Patents by Inventor Takanori Sekido

Takanori Sekido has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230093501
    Abstract: An electronic module includes: an integrated circuit including a first mounting surface; a solid wiring board including a second mounting surface and a third mounting surface within a horizontally projected area corresponding to the integrated circuit; both the second and third mounting surfaces face the first mounting surface of the integrated circuit and disposed at positions with different distances to the first mounting surface. An electrode surface of an electronic component mounted in a space formed between the first and the third mounting surfaces, and an electrode surface of the second mounting surface are arranged substantially parallel to a surface of the integrated circuit on which electrodes are aligned. The electrode on the second mounting surface and the electrodes of the integrated circuit are electrically connected to each other. The electrode of the electronic component is electrically connected to the electronic component and the electrodes of the integrated circuit.
    Type: Application
    Filed: November 23, 2022
    Publication date: March 23, 2023
    Applicant: OLYMPUS CORPORATION
    Inventor: Takanori SEKIDO
  • Publication number: 20220347936
    Abstract: An endoscopic bendable tube includes: an integrally formed resin tube; at least two wires embedded in a tube wall of the resin tube from a proximal end side to a distal end side of the resin tube, the at least two wires being parallel to a tube axis direction of the resin tube and being at positions facing each other; and a plurality of pairs of through slits formed in the tube wall of the resin tube in the tube axis direction, each pair of through slits being formed facing each other in the tube wall of the resin tube.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 3, 2022
    Applicant: OLYMPUS CORPORATION
    Inventor: Takanori SEKIDO
  • Patent number: 11303046
    Abstract: A cable connection structure includes an electric cable, an end face of a core wire of which is exposed, a first electrode that covers the end face, a substrate, a terminal of which is exposed on a principal surface, and a second electrode bonded to the first electrode without another member interposed between the first electrode and the second electrode, the second electrode covering the terminal and having substantially same Vickers hardness as Vickers hardness of the first electrode.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: April 12, 2022
    Assignee: OLYMPUS CORPORATION
    Inventors: Mikio Nakamura, Hiroaki Shibuya, Takanori Sekido
  • Patent number: 11259693
    Abstract: A cable connection substrate includes: a first substrate that is provided with, on a front surface of the first substrate, a first connection electrode to be connected to a sensor electrode of an imaging element, and provided with a second connection electrode on a back surface side of the first substrate; and a second substrate that is provided with, on a front surface of the second substrate, a third connection electrode to be connected to the second connection electrode, and provided with, on a top surface side of the second substrate, the top surface being a side surface perpendicular to the front surface of the second substrate, a plurality of cable connection electrodes to be connected to a plurality of cables. A sum of effective conductor areas of the plurality of cable connection electrodes is greater than a sum of effective conductor areas of the third connection electrode.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: March 1, 2022
    Assignee: OLYMPUS CORPORATION
    Inventors: Masato Mikami, Takanori Sekido
  • Patent number: 11258222
    Abstract: A cable connection structure includes: a substrate that includes: an opening; and a core wire connection electrode that is arranged on one of a principle surface and an inner layer across the opening; a cable that is arranged on a principle surface side of the substrate and includes a core wire that is electrically connected to the core wire connection electrode, the core wire connection electrode being extended so as to be separated from the substrate, the core wire connection electrode being connected to the core wire.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: February 22, 2022
    Assignee: OLYMPUS CORPORATION
    Inventor: Takanori Sekido
  • Patent number: 11125990
    Abstract: An endoscope distal end portion includes: a channel that is tubular, the channel being where a surgical tool is to be inserted in; a light guide configured to guide illumination light emitted from a light source; an imager configured to capture an image of an observed region illuminated with the illumination light from the light guide; and a fixing member that is made of resin and that has a columnar outer shape, the fixing member being configured to seal around the channel, the light guide, and the imager, wherein the channel is in contact with the imager, and the light guide is in contact with at least one of the channel and the imager, and a contact surface of the channel in contact with the light guide or a contact surface of the imager in contact with the light guide has a groove or a projection formed thereon.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: September 21, 2021
    Assignee: OLYMPUS CORPORATION
    Inventors: Nau Satake, Mikio Nakamura, Takanori Sekido
  • Publication number: 20210273394
    Abstract: A cable connection structure manufacturing method includes: covering, by a first electrode, an end face of an electric cable, and covering, by a second electrode, a terminal of a substrate; plastically deforming the first electrode and the second electrode having substantially same hardness by first scrubbing in which the first electrode and the second electrode rub against each other at a first pressure and a first amplitude; polishing the first electrode and the second electrode by second scrubbing in which the first electrode and the second electrode rub against each other at a second pressure smaller than the first pressure and a second amplitude smaller than the first amplitude; and bonding the first electrode and the second electrode at a third pressure higher than the first pressure.
