Abstract: Provided is a mold part which does not generate periodic irregularities (scale pattern) which appear in the direction orthogonal to the drawing direction (MD) of the mold part having a surface which slides parallel to a molded article when the molded article is removed from the mold after injection molding during injection molding of a thermoplastic resin (in particular, a thermoplastic fluoropolymer), an injection molding method using the same, and a molded article in which periodic irregularities (scale pattern) (which appear in the direction orthogonal to the drawing direction (MD) of the mold part) do not appear. The mold part is used for injection molding of a thermoplastic resin, and includes a surface which slides substantially parallel to a molded article when the molded article is removed from the mold after injection molding, wherein the average tilt angle in the sliding direction (MD) is 1.5° or higher.

Abstract: A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.

Abstract: The ultraviolet ray is applied on the surface of the protective tape from an ultraviolet ray generator. In addition, the ultraviolet ray having intensity higher than that from the ultraviolet ray generator is applied on spot on the wafer edge by an irradiation gun. In this case, the ultraviolet ray intensity and the rotation speed of the holding table are controlled by a controller so that the ultraviolet irradiation amount per unit area of the wafer edge portion becomes equal to that to the joining surface of the protective tape.

Abstract: A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.

Abstract: A wafer formed thin through a back grinding process is placed on a support table included in an alignment stage. When a faulty suction is caused by a warp of the wafer, a surface of wafer is pressed by a pressing plate to be corrected and held by suction. The wafer held by suction is transported, along with the alignment stage, to a mount frame preparing unit at the next step. The wafer is received while being held by suction by a chuck table contacting the surface of wafer.

Abstract: A wafer formed thin through a back grinding process is placed on a support table included in an alignment stage. When a faulty suction is caused by a warp of the wafer, a surface of wafer is pressed by a pressing plate to be corrected and held by suction. The wafer held by suction is transported, along with the alignment stage, to a mount frame preparing unit at the next step. The wafer is received while being held by suction by a chuck table contacting the surface of wafer.

Abstract: A silicone rubber composition, comprising: (A) an polyorganosiloxane gum represented by the following average structural formula: RaSiO(4−a)/2 (where R is a substituted or non-substituted monovalent hydrocarbon, and a is a number between 1.8 and 2.3); (B) microparticulate silica; and (C) a methyl-substituted benzoyl peroxide having the maximum grain diameter not exceeding 50 &mgr;m and an average grain diameter of 30 &mgr;m. When cured, the silicone rubber composition has reduced nonuniformity in the physical properties because of fewer voids, resulting in decreased frequency of spark-outs in the insulated wires.

Abstract: Disclosed is an automatic semiconductor wafer applying apparatus capable of lightly easily stacking and loading ring frames onto a frame supply section. This apparatus has the following construction. An adhesive tape unwound from a tape roll is applied to a lower surface of the ring frame supplied to a tape applying position. The applied adhesive tape is cut out along the ring frame. The ring frame having the adhesive tape applied thereto is transported to a wafer applying position. A semiconductor wafer is applied onto the adhesive tape of the ring frame. In this apparatus, a frame supply truck movable with the ring frames stacked and held thereon is arranged so that it can be pushed/transported into and pulled out/transported from the frame supply section. A lift unit for receiving, lifting and supplying a group of ring frames stacked on the pushed and transported frame supply truck is installed in the frame supply section.

Abstract: A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. The apparatus includes an adhesive removing mechanism 13 for treating the surface of wafer W after the adhesive tape is separated therefrom. The adhesive removing mechanism 13 may be effective when constructed to jet ozone to the surface of wafer W heated, to irradiate the surface of wafer W heated, with ultraviolet rays, or to jet ozone to the surface of wafer W heated and irradiate the surface with ultraviolet rays.

Abstract: An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.

Abstract: A silicone rubber composition for application as electrical insulation that cures into a highly water-resistant silicone rubber that has excellent electrical properties and in particular has excellent high-voltage electrical insulation properties. The silicone rubber composition comprises(A) polyorganosiloxane,(B) surface-treated aluminum hydroxide powder surface treated with an organosilane or organosilazane, and(C) curing agent.Also, the composition afforded by the addition of 1 to 200 weight parts (D) microparticulate silica to components (A) to (C).

Abstract: Liquid silicone rubber compositions that prior to cure have good fluidity and excellent moldability and that cure into a highly flame retardant silicone rubber with excellent high-voltage electrical insulating properties. The liquid silicone rubber compositions comprise: (A) polyorganosiloxane; (B) fumed silica; (C) surface-treated zinc carbonate powder as afforded by treating the surface of (a) zinc carbonate powder or basic zinc carbonate powder with (b) an organosilicon compound selected from organosilanes, organosilazanes, and organosiloxane oligomers; (D) polyorganohydrogensiloxane; and (E) platinum catalyst. The liquid silicone rubber compositions may further comprise (F) surface treated aluminum hydroxide powder, (G) triazole compound, and (H) a reaction mixture of (d) platinum compound and (e) 3,5-dimethyl-1-hexyn-3-ol.

