Patents by Inventor Takanori Aketa

Takanori Aketa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210344883
    Abstract: A color conversion element includes: a substrate; a phosphor portion that is disposed above the substrate, receives laser light transmitted from an outside, and emits light in a color different from a color of the laser light; a reflective layer that includes a dielectric multilayer film and is disposed on a principal surface of the phosphor portion facing the substrate; and a joining portion interposed between the reflective layer and the substrate to join the reflective layer and the substrate. The joining portion includes an air layer that exposes the reflective layer in a position where the air layer at least partially overlaps an irradiation region in a plan view, the irradiation region being a region irradiated with the laser light on the phosphor portion.
    Type: Application
    Filed: July 23, 2019
    Publication date: November 4, 2021
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takanori AKETA, Yosuke HONDA, Takashi KISHIDA, Toru HIRANO
  • Patent number: 10876711
    Abstract: A color conversion element includes: a phosphor layer that includes at least one type of phosphor; a reflecting layer stacked on the phosphor layer; a substrate disposed in a position opposite to the reflecting layer; a joining portion interposed between the reflecting layer and the substrate for joining the reflecting layer and the substrate; and an absorbing portion disposed above a principal surface of the substrate closer to the joining portion. The absorbing portion is covered with the joining portion and absorbs laser light having a wavelength that excites the phosphor.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: December 29, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Takanori Aketa
  • Publication number: 20200271282
    Abstract: A light-emitting element includes: a phosphor layer including phosphor (phosphor particles) of at least one type; a substrate which has a thermal conductivity higher than a thermal conductivity of the phosphor layer, the substrate having a principal surface above which the phosphor layer is disposed; and a joining part which is interposed between the phosphor layer and the substrate to join the phosphor layer and the substrate together with metal. An adhesion layer and a reflecting layer are interposed between the joining part and the phosphor layer, the adhesion layer being light-transmissive and on a principal surface of the phosphor layer which faces the substrate, the reflecting layer being on a principal surface of the adhesion layer which faces the substrate.
    Type: Application
    Filed: November 10, 2016
    Publication date: August 27, 2020
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori AKETA, Nobuyuki MIYAGAWA, Hironori KAMI, Makoto SAITO, Toshihiko SATO
  • Patent number: 10535807
    Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: January 14, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori Aketa, Mitsuhiko Ueda, Toru Hirano
  • Publication number: 20190294032
    Abstract: A color conversion element includes: a substrate, a phosphor layer disposed above one principal surface of the substrate, and a joining portion interposed between the substrate and the phosphor layer for joining the substrate and the phosphor layer using metal. The phosphor layer includes individual pieces that are sheet-shaped and planarly arranged. The individual pieces each include at least one type of phosphor. Also, the joining portion has a porous structure obtained by sintering metal nanoparticles.
    Type: Application
    Filed: June 16, 2017
    Publication date: September 26, 2019
    Inventors: Toru HIRANO, Takanori AKETA, Koki OISHI
  • Publication number: 20190264894
    Abstract: A color conversion element includes: a phosphor layer that includes at least one type of phosphor; a reflecting layer stacked on the phosphor layer; a substrate disposed in a position opposite to the reflecting layer; a joining portion interposed between the reflecting layer and the substrate for joining the reflecting layer and the substrate; and an absorbing portion disposed above a principal surface of the substrate closer to the joining portion. The absorbing portion is covered with the joining portion and absorbs laser light having a wavelength that excites the phosphor.