    Type: Application
    Filed: May 5, 2021
    Publication date: September 2, 2021
    Applicant: OLYMPUS CORPORATION
    Inventors: Mikio NAKAMURA, Hiroaki SHIBUYA, Takanori SEKIDO
  • Publication number: 20210273348
    Abstract: A cable connection structure includes an electric cable, an end face of a core wire of which is exposed, a first electrode that covers the end face, a substrate, a terminal of which is exposed on a principal surface, and a second electrode bonded to the first electrode without another member interposed between the first electrode and the second electrode, the second electrode covering the terminal and having substantially same Vickers hardness as Vickers hardness of the first electrode.
    Type: Application
    Filed: May 5, 2021
    Publication date: September 2, 2021
    Applicant: OLYMPUS CORPORATION
    Inventors: Mikio NAKAMURA, Hiroaki SHIBUYA, Takanori SEKIDO
  • Publication number: 20210226396
    Abstract: A cable connection structure includes: a substrate that includes: an opening; and a core wire connection electrode that is arranged on one of a principle surface and an inner layer across the opening; a cable that is arranged on a principle surface side of the substrate and includes a core wire that is electrically connected to the core wire connection electrode, the core wire connection electrode being extended so as to be separated from the substrate, the core wire connection electrode being connected to the core wire.
    Type: Application
    Filed: April 7, 2021
    Publication date: July 22, 2021
    Applicant: OLYMPUS CORPORATION
    Inventor: Takanori Sekido
  • Publication number: 20210119357
    Abstract: A cable connection structure includes: cables, each including a jacket and a core wire exposed at an end portion by removing the jacket; a first fixing member configured to fix distal end portions of exposed core wires while holding the cables at predetermined intervals; a second fixing member configured to fix proximal end portions of the exposed core wires while holding the cables at predetermined intervals; and a substrate including a core wire connection electrode configured to electrically connect the core wire at a position between the first fixing member and the second fixing member, wherein the first fixing member and the second fixing member are different members.
    Type: Application
    Filed: December 30, 2020
    Publication date: April 22, 2021
    Applicant: OLYMPUS CORPORATION
    Inventor: Takanori SEKIDO
  • Patent number: 10966594
    Abstract: An imaging device that includes at least one lens that collects light incident from an object; an imaging sensor that receives light from the lens and converts it to an electric signal; a multi-layer substrate electrically connected to the imaging sensor that includes electronic components and conductive layers and vias; and a collective cable including at least one coaxial cable. A core connection electrode connected to a core of the coaxial cable is formed on a first surface of the multi-layer substrate, the first substrate intersecting with a height direction of the multi-layer substrate. A shielded-wire connection electrode connected to a shielded wire of the coaxial cable is formed on a side surface of the multi-layer substrate adjacent to the first surface. The side surface faces and the cable extend to a proximal end.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: April 6, 2021
    Assignee: OLYMPUS CORPORATION
    Inventor: Takanori Sekido
  • Patent number: 10925464
    Abstract: An imaging unit includes: an imaging element including a light receiver and a connection terminal formed on a back surface of the imaging element; a flexible printed circuit board including a connection electrode forming region, a cable connection electrode forming region, and a bent portion provided between the connection electrode forming region and the cable connection electrode forming region; and sealing resin filled around a junction between the imaging element and the flexible printed circuit board. The bent portion includes: a first bent portion that is bent toward the imaging element from the connection electrode forming region located parallelly to the light receiver of the imaging element; and a second bent portion that is provided continuously with the first bent portion and lets the cable connection electrode forming region extend in a direction opposite to a direction toward the imaging element.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: February 23, 2021
    Assignee: OLYMPUS CORPORATION
    Inventor: Takanori Sekido
  • Patent number: 10898060
    Abstract: A cable connection structure includes: a plurality of cables including at least one coaxial cable including a central conductor, an inner insulator, and an outer conductor exposed stepwise at a distal end portion; an aligning member that is in contact with side surfaces of exposed conductive portions of the cables positioned at least at both ends, of the plurality of cables, to align the cables such that axial directions become parallel and outer sheaths of the adjacent cables are in contact with each other; and a board on which an electrode portion that connects the conductive portions of the plurality of cables are arranged. The conductive portions of the plurality of cables are electrically and mechanically connected to the electrode portion of the board via a conductive connecting member and the aligning member.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: January 26, 2021
    Assignee: OLYMPUS CORPORATION
    Inventors: Junya Yamada, Takanori Sekido, Yukie Yoshizawa
  • Patent number: 10741942
    Abstract: A cable mounting structure includes: a clustered cable including at least two cables covered with an integration coat; a spacer configured to divide the at least two cables that are exposed by removing the integration coat at one end of the clustered cable into two groups and array the two groups of the cables along a upper surface and a lower surface of the spacer; a mounting board including a upper-side cable joint electrode to which a cable arrayed on the upper surface of the spacer is joined and a lower-side cable joint electrode to which a cable arrayed on the lower surface of the spacer is joined; and a resin seal in which a joint between the mounting board and the at least two cables and a mounting board side of the spacer is covered and sealed with a sealing resin.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: August 11, 2020
    Assignee: OLYMPUS CORPORATION
    Inventor: Takanori Sekido
  • Publication number: 20200241280
    Abstract: An endoscope distal end portion includes: a channel that is tubular, the channel being where a surgical tool is to be inserted in; a light guide configured to guide illumination light emitted from a light source; an imager configured to capture an image of an observed region illuminated with the illumination light from the light guide; and a fixing member that is made of resin and that has a columnar outer shape, the fixing member being configured to seal around the channel, the light guide, and the imager, wherein the channel is in contact with the imager, and the light guide is in contact with at least one of the channel and the imager, and a contact surface of the channel in contact with the light guide or a contact surface of the imager in contact with the light guide has a groove or a projection formed thereon.
