Patents by Inventor Takamasa Ito

Takamasa Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10840261
    Abstract: A semiconductor storage device includes a base portion, a stacked body, and a first column. The base portion includes a substrate, a semiconductor element on the substrate, lower-layer wiring above the semiconductor element, and a first conductive layer above the lower-layer wiring and made of a metal compound or polycrystal silicon. The stacked body is above the first conductive layer. The stacked body includes second conductive layers and insulating films stacked alternately. The first column includes a semiconductor body and a memory film. The semiconductor body extends in a stacked direction of the stacked body and is electrically connected to the first conductive layer. A memory film has a charge trap between the plurality of second conductive layers and the semiconductor body. The first conductive layer is provided between the stacked body and the lower-layer wiring, and between a peripheral region of the stacked body and the lower-layer wiring.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: November 17, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takamasa Ito, Ken Komiya, Tsuneo Uenaka
  • Patent number: 10797144
    Abstract: A semiconductor device includes a base body, a stacked body on the base body and a first columnar part. The base body includes a substrate, a first insulating film on the substrate, a first conductive film on the first insulating film, and a first semiconductor part on the first conductive film. The stacked body includes conductive layers and insulating layers stacked alternately in a stacking direction. The first columnar part is provided inside the stacked body and the first semiconductor part. The first columnar part includes a semiconductor body and a memory film between the semiconductor body and conductive layers. The semiconductor body extends in the stacking direction. The first columnar part has a first diameter and a second diameter in a first direction crossing the stacking direction. The first diameter inside the first semiconductor part is larger than the second diameter inside the stacked body.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: October 6, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Megumi Ishiduki, Hiroshi Nakaki, Takamasa Ito
  • Publication number: 20200303305
    Abstract: According to one embodiment, a device includes: a semiconductor in a first region of interconnects stacked in a first direction; a first conductor including a first body and a first protrusion, the first body provided in a first region, the first protrusion protruding from the first body in a second direction and overlapping with a second region adjacent to the first region in the second direction; a plug on the first protrusion; a insulator between the plug and the interconnects; a second conductor including a second body and a second protrusion, the second body on the first body and contacting the semiconductor, and the second protrusion on the first protrusion and protruding to the second body; and a first layer on the first protrusion, contacting the second protrusion and the insulator, and extending between the second protrusion and the insulator.
    Type: Application
    Filed: September 9, 2019
    Publication date: September 24, 2020
    Applicant: Toshiba Memory Corporation
    Inventor: Takamasa ITO
  • Publication number: 20200295033
    Abstract: A semiconductor memory device according to an embodiment includes a substrate, first and second conductive layers, first and second pillars, and a first member. The first conductive layer includes a first portion, a second portion, and a third portion above the second portion. The second conductive layers are stacked above the first conductive layer. The first pillar includes a first semiconductor layer in contact with the first portion in a direction crossing the stacked direction. The second pillar is provided to penetrate the second conductive layers and the third portion in the stacked direction. The first member is provided between the first and second pillars and between the second and third portions.
