Patents by Inventor Takao Ohno

Takao Ohno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070023011
    Abstract: In a case where fuel injection system abnormality is detected, and fuel supply stop processing is carried out against the abnormality, since a judgment is made using a misfire judgment, in a case where the misfire judgment is carried out in a periodic measurement system, the reliability is low at the time of a periodic variation or in a low rotation region, and in a case where it is carried out in an ion detection system, the cost increases, and the calculation load of an internal combustion engine control apparatus by the misfire judgment processing increases. A control apparatus for a vehicular internal combustion engine of the invention includes an injector drive abnormality judgment unit to judge, based on an injector drive confirmation signal, drive abnormality of an injector corresponding to the injector drive confirmation signal, and the injector drive abnormality judgment unit judges abnormality of the injector drive confirmation signal based on a state of the injector drive confirmation signal.
    Type: Application
    Filed: January 9, 2006
    Publication date: February 1, 2007
    Inventors: Takao Ohno, Akira Furuta
  • Publication number: 20050173678
    Abstract: A surface treatment agent is applied onto a metal film of a printed circuit board to form a rust preventive film. The surface treatment agent for metal comprises an aqueous solution comprising an organic acid having a boiling point of 170° C. or higher and one or more compound selected from the group consisting of an imidazole based compound and a benzimidazole based compound.
    Type: Application
    Filed: January 18, 2005
    Publication date: August 11, 2005
    Applicant: TAMURA KAKEN CORPORATION
    Inventors: Ichiro Miura, Kazutaka Nakanami, Yoshitou Hayashida, Takao Ohno
  • Publication number: 20050167812
    Abstract: A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 4, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Masataka Mizukoshi, Takao Nishimura, Akira Takashima, Mitsuhisa Watanabe
  • Publication number: 20050161793
    Abstract: A semiconductor device includes a semiconductor element having a plurality of electrodes provided on one principal surface thereof and a wiring substrate having a conductive layer on an insulating substrate. The wiring substrate is arranged in a substantially U-shape along an outer edge of the semiconductor element. An end of the conductive layer of the wiring substrate is connected to the electrodes of the semiconductor element. The other end of the conductive layer extends in a direction opposite to the semiconductor element on the other principal surface side of the semiconductor element.
    Type: Application
    Filed: January 26, 2005
    Publication date: July 28, 2005
    Inventors: Takao Ohno, Eiji Yoshida, Hiroshi Misawa
  • Publication number: 20040161598
    Abstract: A polymetaphenylene isophtha lamide-based polymer porous film having a satisfactory porous structure that exhibits excellent gas permeability and heat resistance. It is produced by a process which comprises casting a dope of the polymetaphenylene isophthalamide-based polymer and coagulating it in a coagulating bath. The porous film may also contain inorganic whiskers, and a composite porous film may be formed in combination with a separate thermoplastic polymer film.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 19, 2004
    Applicant: TEIJIN LIMITED
    Inventors: Takao Ohno, Jiro Sadanobu, Tsutomu Nakamura, Susumu Honda, Toyoaki Ishiwata
  • Patent number: 6732911
    Abstract: There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid supplying means for supplying a formic acid into the heating/melting area, an exhausting means for exhausting a gas from the heating/melting area and its neighboring area to create a lower pressure area in the heating/melting area as compared to the pressure of outside the chamber, heating means for heating directly or indirectly the solder-adhered object in the heating/melting area, and an air-stream suppressing means for disturbing a gas flow between the heating/melting area and the carrying areas.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: May 11, 2004
    Assignee: Fujitsu Limited
    Inventors: Hirohisa Matsuki, Hiroyuki Matsui, Eiji Yoshida, Takao Ohno, Koki Otake, Akiyo Mizutani, Motoshu Miyajima, Masataka Mizukoshi, Eiji Watanabe
  • Patent number: 6673654
    Abstract: A semiconductor device is manufactured by an integrated circuit forming process, and a series of subsequent steps. In the series of steps, a protection tape 18 is adhered onto a first surface of a semiconductor substrate on which a plurality of semiconductor elements are formed, and the second surface of the semiconductor substrate is ground so that the semiconductor substrate has a desired thickness, the semiconductor substrate is then conveyed while controlling the temperature of the semiconductor substrate. The semiconductor substrate is then separated into a plurality of semiconductor elements. The occurrence of warping on the semiconductor substrate during conveyance of the semiconductor substrate is thus prevented.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: January 6, 2004
    Assignee: Fujitsu Limited
    Inventors: Takao Ohno, Koichi Meguro, Shigeru Kamada, Keisuke Fukuda, Yuzo Shimobeppu
  • Publication number: 20030077879
    Abstract: A semiconductor device is manufactured by an integrated circuit forming process, and a series of subsequent steps. In the series of steps, a protection tape 18 is adhered onto a first surface of a semiconductor substrate on which a plurality of semiconductor elements are formed, and the second surface of the semiconductor substrate is ground so that the semiconductor substrate has a desired thickness, the semiconductor substrate is then conveyed while controlling the temperature of the semiconductor substrate. The semiconductor substrate is then separated into a plurality of semiconductor elements. The occurrence of warping on the semiconductor substrate during conveyance of the semiconductor substrate is thus prevented.
