Patents by Inventor Takashi Asakawa
Takashi Asakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220291035Abstract: An aggregation method includes: acquiring log information including a measurement value of a force used by a processing apparatus and a measurement date and time, the measurement value being measured by a sensor of the processing apparatus that processes a substrate; storing the measurement value of the force and the measurement date and time included in the acquired log information in a storage unit; and integrating the measurement value of the force associated with the measurement date and time in a specified aggregation period with reference to the storage unit to calculate an integrated value of the force for each processing apparatus.Type: ApplicationFiled: March 11, 2022Publication date: September 15, 2022Inventors: Takashi ASAKAWA, Satoshi TANAKA, Ryota AOI
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Patent number: 11382212Abstract: An input device includes a support base, a sensor unit including electrode portions, an extended portion extending outward from the support base, a lead-out wire in conduction with the electrode portions, a grounding wire adjacent to the lead-out wire, the lead-out wire and the grounding wire being along a first major surface of the extended portion, and a reinforcement plate on a part of a second major surface opposite to the first major surface and on the side of the support base from the tip. When viewed from a normal direction of the second major surface, the grounding wire is greater than the lead-out wire, an end-portion projection line formed by a support-base-side end portion of the reinforcement plate is nonlinear, and a most-protruding location in the end-portion projection line closest to the support base overlaps the grounding wire.Type: GrantFiled: April 17, 2020Date of Patent: July 5, 2022Assignee: ALPS ALPINE CO., LTD.Inventors: Hideto Sasagawa, Takashi Asakawa
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Patent number: 11367642Abstract: A substrate processing apparatus includes: a carrier storage rack configured to place and store a carrier that accommodates a substrate; a gas supply configured to supply an inert gas into the carrier placed on the carrier storage rack; and a controller configured to control whether to supply the inert gas into the carrier based on at least one of carrier information and substrate information.Type: GrantFiled: August 23, 2019Date of Patent: June 21, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Moriyoshi Kinoshita, Yuji Sasaki, Junichi Sato, Takashi Asakawa
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Patent number: 11188182Abstract: An input device has a film sensor and a cover member having a convex surface. The film sensor includes: a support substrate that has a film-like main body and an extending portion extending from an end of the main body toward the outside; a plurality of electrode portions provided on a surface of the main body; and lead patterns that extend from the main body to the extending portion and are electrically continuous to the plurality of electrodes. A surface of the main body, the surface being on the same side as the plurality of electrode portions, is attached to the convex surface through an adhesive layer. An end adhesive area, in the adhesive layer, positioned on the same side as the extending portion, has lower adhesiveness than a central adhesive area, in the adhesive layer, positioned on the same side as the central portion of the convex surface.Type: GrantFiled: July 10, 2020Date of Patent: November 30, 2021Assignee: Alps Alpine Co., Ltd.Inventors: Hideto Sasagawa, Takashi Asakawa
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Publication number: 20200348797Abstract: An input device has a film sensor and a cover member having a convex surface. The film sensor includes: a support substrate that has a film-like main body and an extending portion extending from an end of the main body toward the outside; a plurality of electrode portions provided on a surface of the main body; and lead patterns that extend from the main body to the extending portion and are electrically continuous to the plurality of electrodes. A surface of the main body, the surface being on the same side as the plurality of electrode portions, is attached to the convex surface through an adhesive layer. An end adhesive area, in the adhesive layer, positioned on the same side as the extending portion, has lower adhesiveness than a central adhesive area, in the adhesive layer, positioned on the same side as the central portion of the convex surface.Type: ApplicationFiled: July 10, 2020Publication date: November 5, 2020Inventors: Hideto SASAGAWA, Takashi ASAKAWA
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Patent number: 10809859Abstract: A capacitive sensor includes: a resinous panel that has a translucent property, a main surface of the panel being a manipulation surface; a sensor substrate placed so as to face another main surface of the panel, the other main surface being opposite to the manipulation surface of the panel, the sensor substrate having a glass base material and a transparent electrode provided on at least one main surface of the base material; an intermediate layer that has a translucent property, the intermediate layer being disposed between the panel and the sensor substrate; a first adhesive layer disposed between the panel and the intermediate layer, the first adhesive layer bonding the panel and the intermediate layer together; and a second adhesive layer disposed between the sensor substrate and the intermediate layer, the second adhesive layer bonding the sensor substrate and the intermediate layer together.Type: GrantFiled: September 12, 2018Date of Patent: October 20, 2020Assignee: Alps Alpine Co., Ltd.Inventors: Hideto Sasagawa, Takashi Asakawa, Takefumi Osaka, Yutaka Takashima
