, positional information of pins mounted to each component and a board, and connection information between pins are retrieved from a pin positional information file and a net list file. Further, information about an order of layers to be added, a diameter of a via in respective layers and obstacles to wiring is retrieved from the net list file an added layer structure defining file. Thereafter, information about a layer structure, vias, an area where wiring is prohibited is stored in a storage. A wiring route searching section determines whether or not it is possible to form necessary wiring under the present structure. When the wiring route searching section determines it to be impossible, a layer in the next order is added according to information about added layers.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: May 8, 2007
    Assignee: NEC Informatec Systems, Ltd.
    Inventors: Takahiro Yaguchi, Seishi Eya
  • Patent number: 7168058
    Abstract: A printed circuit wiring board designing support device includes a layout data receiving section receiving printed circuit board layout data through an input/output section, a section for extracting structures of power supply/ground planes, a via hole extracting section for extracting a via hole interconnecting the wirings extending over power supply/ground planes, a capacitor extracting section for extracting a capacitor connected between power supply/ground planes, a distance measuring section for measuring the distance between the via hole and the capacitor, a database where the allowable distance value between the via hole and the capacitor in respect to the distance between the power supply and ground planes is recorded, an examination section for comparing the capacitor/via hole distance with the allowable distance value, and a warning section for issuing a warning when the distance between the via hole and the capacitor is larger than the allowable distance value.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: January 23, 2007
    Assignee: NEC Corporation
    Inventors: Takashi Harada, Takahiro Yaguchi, Akira Wakui, Seishi Eya, Shunsuke Fujimoto
  • Patent number: 7114132
    Abstract: There is provided a circuit design supporting device, a circuit board design supporting system, a circuit board design supporting server, a circuit board design supporting client, a circuit design supporting method, and a program for realizing the device for designing a layout of main components such as LSI, etc. on a circuit board such as a printed circuit board wherein unnecessary electromagnetic radiation is suppressed. The circuit design supporting device comprises a noise generating level adding means and a component locating means. The noise generating level adding means adds noise generating level information to a component to be located on a printed circuit board. The component locating means includes a component position detecting section, a voltage distribution detecting section, a noise generating level comparing section, and an error informing section. The component position detecting section detects a position of the component moved on the printed circuit board.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: September 26, 2006
    Assignee: NEC Corporation
    Inventor: Takahiro Yaguchi
  • Publication number: 20060161874
    Abstract: A printed circuit wiring board designing support device includes a layout data receiving section receiving printed circuit board layout data through an input/output section, a section for extracting structures of power supply/ground planes, a via hole extracting section for extracting a via hole interconnecting the wirings extending over power supply/ground planes, a capacitor extracting section for extracting a capacitor connected between power supply/ground planes, a distance measuring section for measuring the distance between the via hole and the capacitor, a database where the allowable distance value between the via hole and the capacitor in respect to the distance between the power supply and ground planes is recorded, an examination section for comparing the capacitor/via hole distance with the allowable distance value, and a warning section for issuing a warning when the distance between the via hole and the capacitor is larger than the allowable distance value.
    Type: Application
    Filed: June 16, 2004
    Publication date: July 20, 2006
    Applicant: NEC CORPORATION
    Inventors: Takashi Harada, Takahiro Yaguchi, Akira Wakui, Seishi Eya, Shunsuke Fujimoto
  • Publication number: 20060005153
    Abstract: To estimate the number of layers required for drawing wirings out of a BGA component at a high speed. A layer number estimation device includes: a bottleneck line detection means, a wiring layer adding means, and a repeating means. The bottleneck line detection means detects a line as a bottleneck line, among a plurality of lines formed by connecting electrodes, where the number of electrodes located nearer the center side than the lines is greater comparing with the number of wirings capable of passing through the lines. The wiring layer adding means disposes electrodes, among the electrodes located nearer the center side than the bottleneck line, which remain after subtracting the number of wirings capable of passing through the bottleneck line, on the next wiring layer with vias. The repeating means causes the bottleneck line detection means and the wiring layer adding means to be executed to the next wiring layer.
    Type: Application
    Filed: June 30, 2005
    Publication date: January 5, 2006
    Inventors: Yoshiaki Maruyama, Takahiro Yaguchi
  • Publication number: 20050278679
    Abstract: A device for estimating the required number of board layer to provide necessary wiring in a printed circuit board or a LSI package, a system including the device, a method and a program for estimating the same. In this system, positional information of pins mounted to each component and a board, and connection information between pins are retrieved from a pin positional information file and a net list file. Further, information about an order of layers to be added, a diameter of a via in respective layers and obstacles to wiring is retrieved from the net list file an added layer structure defining file. Thereafter, information about a layer structure, vias, an area where wiring is prohibited is stored in a storage. A wiring route searching section determines whether or not it is possible to form necessary wiring under the present structure. When the wiring route searching section determines it to be impossible, a layer in the next order is added according to information about added layers.