    Type: Application
    Filed: August 2, 2019
    Publication date: September 17, 2020
    Applicant: Toshiba Memory Corporation
    Inventors: Manabu SAKAMOTO, Kenji TASHIRO, Takamasa ITO
  • Patent number: 10641634
    Abstract: To provide a flow meter capable of easily acquiring, with a simple configuration, an integrated value of a flow rate in every flow of fluid intermittently flowing in a pipe. A flow-rate measuring section 302 measures a flow rate of fluid flowing in a pipe. A value of the flow rate integrated from a point in time when the integration of the flow rate is started to a point in time when the integration of the flow rate is stopped is acquired as an integrated value. A reset section 306 resets the integrated value from a point in time when the integrated value is acquired to a point in time when the next first switching is determined.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: May 5, 2020
    Assignee: Keyence Corporation
    Inventors: Takamasa Koyama, Sotaro Ito
  • Publication number: 20200083239
    Abstract: A semiconductor memory device includes: a substrate including a first and a second regions; first wiring layers disposed in a first direction; a second wiring layer; a third wiring layer closer to the substrate than the first and the second wiring layers; a semiconductor film that penetrates the first and the second wiring layers, and is connected to the third wiring layer; and a gate insulating film disposed between the semiconductor film and the first wiring layers. The first wiring layers include first conductive films opposed to the semiconductor film in the first region, and first films in the second region. The second wiring layer includes a second conductive film opposed to the semiconductor film in the first region, and a second film in the second region. The second film is different from the first films.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 12, 2020
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Ken KOMIYA, Takamasa ITO, Naoki YAMAMOTO, Yu HIROTSU, Kazuhiro TOMISHIGE, Yoshinori NAKAKUBO
  • Publication number: 20200075623
    Abstract: A semiconductor storage device includes a base portion, a stacked body, and a first column. The base portion includes a substrate, a semiconductor element on the substrate, lower-layer wiring above the semiconductor element, and a first conductive layer above the lower-layer wiring and made of a metal compound or polycrystal silicon. The stacked body is above the first conductive layer. The stacked body includes second conductive layers and insulating films stacked alternately. The first column includes a semiconductor body and a memory film. The semiconductor body extends in a stacked direction of the stacked body and is electrically connected to the first conductive layer. A memory film has a charge trap between the plurality of second conductive layers and the semiconductor body. The first conductive layer is provided between the stacked body and the lower-layer wiring, and between a peripheral region of the stacked body and the lower-layer wiring.
    Type: Application
    Filed: February 26, 2019
    Publication date: March 5, 2020
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Takamasa ITO, Ken Komiya, Tsuneo Uenaka
  • Patent number: 10549684
    Abstract: A skin material for vehicle interior includes a woven fabric woven by using a side emission type optical fiber and a multifilament as warp or weft, and is joined to a substrate for vehicle interior to constitute a vehicle interior material. In a surface of the woven fabric which constitutes the inside of a vehicle compartment, a virtual surface constituted by connecting side surfaces, on the inside of the vehicle compartment, of the side emission type optical fibers is in close vicinity to the substrate for vehicle interior, as compared with a virtual surface constituted by connecting side surfaces, on the inside of the vehicle compartment, of the multifilaments. Examples of the vehicle interior material in which the skin material for vehicle interior is used include door trims and roof trims.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: February 4, 2020
    Assignees: TOYOTA BOSHOKU KABUSHIKI KAISHA, DAIKI CO., LTD.
    Inventors: Takamasa Yamada, Seiji Chaza, Shingo Okahara, Mitsutaka Sakoh, Hideo Kanamori, Atsuhiko Ito, Takayoshi Yamamoto
  • Patent number: 10475809
    Abstract: A semiconductor memory device includes a first electrode layer extending in a first direction, a second electrode layer above the first electrode layer and extending in the first direction, a third electrode layer above the first electrode layer and extending in the first direction, an insulating member between the second and third electrode layers and extending in the first direction, first semiconductor members extending in the second direction through the first and second electrodes, second semiconductor members extending in the second direction through the first and third electrode layers, and third semiconductor members extending in the second direction, each having a first portion between the second and third electrode layers and in contact with the insulating member, and a second portion extending through the first electrode layer. In the first direction, an arrangement density of the third semiconductor members is lower than that of the first or second semiconductor member.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: November 12, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takamasa Ito, Toshiaki Fukuzumi
  • Publication number: 20190296117
    Abstract: A semiconductor device includes a base body, a stacked body on the base body and a first columnar part. The base body includes a substrate, a first insulating film on the substrate, a first conductive film on the first insulating film, and a first semiconductor part on the first conductive film. The stacked body includes conductive layers and insulating layers stacked alternately in a stacking direction. The first columnar part is provided inside the stacked body and the first semiconductor part. The first columnar part includes a semiconductor body and a memory film between the semiconductor body and conductive layers. The semiconductor body extends in the stacking direction. The first columnar part has a first diameter and a second diameter in a first direction crossing the stacking direction. The first diameter inside the first semiconductor part is larger than the second diameter inside the stacked body.