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Publication number: 20200245454Abstract: An input device includes a support base, a sensor unit including electrode portions, an extended portion extending outward from the support base, a lead-out wire in conduction with the electrode portions, a grounding wire adjacent to the lead-out wire, the lead-out wire and the grounding wire being along a first major surface of the extended portion, and a reinforcement plate on a part of a second major surface opposite to the first major surface and on the side of the support base from the tip. When viewed from a normal direction of the second major surface, the grounding wire is greater than the lead-out wire, an end-portion projection line formed by a support-base-side end portion of the reinforcement plate is nonlinear, and a most-protruding location in the end-portion projection line closest to the support base overlaps the grounding wire.Type: ApplicationFiled: April 17, 2020Publication date: July 30, 2020Inventors: Hideto SASAGAWA, Takashi ASAKAWA
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Publication number: 20200083078Abstract: A substrate processing apparatus includes: a carrier storage rack configured to place and store a carrier that accommodates a substrate; a gas supply configured to supply an inert gas into the carrier placed on the carrier storage rack; and a controller configured to control whether to supply the inert gas into the carrier based on at least one of carrier information and substrate information.Type: ApplicationFiled: August 23, 2019Publication date: March 12, 2020Inventors: Moriyoshi Kinoshita, Yuji Sasaki, Junichi Sato, Takashi Asakawa
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Publication number: 20200079053Abstract: A touch panel is configured such that a plastic cover and a film sensor are laminated so that the resin flowing direction of the plastic cover and the resin flowing direction of the film sensor are not parallel to each other in plan view in the laminating direction. The touch panel is prevented from being degraded in design and becoming nonuniform in sensitivity because of the occurrence of warping, thereby maintaining its appearance and function well under a high-temperature environment.Type: ApplicationFiled: November 13, 2019Publication date: March 12, 2020Inventors: Hideto SASAGAWA, Takashi ASAKAWA, Takefumi OSAKA, Yutaka TAKASHIMA
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Publication number: 20190025961Abstract: A capacitive sensor includes: a resinous panel that has a translucent property, a main surface of the panel being a manipulation surface; a sensor substrate placed so as to face another main surface of the panel, the other main surface being opposite to the manipulation surface of the panel, the sensor substrate having a glass base material and a transparent electrode provided on at least one main surface of the base material; an intermediate layer that has a translucent property, the intermediate layer being disposed between the panel and the sensor substrate; a first adhesive layer disposed between the panel and the intermediate layer, the first adhesive layer bonding the panel and the intermediate layer together; and a second adhesive layer disposed between the sensor substrate and the intermediate layer, the second adhesive layer bonding the sensor substrate and the intermediate layer together.Type: ApplicationFiled: September 12, 2018Publication date: January 24, 2019Inventors: Hideto SASAGAWA, Takashi ASAKAWA, Takefumi OSAKA, Yutaka TAKASHIMA
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Patent number: 8457788Abstract: In a substrate processing apparatus, before a carrier is carried by a carrier arm, a carrier jig is held by a holding part provided to the carrier arm. First, the carrier arm is actuated to move the holding part of the carrier arm to a preset lowering start position. Then, an image including an opening in a table is taken. Thereafter, a distance between a central position of the opening and a central position of a region of the image is calculated, so as to obtain an amount of horizontal positional shift between the preset lowering start position and an ideal position. The lowering start position of the holding part is corrected by the positional shift as a correction value, whereafter the carrier is placed on the table at the corrected lowering start position.Type: GrantFiled: June 19, 2012Date of Patent: June 4, 2013Assignee: Tokyo Electron LimitedInventors: Takashi Asakawa, Haruoki Nakamura, Masayuki Enomoto
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Patent number: 8366286Abstract: A lower surface and an upper surface are provided in a detection panel 2. Lower electrode layers 11a and 11b, a lower wiring pattern 15, and a lower land portion 13 formed on the lower surface are covered with upper shielding layers 28a and 28c of the upper surface, and an upper electrode layer 21, an upper wiring pattern 25, and an upper land portion 23 formed in the upper surface are covered with lower shielding layers 19a and 19b of the lower surface. Therefore, an effect of a decorative area shielding light may be enhanced, and thus an electrical shielding effect may further be exhibited.Type: GrantFiled: March 13, 2012Date of Patent: February 5, 2013Assignee: Alps Electric Co., Ltd.Inventors: Kiyoshi Kobayashi, Takashi Asakawa, Shinichi Higuchi
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Publication number: 20120316678Abstract: In a substrate processing apparatus, before a carrier is carried by a carrier arm, a carrier jig is held by a holding part provided to the carrier arm. First, the carrier arm is actuated to move the holding part of the carrier arm to a preset lowering start position. Then, an image including an opening in a table is taken. Thereafter, a distance between a central position of the opening and a central position of a region of the image is calculated, so as to obtain an amount of horizontal positional shift between the preset lowering start position and an ideal position. The lowering start position of the holding part is corrected by the positional shift as a correction value, whereafter the carrier is placed on the table at the corrected lowering start position.Type: ApplicationFiled: June 19, 2012Publication date: December 13, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Takashi ASAKAWA, Haruoki Nakamura, Masayuki Enomoto
