Patents by Inventor Takanori Uejima

Takanori Uejima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180091187
    Abstract: A high-frequency front-end circuit (10) includes a band switch (20), duplexers (31, 32, and 33), and a main switch (40). The band switch (20) includes a common terminal (PC20) and selection terminals (PS21, PS22, and PS23). The main switch (40) includes a common terminal (PC40) and selection terminals (PS41, PS42, PS43). The duplexers (31, 32, and 33) are connected between the selection terminals (PS21 and PS41), between the selection terminals (PS22 and PS42), and between the selection terminals (PS23 and PS43), respectively. The selection terminal (PS23) is connected between the selection terminals (PS21 and PS22) and the selection terminal (PS43) is connected between the selection terminals (PS41 and PS42). First and second communication bands the frequency bands of which are close to or overlapped with each other are transmitted and received through the duplexers (31 and 32).
    Type: Application
    Filed: December 2, 2017
    Publication date: March 29, 2018
    Inventor: Takanori Uejima
  • Patent number: 9912370
    Abstract: In a high-frequency module, SAW duplexers are connected to a selection target terminal. A phase circuit is connected between a first SAW duplexer and the selection target terminal and a phase circuit is connected between a second SAW duplexer and the selection target terminal. The phase circuits make the second SAW duplexer side, when seen from the selection target terminal side, be in a substantially open state at a high frequency in the frequency bands of fundamental waves of first communication signals and make the first SAW duplexer side be in a substantially open state in the frequency bands of fundamental waves of second communication signals. The phase circuit is a band elimination filter having an attenuation pole near a third harmonic frequency band of the first transmission signal.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: March 6, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takanori Uejima
  • Publication number: 20180026671
    Abstract: A high-frequency switch module (10) includes a switch element (20) and an inductor (30). The switch element (20) includes a Hi band common terminal (P10), a Low band common terminal (P20), a plurality of selection target terminals (P11 to P14) that are selectively connected to the common terminal (P10), and a plurality of selection target terminals (P21 to P24) that are selectively connected to the common terminal (P20). The inductor (30) is connected between a first selection target terminal (P14) of the selection target terminals (P11 to P14) and a selection target terminal (P21) of the selection target terminals (P21 to P24). The selection target terminal (P14) and the selection target terminal (P21) are simultaneously used terminals that are used for electric paths through which transmission or reception using a plurality of communication bands is performed at the same time.
    Type: Application
    Filed: August 4, 2017
    Publication date: January 25, 2018
    Inventor: Takanori Uejima
  • Publication number: 20170338800
    Abstract: A high frequency switch module (10) includes a switch device (20), a first inductor (30), and a filter device (40). The switch device (20) includes a shared terminal (P00) and selection target terminals (P02, P03) that are selectively connected to the shared terminal. The filter device (40) includes SAW filters (41, 42) connected to the selection target terminal (P02) and the selection target terminal (P03), respectively. A terminal of the SAW filters (41, 42) on the opposite side to the selection target terminals (P02, P03) is shared and connected to a front-end terminal (Pfe). The first inductor (30) is connected between the selection target terminal (P02) and the selection target terminal (P03).
    Type: Application
    Filed: August 4, 2017
    Publication date: November 23, 2017
    Inventor: Takanori Uejima
  • Publication number: 20170331512
    Abstract: A high-frequency switch module (10) includes a switch element (20) and LC parallel resonant circuits (31 and 32). The switch element (20) includes selection target terminals (P14 and P21) used to transmit communication signals using different frequencies. The LC parallel resonant circuits (31 and 32) are connected between a connection conductor (901) connected to the selection target terminal (P14) and a connection conductor (902) connected to the selection target terminal (P21). The LC parallel resonant circuits (31 and 32) are connected in series between the connection conductors (901 and 902). The LC parallel resonant circuits (31 and 32) have different attenuation pole frequencies.
    Type: Application
    Filed: August 3, 2017
    Publication date: November 16, 2017
    Inventor: Takanori UEJIMA
  • Publication number: 20170288646
    Abstract: A high-frequency switch module includes a switch element, a filter element, an inductor, and first and second transmission conductors. The switch element includes a common terminal and first and second selected terminals selectively connected to the common terminal. The first transmission conductor connects the first selected terminal and a SAW filter of the filter element. The second transmission conductor connects the second selected terminal and a SAW filter of the filter element. The inductor is connected between the first and second transmission conductors. A separation distance between at least a portion of the first transmission conductor and a portion of the second transmission conductor is shorter than a separation distance between a land conductor of the first selected terminal and a land conductor of the second selected terminal, and the transmission conductors are capacitively coupled.