    Type: Application
    Filed: April 16, 2020
    Publication date: July 30, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Nau SATAKE, Mikio NAKAMURA, Takanori SEKIDO
  • Publication number: 20200163535
    Abstract: An imaging unit includes: an imaging element including a light receiver and a connection terminal formed on a back surface of the imaging element; a flexible printed circuit board including a connection electrode forming region, a cable connection electrode forming region, and a bent portion provided between the connection electrode forming region and the cable connection electrode forming region; and sealing resin filled around a junction between the imaging element and the flexible printed circuit board. The bent portion includes: a first bent portion that is bent toward the imaging element from the connection electrode forming region located parallelly to the light receiver of the imaging element; and a second bent portion that is provided continuously with the first bent portion and lets the cable connection electrode forming region extend in a direction opposite to a direction toward the imaging element.
    Type: Application
    Filed: January 31, 2020
    Publication date: May 28, 2020
    Applicant: OLYMPUS CORPORATION
    Inventor: Takanori SEKIDO
  • Publication number: 20200084343
    Abstract: A cable mounting structure includes: a clustered cable including at least two cables covered with an integration coat; a spacer configured to divide the at least two cables that are exposed by removing the integration coat at one end of the clustered cable into two groups and array the two groups of the cables along a upper surface and a lower surface of the spacer; a mounting board including a upper-side cable joint electrode to which a cable arrayed on the upper surface of the spacer is joined and a lower-side cable joint electrode to which a cable arrayed on the lower surface of the spacer is joined; and a resin seal in which a joint between the mounting board and the at least two cables and a mounting board side of the spacer is covered and sealed with a sealing resin.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 12, 2020
    Applicant: OLYMPUS CORPORATION
    Inventor: Takanori SEKIDO
  • Patent number: 10456013
    Abstract: A disclosed cable connection structure includes a circuit board that includes a first main body portion and a second main portion that includes a shield set portion, a shield connection electrode, and a plurality of core wire connection electrodes; and a plurality of coaxial cables each of which is processed such that a core wire, an internal insulator, and a shield are exposed from a tip portion in a stepwise manner, where the core wires are connected to the respective core wire connection electrodes and the shields are collectively connected to the shield connection electrode. The second main body portion and the coaxial cables are positioned within a projection plane of a front surface that is perpendicular to a principal surface of the first main body portion.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: October 29, 2019
    Assignee: OLYMPUS CORPORATION
    Inventor: Takanori Sekido
  • Patent number: 10426324
    Abstract: An imaging apparatus mount assembly for an image sensor chip includes a substrate, a plurality of first pins and at least one first electronic component, both mounted on a first surface of the substrate, and a first resin sealant configured to seal the first surface so as to expose an end face of a first shaft section opposite to where a first connecting section is provided. A plurality of second pins and at least one second electronic component are both mounted on a second surf ace of the substrate. A second resin sealant is configured to seal the second surface so as to expose an end face of a second shaft section opposite to where a second connecting section is provided. The image sensor chip includes a light receiving unit and a back-surface electrode, the first shaft section exposed on the first resin sealant is connected to the back-surface electrode.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: October 1, 2019
    Assignee: Olympus Corporation
    Inventors: Mikio Nakamura, Takanori Sekido, Nau Satake
  • Publication number: 20190206589
    Abstract: A mounting cable includes: a metal cable that includes a core wire formed of a conductive material and a jacket formed of an insulator and covering the core wire; a cable fixing portion that fixes an end portion of the metal cable, and has an end face which is perpendicular to an axial direction of the metal cable and on which a cross section of an end portion of the core wire is exposed; an external connection electrode formed on at least one surface of the cable fixing portion, the at least one surface being in parallel with the axial direction of the metal cable; and a wire pattern that extends from an area on the core wire exposed on the end face to the external connection electrode.
    Type: Application
    Filed: March 14, 2019
    Publication date: July 4, 2019
    Applicant: OLYMPUS CORPORATION
    Inventor: Takanori SEKIDO