    Type: Application
    Filed: September 13, 2018
    Publication date: September 26, 2019
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Megumi ISHIDUKI, Hiroshi NAKAKI, Takamasa ITO
  • Publication number: 20190285454
    Abstract: To provide a flow meter capable of easily acquiring, with a simple configuration, an integrated value of a flow rate in every flow of fluid intermittently flowing in a pipe. A flow-rate measuring section 302 measures a flow rate of fluid flowing in a pipe. A value of the flow rate integrated from a point in time when the integration of the flow rate is started to a point in time when the integration of the flow rate is stopped is acquired as an integrated value. A reset section 306 resets the integrated value from a point in time when the integrated value is acquired to a point in time when the next first switching is determined.
    Type: Application
    Filed: February 6, 2019
    Publication date: September 19, 2019
    Applicant: Keyence Corporation
    Inventors: Takamasa Koyama, Sotaro Ito
  • Publication number: 20190197090
    Abstract: An article inspection apparatus includes an inspection control unit 31 and a weighing conveyor main unit 32 that inspect an article W while the article is being conveyed, and a display unit 50 and a display control unit 33 that output an image for displaying a determination result about a plurality of determination items as an image on the same screen in response to an inspection result. The display control unit 33 includes a selection unit 37 and an editing unit 38 that switches an image for displaying a determination result about a specific determination item out of a plurality of determination items to another image for displaying the determination result which is stored and held in advance, in response to a display change request input for the specific determination item.
    Type: Application
    Filed: December 11, 2018
    Publication date: June 27, 2019
    Inventor: Takamasa Ito
  • Patent number: 10315300
    Abstract: A dust collection device, that collects dust particles generated by an impact tool, has a feature that enables the attachment of the device to the impact tool, which is not provided with an attachment section for the device. The dust collection device has a tool body and an auxiliary handle, attached removably to the tool body, and is attached to an electric hammer that, in the lengthwise direction, linearly operates a tool bit mounted to the tip region of the tool body, and collects dust generated by the electric hammer. The dust collection device has: a dust collection unit that has a dust intake port at the tip; a dust collection hose, connected to the dust collection unit, for transferring dust to the downstream side; and a hose-holding unit that holds the dust collection hose. The hose-holding unit can be attached to and removed from the auxiliary handle.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: June 11, 2019
    Assignee: MAKITA CORPORATION
    Inventors: Hiroki Ikuta, Ken Yamauchi, Takamasa Hanai, Masao Miwa, Tomohiro Ukai, Shusaku Wakatsuki, Akihiro Ito
  • Publication number: 20180179995
    Abstract: An internal combustion engine control apparatus includes a fuel injection apparatus injecting fuel into a combustion chamber a plurality of times during a single cycle, and controls an internal combustion engine that performs compression combustion. The internal combustion engine control apparatus includes an injection command unit and an injection specification determining unit. The injection command unit commands the fuel injection apparatus to perform: a main injection for a main combustion that generates torque; and a preceding injection that is performed at a stage before the main injection. The injection specification determining unit determines a penetration force of a spray produced by the preceding injection or an injection direction of the preceding injection, such that a range of reach of the spray produced by the preceding injection is closer to a nozzle hole of the fuel injection apparatus than a range of reach of a spray produced by the main injection.
    Type: Application
    Filed: December 19, 2017
    Publication date: June 28, 2018
    Applicant: DENSO CORPORATION
    Inventors: Takamasa ITO, Youhei MORIMOTO, Shinichiro KAWAKITA
  • Publication number: 20180130820
    Abstract: A semiconductor memory device includes a first electrode layer extending in a first direction, a second electrode layer above the first electrode layer and extending in the first direction, a third electrode layer above the first electrode layer and extending in the first direction, an insulating member between the second and third electrode layers and extending in the first direction, first semiconductor members extending in the second direction through the first and second electrodes, second semiconductor members extending in the second direction through the first and third electrode layers, and third semiconductor members extending in the second direction, each having a first portion between the second and third electrode layers and in contact with the insulating member, and a second portion extending through the first electrode layer. In the first direction, an arrangement density of the third semiconductor members is lower than that of the first or second semiconductor member.