    Type: Application
    Filed: June 16, 2017
    Publication date: October 5, 2017
    Inventor: Takanori UEJIMA
  • Publication number: 20170208677
    Abstract: A multilayer substrate includes a component mounting electrode, an external mounting electrode, and a heat dissipating unit. The component mounting electrode is connected to an electronic component that is connected to an external structure. The heat dissipating unit is constituted by a plurality of via-conductors partially superposed each other in a stacking direction of the multilayer substrate and disposed continuously between the component mounting electrode and the external mounting electrode. The heat dissipating unit includes communicating portions, each in which one via-conductor is disposed per ceramic layer, and a branching portion in which a plurality of via-conductors are disposed continuously between the communicating portions per ceramic layer.
    Type: Application
    Filed: March 30, 2017
    Publication date: July 20, 2017
    Inventors: Takeshi Kogure, Atsushi Ono, Hiroyuki Nagamori, Takanori Uejima
  • Patent number: 9713257
    Abstract: A switch module includes a switch circuit, a chip device which is a coupler, a chip device that defines together with the coupler a common-terminal-side circuit, chip devices defining switching-terminal-side circuits, and a multilayer substrate. The multilayer substrate includes inner-layer ground electrodes. A first inner-layer ground electrode is closer to the chip device than a second inner-layer ground electrode and includes an opening arranged so as not to be superposed with the chip device when viewed in plan in the stacking direction of the multilayer substrate.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: July 18, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Atsushi Ono, Takanori Uejima
  • Patent number: 9667215
    Abstract: A high-frequency switch module includes a switch IC, a phase adjustment circuit, and a filter circuit. The phase adjustment circuit, which includes an inductor and capacitors, includes a ?-type circuit in which the inductor is connected in series between an individual terminal and the filter circuit. The filter circuit is an LC parallel resonant circuit including a filter inductor and a filter capacitor. A distortion second harmonic signal from the individual terminal of the switch IC is reflected by the filter circuit through the phase adjustment circuit and returns to the switch IC through the phase adjustment circuit. This distortion second harmonic signal, whose phase is adjusted by the phase adjustment circuit, is cancelled out by a distortion second harmonic signal output to a common terminal of the switch IC.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: May 30, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takanori Uejima
  • Patent number: 9602147
    Abstract: Impedance mismatching by a matching circuit provided on a signal line which connects a first common terminal and a second common terminal is eliminated so as to significantly reduce insertion loss of a switch module. Therefore, it is possible to provide a switch module which has a simple configuration without the need for connection of a matching circuit to antenna terminals to which antennas are respectively connected, and is able to selectively connect any one of the antennas and any one of communication systems.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: March 21, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takanori Uejima
  • Patent number: 9553630
    Abstract: A switching module includes a common terminal, individual terminals connected to respective corresponding signal paths, and a switch portion that selectively switches and connects the common terminal to one of the individual terminals. The switch portion includes first switches and at least one second switch, each first switch being connected to the common terminal at one end portion within the switch, the at least one second switch being connected to the common terminal at one end portion via a connection wiring electrode provided on a wiring board. This does not allow directional connection between the one end portion of the second switch and the common terminal within the switch. Thus, mutual interference between a communication signal transmitted through the first switch and a communication signal transmitted through the second switch is prevented.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: January 24, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takanori Uejima
  • Publication number: 20160352494
    Abstract: A radio frequency front-end circuit includes a duplexer, a phase adjustment circuit, and a low noise amplifier. The phase adjustment circuit is connected between an Rx filter of the duplexer and the low noise amplifier. The phase adjustment circuit executes phase adjustment such that a quadrant in which an impedance ZLNA(fn) at a particular frequency different from a fundamental frequency of a reception signal when looking at the low noise amplifier side from the Rx filter is present and a quadrant in which an impedance ZRX(fn) at the particular frequency when looking at the Rx filter side from the low noise amplifier is present are not in a conjugate relation in terms of phase.
    Type: Application
    Filed: August 12, 2016
    Publication date: December 1, 2016
    Inventors: Takanori UEJIMA, Hiromichi KITAJIMA, Saneaki ARIUMI, Hisao HAYAFUJI, Tatsuya TSUJIGUCHI
  • Publication number: 20160352365
    Abstract: A high-frequency front end circuit includes a duplexer, a phase adjustment circuit, and a power amplifier. The phase adjustment circuit is connected between the power amplifier and a transmission filter of the duplexer. The phase adjustment circuit carries out phase adjustment so that a quadrant in which an impedance ZRX (fr0) seen from the transmission filter toward the power amplifier at the fundamental frequency of a reception signal is present and a quadrant in which an impedance ZTX (fr0) seen from the power amplifier toward the transmission filter at the fundamental frequency of the reception signal is present are not in a conjugate relationship with respect to the phase.
