Patents by Inventor Takahiro Yashiro

Takahiro Yashiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210326755
    Abstract: A learning model creation device includes, a verifying unit that verifies a learning model for predicting, from a predetermined manufacturing condition including at least one condition, a predetermined material property of a material manufactured under the manufacturing condition.
    Type: Application
    Filed: March 30, 2021
    Publication date: October 21, 2021
    Inventors: Keita HASHIMOTO, Nobuyoshi KOMAI, Takashi HONDA, Nobuhiko SAITO, Takahiro SHIRANE, Ko ARISUE, Yusuke YASHIRO
  • Publication number: 20210294581
    Abstract: Disclosed subject matter is related to project reusability including method and system for identifying reusable project components for building a new project. The method comprises extracting current requirement of the new project from one or more data sources, using NLP and detect pre-existing requirements associated with pre-existing projects, similar to the current requirement by performing semantic analysis of the current requirement and the pre-existing requirements using a predefined machine learning technique such as Latent Semantic Analysis (LSA) technique. Further, a similarity score is determined for each of the one or more pre-existing requirements based on degree of similarity between the current requirement and the pre-existing requirements.
    Type: Application
    Filed: July 2, 2019
    Publication date: September 23, 2021
    Inventors: Takahiro IIDA, Telang Geet TAPAN, Satoshi YASHIRO, Takafumi SUZUKI, Masahiro MATSUBARA
  • Publication number: 20180323295
    Abstract: In a semiconductor device, an epitaxial substrate includes a SiC (silicon carbide) substrate and a GaN (gallium nitride) epitaxial layer formed on the SiC substrate. A multi-layer wiring structure is formed on the front-face side of the epitaxial substrate, and includes at least one metal wiring layer and an organic interlayer dielectric. A back-face metal layer is formed on the back face of the epitaxial substrate. At least one via hole is formed in the epitaxial substrate, and is configured to provide a connection between the multi-layer wiring structure and the back-face metal layer.
    Type: Application
    Filed: July 10, 2018
    Publication date: November 8, 2018
    Inventors: Jun'ichi OKAYASU, Yoshiaki ABE, Takuya OIZUMI, Takahiro YASHIRO
  • Patent number: 4147014
    Abstract: An apparatus for automatically manufacturing cupped food materials such as cupcakes, in which food material is filled in a cup which is formed from a blank cut out from a strip of sheet and pressed between a moulding female member and a moulding male member. The male member has a hollow portion extending through the center thereof and through which food material is ejected into the cup.
    Type: Grant
    Filed: January 10, 1978
    Date of Patent: April 3, 1979
    Assignee: Rheon Automatic Machinery Co., Ltd.
    Inventors: Yasunori Tashiro, Takahiro Yashiro, Katsuaki Higuchi