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Patent number: 8255082Abstract: The present invention is intended to achieve more accurate and facilitated positioning of a carrier onto a table, in a substrate processing apparatus configured for placing the carrier storing multiple sheets of wafers therein, on the table, by using a carrier arm. Before the carrier is actually carried by the carrier arm, a carrier jig having the same shape as the carrier is held by a holding part provided to the carrier arm. The carrier jig is provided with a camera, such that a central position of a region of an image taken by the camera will be coincident with a central position of an opening formed in the table, if the carrier jig is accurately located in an ideal position above the table. First, the carrier arm is actuated to move the holding part of the carrier arm to a preset lowering start position. Then, the image of the region including the opening is taken by the camera.Type: GrantFiled: February 20, 2009Date of Patent: August 28, 2012Assignee: Tokyo Electron LimitedInventors: Takashi Asakawa, Haruoki Nakamura, Masayuki Enomoto
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Publication number: 20120170283Abstract: A lower surface and an upper surface are provided in a detection panel 2. Lower electrode layers 11a and 11b, a lower wiring pattern 15, and a lower land portion 13 formed on the lower surface are covered with upper shielding layers 28a and 28c of the upper surface, and an upper electrode layer 21, an upper wiring pattern 25, and an upper land portion 23 formed in the upper surface are covered with lower shielding layers 19a and 19b of the lower surface. Therefore, an effect of a decorative area shielding light may be enhanced, and thus an electrical shielding effect may further be exhibited.Type: ApplicationFiled: March 13, 2012Publication date: July 5, 2012Applicant: ALPS ELECTRIC CO., LTD.Inventors: Kiyoshi KOBAYASHI, Takashi ASAKAWA, Shinichi HIGUCHI
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Publication number: 20090222135Abstract: The present invention is intended to achieve more accurate and facilitated positioning of a carrier onto a table, in a substrate processing apparatus configured for placing the carrier storing multiple sheets of wafers therein, on the table, by using a carrier arm. Before the carrier is actually carried by the carrier arm, a carrier jig having the same shape as the carrier is held by a holding part provided to the carrier arm. The carrier jig is provided with a camera, such that a central position of a region of an image taken by the camera will be coincident with a central position of an opening formed in the table, if the carrier jig is accurately located in an ideal position above the table. First, the carrier arm is actuated to move the holding part of the carrier arm to a preset lowering start position. Then, the image of the region including the opening is taken by the camera.Type: ApplicationFiled: February 20, 2009Publication date: September 3, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Takashi Asakawa, Haruoki Nakamura, Masayuki Enomoto
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Publication number: 20080103727Abstract: There is provided an invention to implement a multichannel analyzer capable of executing high-precision measurement in short measurement time. The invention is an improvement of a multichannel analyzer for receiving pulse signals having respective peak values corresponding to radiation energy, and generating a histogram by selecting the respective peak values of the pulse signals on the basis of a lower limit value, and an upper limit value. The multichannel analyzer is characterized in comprising a conversion means for converting a voltage level of the pulse signal into a digital data block expressed in the same unit as that for the peak value at a predetermined sampling rate, a peak detector for detecting the peak value out of the digital data blocks of the conversion means, and a histogram analyzer for finding the number of occurrence times for each of the peak values, as selected after detection by the peak detector.Type: ApplicationFiled: October 29, 2007Publication date: May 1, 2008Applicant: YOKOGAWA ELECTRIC CORPORATIONInventors: Koji Ota, Hiroshi Yagyu, Takashi Asakawa, Ken-ichi Hironaga, Hideyuki Fujii
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Patent number: 5772833Abstract: The present invention relates to a plasma etching method and a plasma etching apparatus, and more particularly to a plasma etching method and a plasma etching apparatus in which the selection ration is enhanced by improving trench side-wall protecting effect.Type: GrantFiled: November 17, 1994Date of Patent: June 30, 1998Assignee: Tokyo Electron LimitedInventors: Koichiro Inazawa, Yoshio Ishikawa, Takashi Asakawa, Masato Hiratsuka, Nobuyuki Okayama
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Patent number: 5665946Abstract: A combined-operation type switching apparatus which is downsized and exhibits excellent operability. An operation unit is rotatably and slidably held by a housing. An operation ring is also rotatably held by the housing. The operation ring is rotated together with the operation unit only when the operation unit is pressed. A drive unit is movably supported by a shaft of the operation unit via a spring. A push switch (swell) actuated by pressing the drive unit and rotation detecting switches (projections) actuated by rotating a drive rod of the operation ring are placed inside the housing. A first pair of rotation detecting switches is actuated by rotation of the operation unit when the operation unit is not pressed. The push switch and a second pair of rotation detection switches are actuated by pressing the operation unit such that the operation unit slides along its axis toward the push switch, and then rotating the operation unit.Type: GrantFiled: October 5, 1995Date of Patent: September 9, 1997Assignees: Alps Electric Co., Ltd., Sony CorporationInventors: Akio Nishijima, Takashi Asakawa, Shuichi Matsumoto