    Type: Application
    Filed: August 12, 2016
    Publication date: December 1, 2016
    Inventors: Takanori UEJIMA, Hiromichi KITAJIMA, Saneaki ARIUMI, Hisao HAYAFUJI, Tatsuya TSUJIGUCHI
  • Patent number: 9484608
    Abstract: A switch module includes a plurality of mounting electrodes for external connection provided on a peripheral portion of one main surface of a wiring substrate. The plurality of mounting electrodes includes a common electrode, a plurality of RF signal electrodes, a control electrode, and a power supply electrode. At least one of the power supply electrode and the control electrode is arranged between the RF signal electrodes.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: November 1, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yukiya Yamaguchi, Takanori Uejima
  • Patent number: 9467198
    Abstract: A high-frequency module is connected to a switch port and a switch IC including an antenna connection port and a plurality of switch ports. The high-frequency module includes a signal path that outputs transmitting signals having a predetermined frequency band to the switch IC, a module port connected to the signal path and to which a duplexer and a transmitter circuit are connected, and a harmonic branch circuit that is provided on the signal path and allows a harmonic of the transmitting signal to escape to ground.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: October 11, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takanori Uejima
  • Patent number: 9413413
    Abstract: A high-frequency module includes a first switch element and a second switch element that are mounted on a multilayer body. The first switch element includes a common terminal and individual terminals. The second switch element includes a common terminal and individual terminals. The individual terminals are connected to any of SAW filters mounted on the multilayer body or low loss filters provided inside the multilayer body. The individual terminals are grounded by being connected to an inner layer ground electrode inside the multilayer body by conductive via holes.
    Type: Grant
    Filed: March 21, 2014
    Date of Patent: August 9, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hisanori Murase, Masashi Hayakawa, Takanori Uejima
  • Publication number: 20160197643
    Abstract: In a high-frequency module, SAW duplexers are connected to a selection target terminal. A phase circuit is connected between a first SAW duplexer and the selection target terminal and a phase circuit is connected between a second SAW duplexer and the selection target terminal. The phase circuits make the second SAW duplexer side, when seen from the selection target terminal side, be in a substantially open state at a high frequency in the frequency bands of fundamental waves of first communication signals and make the first SAW duplexer side be in a substantially open state in the frequency bands of fundamental waves of second communication signals. The phase circuit is a band elimination filter having an attenuation pole near a third harmonic frequency band of the first transmission signal.
    Type: Application
    Filed: March 16, 2016
    Publication date: July 7, 2016
    Inventor: Takanori UEJIMA
  • Patent number: 9363344
    Abstract: A high frequency module is configured to be compatible with a cellular phone with a plurality of specifications without increasing the number of ports in a switching device. The high frequency module includes a switching device and a module board. The switching device includes a common port and connection switch ports. The module board includes external connection ports and a third filter circuit. An external connection port is connected to one of the connection switch ports of the switching device via a transmission line inside the module board. The third filter circuit is connected to a second external connection port and a third external connection port independently from the device connection ports of the switching device.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: June 7, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takanori Uejima, Muneyoshi Yamamoto
  • Patent number: 9319026
    Abstract: A high-frequency module includes a multilayer body including stacked dielectric and a pair of ground electrodes spaced apart from each other; a common terminal arranged in the multilayer body to receive and transmit communication signals; and a duplexer that is mounted on a surface of the multilayer body and that separates communication signals input and output via the common terminal. The duplexer includes a first SAW filter mounted on the surface of the multilayer body and grounded by the ground electrode and a second SAW filter mounted on the surface of the multilayer body so as to be spaced apart from the first SAW filter and is grounded by the ground electrode. Thus, degradation of isolation characteristics of the transmission and reception terminals of a splitter is prevented.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: April 19, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takanori Uejima
  • Patent number: 9263780
    Abstract: A switch module includes a multilayer substrate including an antenna terminal, a ground terminal, and a high-frequency-side transmission signal terminal, as external connection terminals. A common-port-side circuit, a switch circuit, and a switching-port-side circuit are provided between the antenna terminal and the high-frequency-side transmission signal terminal. A first wiring portion connects a second inductor that defines a portion of the switching-port-side circuit to the high-frequency-side transmission signal terminal. When the multilayer substrate is viewed in plan, a first inductor, the second inductor, and via electrodes connected to the ground terminal are arranged between the first wiring portion, and second and third wiring portions and a capacitor which are connected to the antenna terminal.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: February 16, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Atsushi Ono, Yukiteru Sugaya, Takanori Uejima