    Type: Application
    Filed: June 16, 2017
    Publication date: August 29, 2019
    Inventor: Takanori AKETA
  • Patent number: 10078007
    Abstract: An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: September 18, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takafumi Okudo, Takahiro Miyatake, Yoshiharu Sanagawa, Masao Kirihara, Yoichi Nishijima, Takanori Aketa, Ryo Tomoida
  • Publication number: 20180254398
    Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
    Type: Application
    Filed: May 8, 2018
    Publication date: September 6, 2018
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori AKETA, Mitsuhiko UEDA, Toru HIRANO
  • Patent number: 10062820
    Abstract: An interposer includes element mounting sections and terminal sections directly and partly formed on a surface of an aluminum film having the predetermined pattern. Each of the element mounting sections and the terminal sections has a laminated structure of an Ni film, an Pd film and an Au film. The interposer is formed with an AuSn layer on a predetermined region of a surface of each Au film in the element mounting sections. The interposer includes a protective film having optical permeability that directly covers a region of the surface of the aluminum film, which is out of contact with the element mounting sections and the terminal sections.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: August 28, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Mituhiko Ueda, Makoto Saito, Takanori Aketa, Toru Hirano
  • Publication number: 20180166617
    Abstract: An interposer includes element mounting sections and terminal sections directly and partly formed on a surface of an aluminum film having the predetermined pattern. Each of the element mounting sections and the terminal sections has a laminated structure of an Ni film, an Pd film and an Au film. The interposer is formed with an AuSn layer on a predetermined region of a surface of each Au film in the element mounting sections. The interposer includes a protective film having optical permeability that directly covers a region of the surface of the aluminum film, which is out of contact with the element mounting sections and the terminal sections.
    Type: Application
    Filed: April 26, 2016
    Publication date: June 14, 2018
    Inventors: Mituhiko UEDA, Makoto SAITO, Takanori AKETA, Toru HIRANO
  • Patent number: 9997685
    Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: June 12, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori Aketa, Mitsuhiko Ueda, Toru Hirano
  • Patent number: 9818923
    Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: November 14, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Mitsuhiko Ueda, Yoshiharu Sanagawa, Takanori Aketa
  • Publication number: 20170279019
    Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.
    Type: Application
    Filed: October 27, 2015
    Publication date: September 28, 2017
    Inventors: Mitsuhiko UEDA, Yoshiharu SANAGAWA, Takanori AKETA
  • Publication number: 20170122799
    Abstract: An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.
    Type: Application
    Filed: January 11, 2017
    Publication date: May 4, 2017
    Inventors: Takafumi OKUDO, Takahiro MIYATAKE, Yoshiharu SANAGAWA, Masao KIRIHARA, Yoichi NISHIJIMA, Takanori AKETA, Ryo TOMOIDA
  • Patent number: 9587978
    Abstract: An infrared sensor includes: an infrared detecting device; a lens disposed above the infrared detecting device; an member that is disposed at a side of an upper surface of the lens and includes an opening; and a gap that intervenes between the member and the lens and has a wider range than the opening.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: March 7, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takafumi Okudo, Takahiro Miyatake, Yoshiharu Sanagawa, Masao Kirihara, Yoichi Nishijima, Takanori Aketa, Ryo Tomoida
  • Patent number: 9508679
    Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: November 29, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Mitsuhiko Ueda, Yoshiharu Sanagawa, Takanori Aketa, Shintaro Hayashi
  • Patent number: 9478682
    Abstract: The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: October 25, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masao Kirihara, Hiroshi Yamanaka, Yoshiharu Sanagawa, Takanori Aketa, Yushi Nakamura, Mitsuhiko Ueda
  • Patent number: 9425373
    Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: August 23, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori Aketa, Yoshiharu Sanagawa, Mitsuhiko Ueda, Takaaki Yoshihara, Shintaro Hayashi, Toshihiko Sato
  • Publication number: 20160218262
    Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
    Type: Application
    Filed: September 3, 2014
    Publication date: July 28, 2016
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LT D.
    Inventors: Takanori AKETA, Mitsuhiko UEDA, Toru HIRANO
  • Publication number: 20160020374
    Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.
    Type: Application
    Filed: March 11, 2014
    Publication date: January 21, 2016
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori AKETA, Yoshiharu SANAGAWA, Mitsuhiko UEDA, Takaaki YOSHIHARA, Shintaro HAYASHI, Toshihiko SATO