Abstract: A silicone rubber composition that does not foam or evolve an unpleasant odor during its cure and that cures into low-surface-tack, non-yellowing silicone rubber moldings comprises:(A) polydiorganosiloxane gum with the average component formula R.sub.a SiO.sub.(4-a)/2 where R represents substituted and unsubstituted monovalent hydrocarbon groups and a is from 1.9 to 2.1,(B) microparticulate silica,(C) bis(ortho-methylbenzoyl)peroxide, and(D) bis(para-methylbenzoyl)peroxide,wherein the component (C) to component (D) weight ratio is from 1:9 to 8:2.

Abstract: A silicone rubber electrical wire insulating covering formed by curing a composition comprising (A) 100 parts by weight of a polydiorganosiloxane gum, (B) 10 to 150 parts by weight of finely powdered silica, (C) 0.01 to 20 parts by weight of a zinc compound, and (D) 0.1 to 10 parts by weight of a methyl-group-substituted benzoyl peroxide. When cured the composition has good electrical insulating characteristics and does not adhere to electrical conductors.

Abstract: A silicone rubber composition comprising(A) polyorganosiloxane described by average formula R.sub.a SiO.sub.(4-a)/2, where R denotes substituted and unsubstituted monovalent hydrocarbon groups and a is a number from 1.95 to 2.05 and having at least 2 silicon-bonded alkenyl groups in each molecule;(B) microparticulate silica;(C) the reaction mixture of(a) a platinum compound and(b) an organosilicon compound described by general formula ##STR1## where R.sup.1, R.sup.2, and R.sup.3 represent C.sub.1 to C.sub.10 monovalent hydrocarbon groups and a is 1, 2, or 3;(D) curing agent, and optionally(E) triazole compound.

Abstract: A silicone rubber composition that cures into a highly flame-retardant silicone rubber with excellent electrical insulation characteristics and that does so without sacrificing mechanical strength. The silicone rubber composition comprises:(A) polyorganosiloxane described by average formula R.sub.a SiO.sub.(4-a)/, where R denotes substituted and unsubstituted monovalent hydrocarbon groups and a is a number from 1.95 to 2.05 and having at least 2 silicon-bonded alkenyl groups in each molecule;(B) microparticulate silica;(C) the reaction mixture of(a) a platinum compound and(b) a compound containing a carbon-carbon double bond and a carbon-carbon triple bond;(D) curing agent, and optionally(E) a triazole compound.

Abstract: A method and apparatus for peeling protective adhesive tape 3 from work having the protective adhesive tape 3 applied to a surface of a semiconductor wafer W supported in a ring-shaped frame F by means of a supporting adhesive tape 1. Thin plates 4 with non-adhesive upper surfaces are applied to the supporting adhesive tape 1 adjacent a peel starting end 3a and a peel finishing end 3b of protective adhesive tape 3, respectively, to form regions for avoiding contact between a peeling tape 5 wound around an applying roller 8 and the like and the supporting adhesive tape 1. Subsequently, the peeling tape 5 is applied to the protective adhesive tape 3 at the peel starting end 3a with the applying roller 8, and a group of rollers 6-8 is moved horizontally on the work A to peel the peeling tape 5 and protective adhesive tape 3 together from the surface of semiconductor wafer W.

Abstract: A heat-curable silicone rubber composition whose cure provides silicone rubber with excellent high-voltage electrical insulating properties. The heat-curable silicone rubber composition comprises:(A) polyorganosiloxane gum described by average compositional formulaR.sub.a SiO.sub.(4-a)/2,where R represents substituted and unsubstituted monovalent hydrocarbon groups and a is a number from 1.95 to 2.05 and that contains at least 2 silicon-bonded alkenyl groups in each molecule,(B) microparticulate silica,(C) zinc carbonate powder or basic zinc carbonate powder, and(D) organoperoxide.

Abstract: A liquid silicone rubber composition that prior to its cure has a suitable fluidity and excellent moldability and that cures into a highly flame retardant silicone rubber molding with excellent electrical properties. The liquid silicone rubber composition comprises(A) polyorganosiloxane,(B) microparticulate silica,(C) aluminum hydroxide powder,(D) zinc carbonate powder,(E) polyorganohydrogensiloxane,(F) benzotriazole,(G) the reaction mixture of(a) a platinum compound and(b) 3,5-dimethyl-1-hexyn-3-ol, and(H) hydrosilylation reaction catalyst.

Abstract: A silicone rubber composition having improved mold release properties comprising (A) silicone rubber base compound, (B) organopolysiloxane having no aliphatic unsaturated groups, (C) higher fatty acid or higher fatty acid metal salt, (D) water, and (E) curing agent.