Patents by Inventor Takashi Akiguchi

Takashi Akiguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7090482
    Abstract: A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplastic resin portion that covers a portion other than the end surface of each bump of the semiconductor device. The thermoplastic resin portion obtained after the hot pressing is cut.
    Type: Grant
    Filed: December 17, 2003
    Date of Patent: August 15, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Norihito Tsukahara, Takashi Akiguchi, Hidenori Miyakawa
  • Patent number: 6780668
    Abstract: A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplastic resin portion that covers a portion other than the end surface of each bump of the semiconductor device. The thermoplastic resin portion obtained after the hot pressing is out.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: August 24, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Norihito Tsukahara, Takashi Akiguchi, Hidenori Miyakawa
  • Publication number: 20040130024
    Abstract: A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplastic resin portion that covers a portion other than the end surface of each bump of the semiconductor device. The thermoplastic resin portion obtained after the hot pressing is cut.
    Type: Application
    Filed: December 17, 2003
    Publication date: July 8, 2004
    Inventors: Norihito Tsukahara, Takashi Akiguchi, Hidenori Miyakawa
  • Publication number: 20040078965
    Abstract: A package is formed by covering a circuit board with a thermoplastics film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.
    Type: Application
    Filed: October 16, 2003
    Publication date: April 29, 2004
    Inventors: Hidenori Miyakawa, Yoshio Maruyama, Hiroshi Yamauchi, Mikiya Nakata, Takashi Akiguchi, Yoshinori Wada, Kazuhiro Mori
  • Patent number: 6708401
    Abstract: A package is formed by covering a circuit board with a thermoplastice film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: March 23, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hidenori Miyakawa, Yoshio Maruyama, Hiroshi Yamauchi, Mikiya Nakata, Takashi Akiguchi, Yoshinori Wada, Kazuhiro Mori
  • Publication number: 20020036898
    Abstract: A cylindrical or sheet-like thermoplastic film is decompressed and used to cover a board to protect the board and components.
    Type: Application
    Filed: March 28, 2001
    Publication date: March 28, 2002
    Inventors: Hidenori Miyakawa, Yoshio Maruyama, Hiroshi Yamauchi, Mikiya Nakata, Takashi Akiguchi, Yoshinori Wada, Kazuhiro Mori
  • Patent number: 6357106
    Abstract: A method for mounting parts, and an IC card and its manufacturing method. The method reduces the number of steps, increases productivity, lowers costs, and miniaturizes the chip. A first electrode of the IC chip for processing signals received from a coil is connected to an internal end of a coil pattern formed on a first substrate, and an external end of the coil pattern and a second electrode of the IC chip are connected via a jumper wire.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: March 19, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitsumasa Oku, Takashi Akiguchi, Shinji Murakami, Yutaka Harada, Norihito Tsukahara, Mitsunori Yokomakura, Kenichi Sato
  • Publication number: 20020026703
    Abstract: The present invention provides a method for mounting parts, and an IC card and its manufacturing method, capable of reducing the number of steps, increasing productivity, reducing in costs, and miniaturizing the chip. For this purpose, in the present invention, a first electrode (7a) of the IC chip (4) for processing signals received from a coil (3) is connected to an internal end (3b) of a coil pattern (2) formed on a first substrate (1a), and an external end (3a) of the coil pattern (2) and a second electrode (7b) of the IC chip (4) are connected via a jumper wiring means (8).
    Type: Application
    Filed: October 26, 2001
    Publication date: March 7, 2002
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Mitsumasa Oku, Takashi Akiguchi, Shinji Murakami, Yutaka Harada, Norihito Tsukahara, Mitsunori Yokomakura, Kenichi Sato
  • Patent number: 6086441
    Abstract: A method is disclosed for connecting electrodes of a plasma display panel. The method includes overlapping a thick film electrode formed on a glass substrate with an electrode of a flexible substrate via an adhesive sheet having conductive particles dispersed therein, then, heating and pressuring from above the flexible substrate with a pressuring tool, to thereby set the adhesive sheet, and finally electrically connecting the electrode of the glass substrate and the electrode of the flexible substrate with each other.
    Type: Grant
    Filed: April 29, 1998
    Date of Patent: July 11, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Akiguchi, Kazuto Nishida
  • Patent number: 5744382
    Abstract: An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the water, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. Such component is packed in a package including a carrier tape having therethrough a space for receiving the component with one end of such space open. A cover is applied to close the open end of the space after the component is inserted therein.
    Type: Grant
    Filed: August 27, 1996
    Date of Patent: April 28, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshifumi Kitayama, Kazuhiro Mori, Keiji Saeki, Takashi Akiguchi
  • Patent number: 5646439
    Abstract: An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the wafer, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. A package for packing the component includes a carrier tape having therethrough a space for receiving the component with one end or side of the space opened, and a cover tape for closing the open end of the space after the component is stored in the space. A method for packing the component includes the steps of storing the component in the space of the carrier tape with one end of the space opened, and closing the open end of the space with the cover tape.
    Type: Grant
    Filed: August 27, 1996
    Date of Patent: July 8, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshifumi Kitayama, Kazuhiro Mori, Keiji Saeki, Takashi Akiguchi
  • Patent number: 5427642
    Abstract: An adhesive composition for use in the mounting of electronic parts on a printed circuit board is disclosed. The composition comprises a photosetting and thermosetting resin ingredient and a long-chain saturated fatty acid amide. Also disclosed is a method for mounting electronic parts on a printed circuit board by the use of such an adhesive composition.
    Type: Grant
    Filed: October 8, 1991
    Date of Patent: June 27, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Akiguchi, Yukio Maeda
  • Patent number: 5137936
    Abstract: An adhesive composition comprising 10 to 60 parts by weight per 100 parts of the total weight of components (1) to (4) of a monofunctional (meth)acrylic monomer, 0.01 to 10 parts by weight per 100 parts of the total weight of components (1) to (4) of a compound having at least two (meth)acryloyl groups in a molecule, 30 to 80 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a heat resistant epoxy resin, 0.1 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of an imidazole compound, 0.001 to 10 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a photopolymerization initiator, and 0.01 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a thixotropic agent, with which an electronic part can be effectively packaged to a printed board.
    Type: Grant
    Filed: July 26, 1990
    Date of Patent: August 11, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Akiguchi, Yukio Maeda, Daisuke Irii