    Type: Application
    Filed: March 5, 2002
    Publication date: April 24, 2003
    Applicant: Fujitsu Limited
    Inventors: Takao Ohno, Koichi Meguro, Shigeru Kamada, Keisuke Fukuda, Yuzo Shimobeppu
  • Publication number: 20030073264
    Abstract: A silicon wafer has a first surface having a plurality of semiconductor elements and a second surface opposite to the first surface. The second surface of the silicon wafer is partially removed, by grinding or etching, to form a center portion and a peripheral portion having thickness greater than a thickness of the center portion. The silicon wafer is then separated into the plurality of semiconductor elements.
    Type: Application
    Filed: February 6, 2002
    Publication date: April 17, 2003
    Applicant: Fujitsu Limited
    Inventors: Koichi Meguro, Keisuke Fukuda, Yuzo Shimobeppu, Takao Ohno
  • Patent number: 6475701
    Abstract: There is provided an active energy beam curable composition, which is useful for forming a solder resist film for a printed wiring board, which can be developed through an ultraviolet exposure and a dilute alkali aqueous solution, and is excel lent in heat resistance, adhesivity and chemical resistance. There is also proposed a printed wiring board provided with a cured film of such an active energy beam curable composition. This composition is featured in that it comprises not only an active energy beam curable vinyl copolymer modified resin wherein an epoxy compound having an ethylenic unsaturated group is added to a copolymer comprising styrene, (metha)acrylic acid, and, as an optional component, (metha)acrylate; but also an active energy beam curable bisphenol type epoxyacrylate resin.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: November 5, 2002
    Assignee: Tamura Kaken Corporation
    Inventors: Takao Ohno, Ken Ito, Ichiro Miura
  • Publication number: 20020130164
    Abstract: There are provided a chamber having openings which are opened to an outer air and through which a solder-adhered object w is passed and having a heating/melting area and carrying areas arranged adjacent to the heating/melting area, a carrying mechanism for carrying the solder-adhered object w into the heating/melting area, a formic-acid supplying means for supplying a formic acid into the heating/melting area, an exhausting means for exhausting a gas from the heating/melting area and its neighboring area to lower a pressure in the heating/melting area rather than an outer air, heating means for heating directly or indirectly the solder-adhered object w in the heating/melting area, and air-stream suppressing means for disturbing a gas flow between the heating/melting area and the carrying areas.
    Type: Application
    Filed: October 5, 2001
    Publication date: September 19, 2002
    Applicant: Fujitsu Limited
    Inventors: Hirohisa Matsuki, Hiroyuki Matsui, Eiji Yoshida, Takao Ohno, Koki Otake, Akiyo Mizutani, Motoshu Miyajima, Masataka Mizukoshi, Eiji Watanabe
  • Publication number: 20020115739
    Abstract: There is provided an active energy beam curable composition, which is useful for forming a solder resist film for a printed wiring board, which can be developed through an ultraviolet exposure and a dilute alkali aqueous solution, and is excellent in heat resistance, adhesivity and chemical resistance. There is also proposed a printed wiring board provided with a cured film of such an active energy beam curable composition. This composition is featured in that it comprises not only an active energy beam curable vinyl copolymer modified resin wherein an epoxy compound having an ethylenic unsaturated group is added to a copolymer comprising styrene, (metha)acrylic acid, and, as an optional component, (metha)acrylate; but also an active energy beam curable bisphenol type epoxyacrylate resin.
    Type: Application
    Filed: February 12, 2001
    Publication date: August 22, 2002
    Inventors: Takao Ohno, Ken Ito, Ichiro Miura
  • Patent number: 6428644
    Abstract: An apparatus and a process for producing a laminate for electronic parts such as ceramic capacitors. After a predetermined pattern for forming an internal conductive layer is formed on a self-supporting green sheet which contains inorganic powder and an organic binder, the self-supporting green sheet is taken up by a columnar roll and laminated. At this point, the position of the same pattern on the green sheet G2 of the next cycle to be laminated adjacently onto the green sheet G1 of the previous cycle as the above pattern with respect to the predetermined pattern on the green sheet G1 taken up by the columnar roll is determined.
