Abstract: A thin-film transistor element including a gate layer, an oxide semiconductor thin-film, a gate insulating film disposed between the gate layer and the oxide semiconductor thin-film, a pair of source-drain electrodes electrically connected to the oxide semiconductor thin-film, and a resin film covering the oxide semiconductor thin-film is provided. The oxide semiconductor thin-film contains two or more metal elements selected from indium, gallium, zinc, and tin. The resin film is in contact with the oxide semiconductor thin-film. The resin film may include a compound that contains a SiH group. The resin film may be formed by applying a composition including a SiH group-containing compound onto the oxide semiconductor thin-film, and heating the composition.

Abstract: The present disclosure is directed to a light-shielding colored resin layer formed on a substrate, and a patterned protective layer formed on the colored resin layer. By removing the colored resin layer exposed in an opening of the protective layer by dry etching, thereby patterning the colored resin layer, a partition wall in which the protective layer is provided on a patterned colored resin layer is formed. This partition wall partitions the display surface of an image display device into a plurality of regions; and an image display device is formed by filling spaces, which are partitioned by the partition wall, with a color developing material.

Abstract: A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.

Abstract: A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.

Abstract: The present invention aims to provide a polysiloxane composition which exhibits high heat and light resistance, and excellent gas-barrier properties. The polysiloxane composition of the present invention includes: (A) a modified polyhedral polysiloxane which is obtained by modifying (a) an alkenyl group-containing polyhedral polysiloxane compound with (b) a hydrosilyl group-containing compound; and (B) an organopolysiloxane containing at least two alkenyl groups in a molecule, wherein the polysiloxane composition after curing has a water vapor permeability of not more than 30 g/m2/24 h, and the polysiloxane composition includes (B1) an aryl group-containing organopolysiloxane as the organopolysiloxane (B), and/or (C) a component which is (C1) an organosilicon compound that contains one alkenyl or hydrosilyl group in a molecule, or (C2) a cyclic olefin compound that contains one carbon-carbon double bond in a molecule.

Abstract: A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 ?m to 10 ?m, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of ?50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

Abstract: An object of the present invention is to provide a polyhedral polysiloxane composition that has high heat resistance and high light resistance, is excellent in gas-barrier properties and thermal shock resistance, and exhibits good handleability when used to encapsulate an optical semiconductor device. The polyhedral polysiloxane composition of the present invention is characterized by including a modified polyhedral polysiloxane which is obtained by hydrosilylation of an alkenyl group-containing polyhedral polysiloxane compound (a) and a hydrosilyl group-containing compound (b) and has a structure derived from an organic silicon compound (a?) having one alkenyl group per molecule.

Abstract: The present invention aims to provide a polysiloxane composition which exhibits high heat and light resistance, and excellent gas-barrier properties. The polysiloxane composition of the present invention includes: (A) a modified polyhedral polysiloxane which is obtained by modifying (a) an alkenyl group-containing polyhedral polysiloxane compound with (b) a hydrosilyl group-containing compound; and (B) an organopolysiloxane containing at least two alkenyl groups in a molecule, wherein the polysiloxane composition after curing has a water vapor permeability of not more than 30 g/m2/24 h, and the polysiloxane composition includes (B1) an aryl group-containing organopolysiloxane as the organopolysiloxane (B), and/or (C) a component which is (C1) an organosilicon compound that contains one alkenyl or hydrosilyl group in a molecule, or (C2) a cyclic olefin compound that contains one carbon-carbon double bond in a molecule.

Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Abstract: An object of the present invention is to provide a polysiloxane compound that can be developed in an aqueous alkali solution and can yield a cured product or thin film having superior heat-resistant transparency and insulating properties, a curable composition thereof, and a thin film transistor provided with a passivation layer or gate insulator using the same, and the present invention relates to a polysiloxane compound having at least one photopolymerizable functional group in a molecule thereof, and having at least one member selected from the group consisting of an isocyanuric acid backbone structure, a phenolic hydroxyl group and a carboxyl group within the same molecule, to a curable composition containing the polysiloxane compound, and to a cured product thereof.

Abstract: The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).

Abstract: The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).

Abstract: The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).

Abstract: The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).

Abstract: The present invention aims to provide a polysiloxane composition which exhibits high heat and light resistance, and excellent gas-barrier properties. The polysiloxane composition of the present invention includes: (A) a modified polyhedral polysiloxane which is obtained by modifying (a) an alkenyl group-containing polyhedral polysiloxane compound with (b) a hydrosilyl group-containing compound; and (B) an organopolysiloxane containing at least two alkenyl groups in a molecule, wherein the polysiloxane composition after curing has a water vapor permeability of not more than 30 g/m2/24 h, and the polysiloxane composition includes (B1) an aryl group-containing organopolysiloxane as the organopolysiloxane (B), and/or (C) a component which is (C1) an organosilicon compound that contains one alkenyl or hydrosilyl group in a molecule, or (C2) a cyclic olefin compound that contains one carbon-carbon double bond in a molecule.

Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Abstract: A polyester fiber cord for reinforcing rubber including a polyester fiber preloaded with a polyepoxide compound; and an adhesive applied to the polyester fiber and including a resorcinol-formalin-rubber latex (A), a blocked polyisocyanate compound (B), and a halogenated phenol derivative (C), wherein a rubber latex, a material of the resorcinol-formalin-rubber latex (A) in the adhesive, contains a mixture of a chloroprene rubber latex (D) and a polybutadiene rubber latex (E) in an amount of 80 to 100 parts by mass based on 100 parts by mass of the total solids of the rubber latex, and a mixing ratio of the chloroprene rubber latex (D) to the polybutadiene rubber latex (E) ((D)/(E)) is 80/20 to 20/80 (solid content mass ratio).

Abstract: The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).