    Type: Application
    Filed: August 31, 2017
    Publication date: May 10, 2018
    Inventors: Takamasa ITO, Toshiaki FUKUZUMI
  • Patent number: 9929043
    Abstract: A semiconductor memory device according to an embodiment includes: a pair of insulating members separated from each other, the pair of insulating members extending in a first direction; a plurality of electrode films and a plurality of inter-layer insulating films disposed between the pair of insulating members and stacked alternately along a second direction, the second direction intersecting the first direction; a plurality of semiconductor pillars extending in the second direction and piercing the plurality of electrode films and the plurality of inter-layer insulating films; and a charge storage film disposed between one of the semiconductor pillars and one of the electrode films. An end portion on one of the insulating members side of a first electrode film of the electrode films is thicker than a central portion of the first electrode film between the pair of insulating members.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: March 27, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takamasa Ito, Hiroki Yamashita
  • Publication number: 20170025350
    Abstract: A semiconductor memory device according to an embodiment includes: a pair of insulating members separated from each other, the pair of insulating members extending in a first direction; a plurality of electrode films and a plurality of inter-layer insulating films disposed between the pair of insulating members and stacked alternately along a second direction, the second direction intersecting the first direction; a plurality of semiconductor pillars extending in the second direction and piercing the plurality of electrode films and the plurality of inter-layer insulating films; and a charge storage film disposed between one of the semiconductor pillars and one of the electrode films. An end portion on one of the insulating members side of a first electrode film of the electrode films is thicker than a central portion of the first electrode film between the pair of insulating members.
    Type: Application
    Filed: February 1, 2016
    Publication date: January 26, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takamasa ITO, Hiroki YAMASHITA
  • Patent number: 9028326
    Abstract: Provided is an operation device which allows various kinds of operation information to be input to a main body thereof as needed without unnecessarily increasing the weight of the operation device. The operation device includes: the main body having a shape elongated from one end to another end; a light emitting member provided to the one end of the main body; and a connection portion provided to the other end of the main body, to which an arbitrary one of a plurality of other operation devices is to be connected.
    Type: Grant
    Filed: April 28, 2014
    Date of Patent: May 12, 2015
    Assignees: Sony Corporation, Sony Computer Entertainment Inc.
    Inventors: Yoshio Miyazaki, Koji Hamada, Yoshikazu Onuki, Kazuyoshi Enomoto, Yutaka Sumi, Takamasa Araki, Takamasa Ito
  • Patent number: 8958581
    Abstract: A polymer speaker is configured to include an electrostrictive element having an elastomer or resin dielectric layer and a plurality of electrode layers arranged on the front and back surfaces of the dielectric layer. The electrode layers are formed from a conductive material including a polymer binder and a conductor and having a modulus of elasticity of 100 MPa or less. The spring constant of the electrode layers in the surface direction is smaller than the spring constant of the dielectric layer in the surface direction. The volume resistivity of the electrode layers is 200 ?·cm or less. The polymer speaker provides a practical sound pressure in a wide frequency region from low frequencies to high frequencies.
    Type: Grant
    Filed: September 3, 2013
    Date of Patent: February 17, 2015
    Assignee: Tokai Rubber Industries, Ltd.
    Inventors: Takamasa Ito, Hitoshi Yoshikawa, Mitsuyoshi Kondo, Katsuhiko Nakano
  • Publication number: 20140235349
    Abstract: Provided is an operation device which allows various kinds of operation information to be input to a main body thereof as needed without unnecessarily increasing the weight of the operation device. The operation device includes: the main body having a shape elongated from one end to another end; a light emitting member provided to the one end of the main body; and a connection portion provided to the other end of the main body, to which an arbitrary one of a plurality of other operation devices is to be connected.
    Type: Application
    Filed: April 28, 2014
    Publication date: August 21, 2014
    Applicant: Sony Computer Entertainment Inc.
    Inventors: Yoshio MIYAZAKI, Koji HAMADA, Yoshikazu ONUKI, Kazuyoshi ENOMOTO, Yutaka SUMI, Takamasa ARAKI, Takamasa ITO