    Type: Application
    Filed: February 13, 2004
    Publication date: December 15, 2005
    Inventors: Takahiro Yaguchi, Seishi Eya
  • Patent number: 6774641
    Abstract: In a printed circuit board design support apparatus for supporting design of a printed circuit board by calculating a radiation amount of electromagnetic radiation caused by an interconnection on the basis of design information related to each of the printed circuit board having a ground plane, interconnections formed on the printed circuit board, and components to be mounted on the printed circuit board, an arithmetic unit calculates a common mode (CM) radiation amount of the interconnection on the basis of a CM radiation amount ratio that indicates a ratio of a common mode (CM) radiation amount of electromagnetic radiation caused by the ground plane in correspondence with the interconnection to a differential mode (DM) radiation amount of electromagnetic radiation caused by the interconnection. A printed circuit board design support method and program are also disclosed.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: August 10, 2004
    Assignee: NEC Corporation
    Inventors: Hideki Sasaki, Takahiro Yaguchi, Akira Wakui, Seishi Eya, Takashi Harada, Toshihide Kuriyama
  • Publication number: 20030046651
    Abstract: In a printed circuit board design support apparatus for supporting design of a printed circuit board by calculating a radiation amount of electromagnetic radiation caused by an interconnection on the basis of design information related to each of the printed circuit board having a ground plane, interconnections formed on the printed circuit board, and components to be mounted on the printed circuit board, an arithmetic unit calculates a common mode (CM) radiation amount of the interconnection on the basis of a CM radiation amount ratio that indicates a ratio of a common mode (CM) radiation amount of electromagnetic radiation caused by the ground plane in correspondence with the interconnection to a differential mode (DM) radiation amount of electromagnetic radiation caused by the interconnection. A printed circuit board design support method and program are also disclosed.
    Type: Application
    Filed: June 18, 2002
    Publication date: March 6, 2003
    Applicant: NEC CORPORATION
    Inventors: Hideki Sasaki, Takahiro Yaguchi, Akira Wakui, Seishi Eya, Takashi Harada, Toshihide Kuriyama
  • Patent number: 6519741
    Abstract: Disclosed is a power decoupling circuit generating system and method capable of easily generating a power decoupling circuit for each device such as an LSI. On the basis of information regarding parameters of generating a power decoupling circuit held in a capacitor parts library and a line calculation parameter file, a power decoupling circuit of a &pgr;-type low pass filter construction having first and second decoupling capacitors to be added to a power supply terminal of a device as a target from which high frequency noise is prevented from being passed to a power plane and a power line corresponding to an inductance is automatically generated by a power decoupling circuit generating unit, thereby making calculation for generating the power decoupling circuit unnecessary.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: February 11, 2003
    Assignee: NEC Corporation
    Inventors: Takahiro Yaguchi, Kiyoshi Asao, Hideki Sasaki, Takashi Harada
  • Publication number: 20020157067
    Abstract: There is provided a circuit design supporting device, a circuit board design supporting system, a circuit board design supporting server, a circuit board design supporting client, a circuit design supporting method, and a program for realizing the device for designing a layout of main components such as LSI, etc. on a circuit board such as a printed circuit board wherein unnecessary electromagnetic radiation is suppressed. The circuit design supporting device comprises a noise generating level adding means and a component locating means. The noise generating level adding means adds noise generating level information to a component to be located on a printed circuit board. The component locating means includes a component position detecting section, a voltage distribution detecting section, a noise generating level comparing section, and an error informing section. The component position detecting section detects a position of the component moved on the printed circuit board.
    Type: Application
    Filed: April 19, 2002
    Publication date: October 24, 2002
    Applicant: NEC CORPORATION
    Inventor: Takahiro Yaguchi
  • Publication number: 20010010035
    Abstract: Disclosed is a power decoupling circuit generating system and method capable of easily generating a power decoupling circuit for each device such as an LSI. On the basis of information regarding parameters of generating a power decoupling circuit held in a capacitor parts library and a line calculation parameter file, a power decoupling circuit of a &pgr;-type low pass filter construction having first and second decoupling capacitors to be added to a power supply terminal of a device as a target from which high frequency noise is prevented from being passed to a power plane and a power line corresponding to an inductance is automatically generated by a power decoupling circuit generating unit, thereby making calculation for generating the power decoupling circuit unnecessary.
    Type: Application
    Filed: January 19, 2001
    Publication date: July 26, 2001
    Applicant: NEC CORPORATION
    Inventors: Takahiro Yaguchi, Kiyoshi Asao, Hideki Sasaki, Takashi Harada
  • Patent number: 5537008
    Abstract: An incandescent lamp which is operable at about 200-275 V is obtainable by enclosing a filling composition consisting of about 80-95% by volume of krypton gas and about 5-20% by volume of nitrogen gas in a glass envelope bearing a tungsten filament and an inner volume of about 0.2-1.2 ml/operating wattage in an amount of about 0.7-0.9 ml/ml of the inner volume. The incandescent lamp exhibits satisfactory luminous characteristics and an extended life expectancy without causing arc discharge even when operated at a voltage of about 200-275 V. Thus a lighting device which comprises such an incandescent lamp as the luminous source and a power source capable of energizing it at a voltage of about 200-275 V is very useful in general and special illumination.
    Type: Grant
    Filed: June 28, 1994
    Date of Patent: July 16, 1996
    Assignee: Ken Hayashibara
    Inventors: Osamu Matsuda, Takahiro Yaguchi
  • Patent number: 5432408
    Abstract: A filling composition consisting essentially of about 20-75% by volume of xenon gas and about 15-80% by volume of nitrogen gas exhibits excellent luminous characteristics and an extended life expectancy but hardly causes arc discharge when enclosed in incandescent lamp. Incandescent lamps using the filling composition emit a light which is natural, appropriately high in color temperature, excellent in color rendering properties and gentle to the eye when operated at a voltage exceeding their rating but not exceeding 150% thereof.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: July 11, 1995
    Assignee: Ken Hayashibara
    Inventors: Osamu Matsuda, Takahiro Yaguchi