Patents by Inventor Takao Takeshita

Takao Takeshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240414420
    Abstract: An electronic apparatus includes a noise generation source that generates electromagnetic noise and a housing. The housing includes first and second housing components defining an accommodation space R for accommodating the noise generation source. The first housing component includes a first fixing part and at least two ridge parts extending in directions away from the first fixing part. The second housing component includes a second fixing part fixed to the first fixing part, and at least two grooves extending in directions away from the second fixing part and into which the two ridge parts enter. The ridge parts and the grooves each have a protrusion amount and a depth that make the resonance frequency of the housing different from the frequency of the electromagnetic noise.
    Type: Application
    Filed: July 20, 2022
    Publication date: December 12, 2024
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yingchun GUAN, Takao TAKESHITA, Shinkuro FUJINO, Masami SAITO
  • Publication number: 20240276086
    Abstract: A vehicular camera according to an aspect of an embodiment includes a substrate, a housing, and a conductive member. An imaging element is mounted on the substrate on. The housing has a first housing and a second housing made of metal. The housing accommodates the substrate in a space formed by the first housing and the second housing. The conductive member is disposed at a joint portion between the first housing and the second housing, and has conductivity. Any one or both of the first housing and the second housing have an insulating layer on a surface thereof.
    Type: Application
    Filed: April 23, 2024
    Publication date: August 15, 2024
    Inventors: Takao TAKESHITA, Yingchun GUAN, Yoshihiro UENO, Shinkuro FUJINO, Masami FUKUHARA
  • Patent number: 11844174
    Abstract: An electronic board includes: a board including an upper surface ground on an upper surface; at least one first land formed on the upper surface and connected to a first signal line; at least one second land formed on the upper surface and connected to a second signal line; at least one third land disposed on the upper surface between the first land and the second land and connected to the upper surface ground; and at least one fourth land disposed on the upper surface on a side opposite to the third land and connected to the upper surface ground, the first land being interposed between the third land and the fourth land.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: December 12, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shinkuro Fujino, Tomokazu Deki, Hiroyuki Tahara, Takao Takeshita
  • Publication number: 20220322521
    Abstract: An electronic board includes: a board including an upper surface ground on an upper surface; at least one first land formed on the upper surface and connected to a first signal line; at least one second land formed on the upper surface and connected to a second signal line; at least one third land disposed on the upper surface between the first land and the second land and connected to the upper surface ground; and at least one fourth land disposed on the upper surface on a side opposite to the third land and connected to the upper surface ground, the first land being interposed between the third land and the fourth land.
    Type: Application
    Filed: July 21, 2020
    Publication date: October 6, 2022
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Shinkuro FUJINO, Tomokazu DEKI, Hiroyuki TAHARA, Takao TAKESHITA
  • Patent number: 9179053
    Abstract: A solid-state imaging apparatus in which heat dissipation and electromagnetic shielding can be efficiently performed is provided. The solid-state imaging apparatus includes: an MCM board 41 on which a sensor 42, and a SiP 44 that processes an output signal from the sensor 42 are mounted; a power supply board 61 on which a power supply IC 62 is mounted; and a shielding section 50 which is placed between the MCM board 41 and the power supply board 61 to cover the power supply IC 62, and which has an electrically conductive property and a thermally conductive property.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: November 3, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takao Takeshita, Hiroo Uchiyama
  • Publication number: 20100321555
    Abstract: A solid state imaging device includes: a substrate having an opening portion; a solid state imaging element mounted to the substrate through a flip-chip process; and a resin mold portion formed on a rear surface of the solid state imaging element. The resin mold portion has a surface of an uneven shape.
    Type: Application
    Filed: February 4, 2009
    Publication date: December 23, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Takao Takeshita, Yasushi Nakagiri