    Type: Grant
    Filed: October 18, 1999
    Date of Patent: August 6, 2002
    Assignee: Teijin Limited
    Inventors: Takao Ohno, Nobuaki Kido, Tsutomu Nakamura, Michio Yoshino, Masatoshi Ozono, Jiro Sadanobu
  • Patent number: 6412757
    Abstract: A shock absorbing apparatus that absorbs a shock produced by an abutment of a traveler on a stop member when the traveler is brought to a stop at a predetermined position includes a leaf spring arranged adjacent the stop member in a substantially face-to-face relationship with a guideway. A free end of the leaf spring abuts slightly with the guideway or with a slight clearance from the guideway. A mid portion of the leaf spring is curved gradually from the guideway. The traveler is provided with a contact portion that passes over the free end of the leaf spring to contact with the curved mid portion before the traveler abuts with the stop member at the predetermined position.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: July 2, 2002
    Assignee: Toyotsu Eng. & Mfg. Co., Ltd.
    Inventors: Takao Ohno, Kazushige Nakano
  • Publication number: 20020056952
    Abstract: A shock absorbing apparatus that absorbs a shock produced by an abutment of a traveler on a stop member when the traveler is brought to a stop at a predetermined position comprises a leaf spring arranged adjacent to the stop member in substantially face-to-face relationship with a guideway. A free end of the leaf spring abuts slightly on the guideway or with a slight clearance against the guideway. A midportion of the leaf spring is curved gradually apart from the guideway. The traveler is provided with a contact portion that passes over the free end of the leaf spring to contact with the curved midportion before the traveler abuts on the stop member at the predetermined position.
    Type: Application
    Filed: February 5, 2001
    Publication date: May 16, 2002
    Applicant: TOYOTSU ENG. &MFG. Co., LTD.
    Inventors: Takao Ohno, Kazushige Nakano
  • Publication number: 20010045244
    Abstract: There is provided a soldering flux for circuit board, which is designed to be employed on an occasion of soldering electronic parts on a circuit board, the soldering flux being free from any organic solvent which may become a cause for contaminating air atmosphere and being capable of providing an excellent insulating property. This soldering flux comprises; a rosin-based modified resin having an acid value of not less than 100, a nondissociative activator formed of a nondissociative halogenide, and an aqueous solvent containing a volatile basic agent. There is also provided a circuit board having a flux film formed from such a soldering flux.
    Type: Application
    Filed: April 23, 2001
    Publication date: November 29, 2001
    Inventors: Shinichi Akaike, Shoichi Saito, Takao Ohno
  • Patent number: 5863355
    Abstract: The invention provides a soldering flux for mounting circuit substrates, which is free from any organic solvent attributable to air pollution and dispenses with any washing step. The soldering flux is obtained by dissolving a rosin modified by an unsaturated organic acid according to the Diels-Alder reaction in an aqueous solvent. A volatile basic agent may further be contained in the flux.
    Type: Grant
    Filed: February 27, 1996
    Date of Patent: January 26, 1999
    Assignee: Tamura Kaken Co., Ltd.
    Inventors: Takao Ohno, Shouichi Saito, Satoshi Shinohara, Kazuyuki Takakuwa
  • Patent number: 5735973
    Abstract: Described herein is a printed circuit board surface protective agent containing compounds as expressed by Formula I. ##STR1## (herein, Y is a linear or a branched alkyl group having 1 to 20 carbon atoms or (2) ##STR2## X is any of halogen atom, amino group, di-lower alkylamino group, hydroxy group, lower alkoxy group, cyano group, formyl group, acetyl group, benzoyl group, carbamoyl group, carboxyl group, lower alkoxycarbonyl group, or nitro group; X' is any of alkyl group, halogen atom, amino group, di-lower alkylamino group, hydroxy group, lower alcoxy group, cyano group, formyl group, acetyl group, benzoyl group, carbamoyl group, carboxyl group, lower alkoxycarbonyl group or nitro group; n is an integral number from 1 to 4, and X may be either identical or different when n is in a range from 2 to 4. m is an integral number in a range from 1 to 10, p is 0 or an integral number in a range from 1 to 4, and X' may be either identical or different when p is in a range from 2 to 4.
    Type: Grant
    Filed: December 20, 1993
    Date of Patent: April 7, 1998
    Assignee: Tamura Kaken Corporation
    Inventors: Yasumichi Sasahara, Takao Ohno, Seiji Shibata
  • Patent number: 5674624
    Abstract: Disclosed is a highly light-transmitting dust protective film composed of at least one member selected from the group consisting of transparent gels of oxides, hydroxides, organic group-containing oxides and organic group-containing hydroxides of polyvalent metals, formed by the sol-gel process.
    Type: Grant
    Filed: December 17, 1993
    Date of Patent: October 7, 1997
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Tetsuya Miyazaki, Mayumi Kawasaki, Takao Ohno
  • Patent number: 5667726
    Abstract: Disclosed is a highly light-transmitting dust protective film composed of at least one member selected from the group consisting of transparent gels of oxides, hydroxides, organic group-containing oxides and organic group-containing hydroxides of polyvalent metals, formed by the sol-gel process.
    Type: Grant
    Filed: January 25, 1994
    Date of Patent: September 16, 1997
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Tetsuya Miyazaki, Mayumi Kawasaki, Takao Ohno